Energy Cooperation in Energy Harvesting Communication Systems

In energy harvesting communications, users transmit messages using energy harvested from nature. In such systems, transmission policies of the users need to be carefully designed according to the energy arrival profiles. When the energy management policies are optimized, the resulting performance of the system depends only on the energy arrival profiles. In this dissertation, we introduce and analyze the notion of energy cooperation in energy harvesting communications where users can share a portion of their harvested energy with the other users via wireless energy transfer. This energy cooperation enables us to control and optimize the energy arrivals at users to the extent possible. In the classical setting of cooperation, users help each other in the transmission of their data by exploiting the broadcast nature of wireless communications and the resulting overheard information. In contrast to the usual notion of cooperation, which is at the signal level, energy cooperation we introduce here is at the battery energy level. In a multi-user setting, energy may be abundant in one user in which case the loss incurred by transferring it to another user may be less than the gain it yields for the other user. It is this cooperation that we explore in this dissertation for several multi-user scenarios, where energy can be transferred from one user to another through a separate wireless energy transfer unit. We first consider the offline optimal energy management problem for several basic multi-user network structures with energy harvesting transmitters and one-way wireless energy transfer. In energy harvesting transmitters, energy arrivals in time impose energy causality constraints on the transmission policies of the users. In the presence of wireless energy transfer, energy causality constraints take a new form: energy can flow in time from the past to the future for each user, and from one user to the other at each time. This requires a careful joint management of energy flow in two separate dimensions, and different management policies are required depending on how users share the common wireless medium and interact over it. In this context, we analyze several basic multi-user energy harvesting network structures with wireless energy transfer. To capture the main trade-offs and insights that arise due to wireless energy transfer, we focus our attention on simple two- and three-user communication systems, such as the relay channel, multiple access channel and the two-way channel. Next, we focus on the delay minimization problem for networks. We consider a general network topology of energy harvesting and energy cooperating nodes. Each node harvests energy from nature and all nodes may share a portion of their harvested energies with neighboring nodes through energy cooperation. We consider the joint data routing and capacity assignment problem for this setting under fixed data and energy routing topologies. We determine the joint routing of energy and data in a general multi-user scenario with data and energy transfer. Next, we consider the cooperative energy harvesting diamond channel, where the source and two relays harvest energy from nature and the physical layer is modeled as a concatenation of a broadcast and a multiple access channel. Since the broadcast channel is degraded, one of the relays has the message of the other relay. Therefore, the multiple access channel is an extended multiple access channel with common data. We determine the optimum power and rate allocation policies of the users in order to maximize the end-to-end throughput of this system. Finally, we consider the two-user cooperative multiple access channel with energy harvesting users. The users cooperate at the physical layer (data cooperation) by establishing common messages through overheard signals and then cooperatively sending them. For this channel model, we investigate the effect of intermittent data arrivals to the users. We find the optimal offline transmit power and rate allocation policy that maximize the departure region. When the users can further cooperate at the battery level (energy cooperation), we find the jointly optimal offline transmit power and rate allocation policy together with the energy transfer policy that maximize the departure region.

Time-Reversal Massive Multipath Effect and Bandwidth Heterogeneity

The proliferation of new mobile communication devices, such as smartphones and tablets, has led to an exponential growth in network traffic. The demand for supporting the fast-growing consumer data rates urges the wireless service providers and researchers to seek a new efficient radio access technology, which is the so-called 5G technology, beyond what current 4G LTE can provide. On the other hand, ubiquitous RFID tags, sensors, actuators, mobile phones and etc. cut across many areas of modern-day living, which offers the ability to measure, infer and understand the environmental indicators. The proliferation of these devices creates the term of the Internet of Things (IoT). For the researchers and engineers in the field of wireless communication, the exploration of new effective techniques to support 5G communication and the IoT becomes an urgent task, which not only leads to fruitful research but also enhance the quality of our everyday life. Massive MIMO, which has shown the great potential in improving the achievable rate with a very large number of antennas, has become a popular candidate. However, the requirement of deploying a large number of antennas at the base station may not be feasible in indoor scenarios. Does there exist a good alternative that can achieve similar system performance to massive MIMO for indoor environment? In this dissertation, we address this question by proposing the time-reversal technique as a counterpart of massive MIMO in indoor scenario with the massive multipath effect. It is well known that radio signals will experience many multipaths due to the reflection from various scatters, especially in indoor environments. The traditional TR waveform is able to create a focusing effect at the intended receiver with very low transmitter complexity in a severe multipath channel. TR's focusing effect is in essence a spatial-temporal resonance effect that brings all the multipaths to arrive at a particular location at a specific moment. We show that by using time-reversal signal processing, with a sufficiently large bandwidth, one can harvest the massive multipaths naturally existing in a rich-scattering environment to form a large number of virtual antennas and achieve the desired massive multipath effect with a single antenna. Further, we explore the optimal bandwidth for TR system to achieve maximal spectral efficiency. Through evaluating the spectral efficiency, the optimal bandwidth for TR system is found determined by the system parameters, e.g., the number of users and backoff factor, instead of the waveform types. Moreover, we investigate the tradeoff between complexity and performance through establishing a generalized relationship between the system performance and waveform quantization in a practical communication system. It is shown that a 4-bit quantized waveforms can be used to achieve the similar bit-error-rate compared to the TR system with perfect precision waveforms. Besides 5G technology, Internet of Things (IoT) is another terminology that recently attracts more and more attention from both academia and industry. In the second part of this dissertation, the heterogeneity issue within the IoT is explored. One of the significant heterogeneity considering the massive amount of devices in the IoT is the device heterogeneity, i.e., the heterogeneous bandwidths and associated radio-frequency (RF) components. The traditional middleware techniques result in the fragmentation of the whole network, hampering the objects interoperability and slowing down the development of a unified reference model for the IoT. We propose a novel TR-based heterogeneous system, which can address the bandwidth heterogeneity and maintain the benefit of TR at the same time. The increase of complexity in the proposed system lies in the digital processing at the access point (AP), instead of at the devices' ends, which can be easily handled with more powerful digital signal processor (DSP). Meanwhile, the complexity of the terminal devices stays low and therefore satisfies the low-complexity and scalability requirement of the IoT. Since there is no middleware in the proposed scheme and the additional physical layer complexity concentrates on the AP side, the proposed heterogeneous TR system better satisfies the low-complexity and energy-efficiency requirement for the terminal devices (TDs) compared with the middleware approach.

High Precision Plasma Etch for Pattern Transfer: Towards Fluorocarbon Based Atomic Layer Etching

A basic requirement of a plasma etching process is fidelity of the patterned organic materials. In photolithography, a He plasma pretreatment (PPT) based on high ultraviolet and vacuum ultraviolet (UV/VUV) exposure was shown to be successful for roughness reduction of 193nm photoresist (PR). Typical multilayer masks consist of many other organic masking materials in addition to 193nm PR. These materials vary significantly in UV/VUV sensitivity and show, therefore, a different response to the He PPT. A delamination of the nanometer-thin, ion-induced dense amorphous carbon (DAC) layer was observed. Extensive He PPT exposure produces volatile species through UV/VUV induced scissioning. These species are trapped underneath the DAC layer in a subsequent plasma etch (PE), causing a loss of adhesion. Next to stabilizing organic materials, the major goals of this work included to establish and evaluate a cyclic fluorocarbon (FC) based approach for atomic layer etching (ALE) of SiO2 and Si; to characterize the mechanisms involved; and to evaluate the impact of processing parameters. Periodic, short precursor injections allow precise deposition of thin FC films. These films limit the amount of available chemical etchant during subsequent low energy, plasma-based Ar+ ion bombardment, resulting in strongly time-dependent etch rates. In situ ellipsometry showcased the self-limited etching. X-ray photoelectron spectroscopy (XPS) confirms FC film deposition and mixing with the substrate. The cyclic ALE approach is also able to precisely etch Si substrates. A reduced time-dependent etching is seen for Si, likely based on a lower physical sputtering energy threshold. A fluorinated, oxidized surface layer is present during ALE of Si and greatly influences the etch behavior. A reaction of the precursor with the fluorinated substrate upon precursor injection was observed and characterized. The cyclic ALE approach is transferred to a manufacturing scale reactor at IBM Research. Ensuring the transferability to industrial device patterning is crucial for the application of ALE. In addition to device patterning, the cyclic ALE process is employed for oxide removal from Si and SiGe surfaces with the goal of minimal substrate damage and surface residues. The ALE process developed for SiO2 and Si etching did not remove native oxide at the level required. Optimizing the process enabled strong O removal from the surface. Subsequent 90% H2/Ar plasma allow for removal of C and F residues.

Architectural-Physical Co-Design of 3D CPUs with Micro-Fluidic Cooling

The performance, energy efficiency and cost improvements due to traditional technology scaling have begun to slow down and present diminishing returns. Underlying reasons for this trend include fundamental physical limits of transistor scaling, the growing significance of quantum effects as transistors shrink, and a growing mismatch between transistors and interconnects regarding size, speed and power. Continued Moore's Law scaling will not come from technology scaling alone, and must involve improvements to design tools and development of new disruptive technologies such as 3D integration. 3D integration presents potential improvements to interconnect power and delay by translating the routing problem into a third dimension, and facilitates transistor density scaling independent of technology node. Furthermore, 3D IC technology opens up a new architectural design space of heterogeneously-integrated high-bandwidth CPUs. Vertical integration promises to provide the CPU architectures of the future by integrating high performance processors with on-chip high-bandwidth memory systems and highly connected network-on-chip structures. Such techniques can overcome the well-known CPU performance bottlenecks referred to as memory and communication wall. However the promising improvements to performance and energy efficiency offered by 3D CPUs does not come without cost, both in the financial investments to develop the technology, and the increased complexity of design. Two main limitations to 3D IC technology have been heat removal and TSV reliability. Transistor stacking creates increases in power density, current density and thermal resistance in air cooled packages. Furthermore the technology introduces vertical through silicon vias (TSVs) that create new points of failure in the chip and require development of new BEOL technologies. Although these issues can be controlled to some extent using thermal-reliability aware physical and architectural 3D design techniques, high performance embedded cooling schemes, such as micro-fluidic (MF) cooling, are fundamentally necessary to unlock the true potential of 3D ICs. A new paradigm is being put forth which integrates the computational, electrical, physical, thermal and reliability views of a system. The unification of these diverse aspects of integrated circuits is called Co-Design. Independent design and optimization of each aspect leads to sub-optimal designs due to a lack of understanding of cross-domain interactions and their impacts on the feasibility region of the architectural design space. Co-Design enables optimization across layers with a multi-domain view and thus unlocks new high-performance and energy efficient configurations. Although the co-design paradigm is becoming increasingly necessary in all fields of IC design, it is even more critical in 3D ICs where, as we show, the inter-layer coupling and higher degree of connectivity between components exacerbates the interdependence between architectural parameters, physical design parameters and the multitude of metrics of interest to the designer (i.e. power, performance, temperature and reliability). In this dissertation we present a framework for multi-domain co-simulation and co-optimization of 3D CPU architectures with both air and MF cooling solutions. Finally we propose an approach for design space exploration and modeling within the new Co-Design paradigm, and discuss the possible avenues for improvement of this work in the future.