Creating Common Ground: Architecture For Tactical Learning and Creative Convergence

Certain environments can inhibit learning and stifle enthusiasm, while others enhance learning or stimulate curiosity. Furthermore, in a world where technological change is accelerating we could ask how might architecture connect resource abundant and resource scarce innovation environments? Innovation environments developed out of necessity within urban villages and those developed with high intention and expectation within more institutionalized settings share a framework of opportunity for addressing change through learning and education. This thesis investigates formal and informal learning environments and how architecture can stimulate curiosity, enrich learning, create common ground, and expand access to education. The reason for this thesis exploration is to better understand how architects might design inclusive environments that bring people together to build sustainable infrastructure encouraging innovation and adaptation to change for years to come. The context of this thesis is largely based on Colin McFarlane’s theory that the “city is an assemblage for learning” The socio-spatial perspective in urbanism, considers how built infrastructure and society interact. Through the urban realm, inhabitants learn to negotiate people, space, politics, and resources affecting their daily lives. The city is therefore a dynamic field of emergent possibility. This thesis uses the city as a lens through which the boundaries between informal and formal logics as well as the public and private might be blurred. Through analytical processes I have examined the environmental devices and assemblage of factors that consistently provide conditions through which learning may thrive. These parameters that make a creative space significant can help suggest the design of common ground environments through which innovation is catalyzed.

Architectural-Physical Co-Design of 3D CPUs with Micro-Fluidic Cooling

The performance, energy efficiency and cost improvements due to traditional technology scaling have begun to slow down and present diminishing returns. Underlying reasons for this trend include fundamental physical limits of transistor scaling, the growing significance of quantum effects as transistors shrink, and a growing mismatch between transistors and interconnects regarding size, speed and power. Continued Moore's Law scaling will not come from technology scaling alone, and must involve improvements to design tools and development of new disruptive technologies such as 3D integration. 3D integration presents potential improvements to interconnect power and delay by translating the routing problem into a third dimension, and facilitates transistor density scaling independent of technology node. Furthermore, 3D IC technology opens up a new architectural design space of heterogeneously-integrated high-bandwidth CPUs. Vertical integration promises to provide the CPU architectures of the future by integrating high performance processors with on-chip high-bandwidth memory systems and highly connected network-on-chip structures. Such techniques can overcome the well-known CPU performance bottlenecks referred to as memory and communication wall. However the promising improvements to performance and energy efficiency offered by 3D CPUs does not come without cost, both in the financial investments to develop the technology, and the increased complexity of design. Two main limitations to 3D IC technology have been heat removal and TSV reliability. Transistor stacking creates increases in power density, current density and thermal resistance in air cooled packages. Furthermore the technology introduces vertical through silicon vias (TSVs) that create new points of failure in the chip and require development of new BEOL technologies. Although these issues can be controlled to some extent using thermal-reliability aware physical and architectural 3D design techniques, high performance embedded cooling schemes, such as micro-fluidic (MF) cooling, are fundamentally necessary to unlock the true potential of 3D ICs. A new paradigm is being put forth which integrates the computational, electrical, physical, thermal and reliability views of a system. The unification of these diverse aspects of integrated circuits is called Co-Design. Independent design and optimization of each aspect leads to sub-optimal designs due to a lack of understanding of cross-domain interactions and their impacts on the feasibility region of the architectural design space. Co-Design enables optimization across layers with a multi-domain view and thus unlocks new high-performance and energy efficient configurations. Although the co-design paradigm is becoming increasingly necessary in all fields of IC design, it is even more critical in 3D ICs where, as we show, the inter-layer coupling and higher degree of connectivity between components exacerbates the interdependence between architectural parameters, physical design parameters and the multitude of metrics of interest to the designer (i.e. power, performance, temperature and reliability). In this dissertation we present a framework for multi-domain co-simulation and co-optimization of 3D CPU architectures with both air and MF cooling solutions. Finally we propose an approach for design space exploration and modeling within the new Co-Design paradigm, and discuss the possible avenues for improvement of this work in the future.

A Plan for Salisbury, MD: Urban Design Transformations in Response to Sea Level Rise

This thesis proposes a master plan for Salisbury, MD that presents solutions to the challenges faced by small towns along tidal waterways. Salisbury’s challenges include flooding and sea level rise, poorly defined arteries framing downtown and disconnecting neighborhoods, and a lack of vibrant, mixed use development. These issues are common to small towns and present opportunities for transformative design.

Designing Happiness: Architecture and urban design for joy and well-being

Scientific studies exploring the environmental and experiential elements that help boost human happiness have become a significant and expanding body of work. Some urban designers, architects and planners are looking to apply this knowledge through policy decisions and design, but there is a great deal of room for further study and exploration. This paper looks at definitions of happiness and happiness measurements used in research. The paper goes on to introduce six environmental factors identified in a literature review that have design implications relating to happiness: Nature, Light, Surprise, Access, Identity, and Sociality. Architectural precedents are examined and design strategies are proposed for each factor, which are then applied to a test case site and building in Baltimore, Maryland. It is anticipated that these factors and strategies will be useful to architects, urban designers and planners as they endeavor to design positive user experiences and set city shaping policy.