Characterization of Non-linear Polymer Properties to Predict Process Induced Warpage and Residual Stress of Electronic Packages

Nonlinear thermo-mechanical properties of advanced polymers are crucial to accurate prediction of the process induced warpage and residual stress of electronics packages. The Fiber Bragg grating (FBG) sensor based method is advanced and implemented to determine temperature and time dependent nonlinear properties. The FBG sensor is embedded in the center of the cylindrical specimen, which deforms together with the specimen. The strains of the specimen at different loading conditions are monitored by the FBG sensor. Two main sources of the warpage are considered: curing induced warpage and coefficient of thermal expansion (CTE) mismatch induced warpage. The effective chemical shrinkage and the equilibrium modulus are needed for the curing induced warpage prediction. Considering various polymeric materials used in microelectronic packages, unique curing setups and procedures are developed for elastomers (extremely low modulus, medium viscosity, room temperature curing), underfill materials (medium modulus, low viscosity, high temperature curing), and epoxy molding compound (EMC: high modulus, high viscosity, high temperature pressure curing), most notably, (1) zero-constraint mold for elastomers; (2) a two-stage curing procedure for underfill materials and (3) an air-cylinder based novel setup for EMC. For the CTE mismatch induced warpage, the temperature dependent CTE and the comprehensive viscoelastic properties are measured. The cured cylindrical specimen with a FBG sensor embedded in the center is further used for viscoelastic property measurements. A uni-axial compressive loading is applied to the specimen to measure the time dependent Young’s modulus. The test is repeated from room temperature to the reflow temperature to capture the time-temperature dependent Young’s modulus. A separate high pressure system is developed for the bulk modulus measurement. The time temperature dependent bulk modulus is measured at the same temperatures as the Young’s modulus. The master curve of the Young’s modulus and bulk modulus of the EMC is created and a single set of the shift factors is determined from the time temperature superposition. The supplementary experiments are conducted to verify the validity of the assumptions associated with the linear viscoelasticity. The measured time-temperature dependent properties are further verified by a shadow moiré and Twyman/Green test.

Automated Software Debugging Using Hybrid Static/Dynamic Analysis

With the increasing complexity of today's software, the software development process is becoming highly time and resource consuming. The increasing number of software configurations, input parameters, usage scenarios, supporting platforms, external dependencies, and versions plays an important role in expanding the costs of maintaining and repairing unforeseeable software faults. To repair software faults, developers spend considerable time in identifying the scenarios leading to those faults and root-causing the problems. While software debugging remains largely manual, it is not the case with software testing and verification. The goal of this research is to improve the software development process in general, and software debugging process in particular, by devising techniques and methods for automated software debugging, which leverage the advances in automatic test case generation and replay. In this research, novel algorithms are devised to discover faulty execution paths in programs by utilizing already existing software test cases, which can be either automatically or manually generated. The execution traces, or alternatively, the sequence covers of the failing test cases are extracted. Afterwards, commonalities between these test case sequence covers are extracted, processed, analyzed, and then presented to the developers in the form of subsequences that may be causing the fault. The hypothesis is that code sequences that are shared between a number of faulty test cases for the same reason resemble the faulty execution path, and hence, the search space for the faulty execution path can be narrowed down by using a large number of test cases. To achieve this goal, an efficient algorithm is implemented for finding common subsequences among a set of code sequence covers. Optimization techniques are devised to generate shorter and more logical sequence covers, and to select subsequences with high likelihood of containing the root cause among the set of all possible common subsequences. A hybrid static/dynamic analysis approach is designed to trace back the common subsequences from the end to the root cause. A debugging tool is created to enable developers to use the approach, and integrate it with an existing Integrated Development Environment. The tool is also integrated with the environment's program editors so that developers can benefit from both the tool suggestions, and their source code counterparts. Finally, a comparison between the developed approach and the state-of-the-art techniques shows that developers need only to inspect a small number of lines in order to find the root cause of the fault. Furthermore, experimental evaluation shows that the algorithm optimizations lead to better results in terms of both the algorithm running time and the output subsequence length.