AIR SIDE HEAT TRANSFER ENHANCEMENT IN HEAT EXCHANGERS UTILIZING INNOVATIVE DESIGNS AND THE ADDITIVE MANUFACTURING TECHNIQUE

Over the last decade, rapid development of additive manufacturing techniques has allowed the fabrication of innovative and complex designs. One field that can benefit from such technology is heat exchanger fabrication, as heat exchanger design has become more and more complex due to the demand for higher performance particularly on the air side of the heat exchanger. By employing the additive manufacturing, a heat exchanger design was successfully realized, which otherwise would have been very difficult to fabricate using conventional fabrication technologies. In this dissertation, additive manufacturing technique was implemented to fabricate an advanced design which focused on a combination of heat transfer surface and fluid distribution system. Although the application selected in this dissertation is focused on power plant dry cooling applications, the results of this study can directly and indirectly benefit other sectors as well, as the air-side is often the limiting side for in liquid or single phase cooling applications. Two heat exchanger designs were studied. One was an advanced metallic heat exchanger based on manifold-microchannel technology and the other was a polymer heat exchanger based on utilization of prime surface technology. Polymer heat exchangers offer several advantages over metals such as antifouling, anticorrosion, lightweight and often less expensive than comparable metallic heat exchangers. A numerical modeling and optimization were performed to calculate a design that yield an optimum performance. The optimization results show that significant performance enhancement is noted compared to the conventional heat exchangers like wavy fins and plain plate fins. Thereafter, both heat exchangers were scaled down and fabricated using additive manufacturing and experimentally tested. The manifold-micro channel design demonstrated that despite some fabrication inaccuracies, compared to a conventional wavy-fin surface, 15% - 50% increase in heat transfer coefficient was possible for the same pressure drop value. In addition, if the fabrication inaccuracy can be eliminated, an even larger performance enhancement is predicted. Since metal based additive manufacturing is still in the developmental stage, it is anticipated that with further refinement of the manufacturing process in future designs, the fabrication accuracy can be improved. For the polymer heat exchanger, by fabricating a very thin wall heat exchanger (150μm), the wall thermal resistance, which usually becomes the limiting side for polymer heat exchanger, was calculated to account for only up to 3% of the total thermal resistance. A comparison of air-side heat transfer coefficient of the polymer heat exchanger with some of the commercially available plain plate fin surface heat exchangers show that polymer heat exchanger performance is equal or superior to plain plate fin surfaces. This shows the promising potential for polymer heat exchangers to compete with conventional metallic heat exchangers when an additive manufacturing-enabled fabrication is utilized. Major contributions of this study are as follows: (1) For the first time demonstrated the potential of additive manufacturing in metal printing of heat exchangers that benefit from a sophisticated design to yield a performance substantially above the respective conventional systems. Such heat exchangers cannot be fabricated with the conventional fabrication techniques. (2) For the first time demonstrated the potential of additive manufacturing to produce polymer heat exchangers that by design minimize the role of thermal conductivity and deliver a thermal performance equal or better that their respective metallic heat exchangers. In addition of other advantages of polymer over metal like antifouling, anticorrosion, and lightweight. Details of the work are documented in respective chapters of this thesis.

FLOW REGIME DRIVEN THERMAL ENHANCEMENT IN INTERNALLY-GROOVED TUBES

Internally-grooved refrigeration tubes maximize tube-side evaporative heat transfer rates and have been identified as a most promising technology for integration into compact cold plates. Unfortunately, the absence of phenomenological insights and physical models hinders the extrapolation of grooved-tube performance to new applications. The success of regime-based heat transfer correlations for smooth tubes has motivated the current effort to explore the relationship between flow regimes and enhanced heat transfer in internally-grooved tubes. In this thesis, a detailed analysis of smooth and internally-grooved tube data reveals that performance improvement in internally-grooved tubes at low-to-intermediate mass flux is a result of early flow regime transition. Based on this analysis, a new flow regime map and corresponding heat transfer coefficient correlation, which account for the increased wetted angle, turbulence, and Gregorig effects unique to internally-grooved tubes, were developed. A two-phase test facility was designed and fabricated to validate the newly-developed flow regime map and regime-based heat transfer coefficient correlation. As part of this setup, a non-intrusive optical technique was developed to study the dynamic nature of two-phase flows. It was found that different flow regimes result in unique temporally varying film thickness profiles. Using these profiles, quantitative flow regime identification measures were developed, including the ability to explain and quantify the more subtle transitions that exist between dominant flow regimes. Flow regime data, based on the newly-developed method, and heat transfer coefficient data, using infrared thermography, were collected for two-phase HFE-7100 flow in horizontal 2.62mm - 8.84mm diameter smooth and internally-grooved tubes with mass fluxes from 25-300 kg/m²s, heat fluxes from 4-56 kW/m², and vapor qualities approaching 1. In total, over 6500 combined data points for the adiabatic and diabatic smooth and internally-grooved tubes were acquired. Based on results from the experiments and a reinterpretation of data from independent researchers, it was established that heat transfer enhancement in internally-grooved tubes at low-to-intermediate mass flux is primarily due to early flow regime transition to Annular flow. The regime-based heat transfer coefficient outperformed empirical correlations from the literature, with mean and absolute deviations of 4.0% and 32% for the full range of data collected.

Thermal Tracking and Estimation for Microprocessors

Due to increasing integration density and operating frequency of today's high performance processors, the temperature of a typical chip can easily exceed 100 degrees Celsius. However, the runtime thermal state of a chip is very hard to predict and manage due to the random nature in computing workloads, as well as the process, voltage and ambient temperature variability (together called PVT variability). The uneven nature (both in time and space) of the heat dissipation of the chip could lead to severe reliability issues and error-prone chip behavior (e.g. timing errors). Many dynamic power/thermal management techniques have been proposed to address this issue such as dynamic voltage and frequency scaling (DVFS), clock gating and etc. However, most of such techniques require accurate knowledge of the runtime thermal state of the chip to make efficient and effective control decisions. In this work we address the problem of tracking and managing the temperature of microprocessors which include the following sub-problems: (1) how to design an efficient sensor-based thermal tracking system on a given design that could provide accurate real-time temperature feedback; (2) what statistical techniques could be used to estimate the full-chip thermal profile based on very limited (and possibly noise-corrupted) sensor observations; (3) how do we adapt to changes in the underlying system's behavior, since such changes could impact the accuracy of our thermal estimation. The thermal tracking methodology proposed in this work is enabled by on-chip sensors which are already implemented in many modern processors. We first investigate the underlying relationship between heat distribution and power consumption, then we introduce an accurate thermal model for the chip system. Based on this model, we characterize the temperature correlation that exists among different chip modules and explore statistical approaches (such as those based on Kalman filter) that could utilize such correlation to estimate the accurate chip-level thermal profiles in real time. Such estimation is performed based on limited sensor information because sensors are usually resource constrained and noise-corrupted. We also took a further step to extend the standard Kalman filter approach to account for (1) nonlinear effects such as leakage-temperature interdependency and (2) varying statistical characteristics in the underlying system model. The proposed thermal tracking infrastructure and estimation algorithms could consistently generate accurate thermal estimates even when the system is switching among workloads that have very distinct characteristics. Through experiments, our approaches have demonstrated promising results with much higher accuracy compared to existing approaches. Such results can be used to ensure thermal reliability and improve the effectiveness of dynamic thermal management techniques.

COMPREHENSIVE ELECTRICAL/OPTICAL/THERMAL CHARACTERIZATIONS OF HIGH POWER LIGHT EMITTING DIODES AND LASER DIODES

Thermal characterizations of high power light emitting diodes (LEDs) and laser diodes (LDs) are one of the most critical issues to achieve optimal performance such as center wavelength, spectrum, power efficiency, and reliability. Unique electrical/optical/thermal characterizations are proposed to analyze the complex thermal issues of high power LEDs and LDs. First, an advanced inverse approach, based on the transient junction temperature behavior, is proposed and implemented to quantify the resistance of the die-attach thermal interface (DTI) in high power LEDs. A hybrid analytical/numerical model is utilized to determine an approximate transient junction temperature behavior, which is governed predominantly by the resistance of the DTI. Then, an accurate value of the resistance of the DTI is determined inversely from the experimental data over the predetermined transient time domain using numerical modeling. Secondly, the effect of junction temperature on heat dissipation of high power LEDs is investigated. The theoretical aspect of junction temperature dependency of two major parameters – the forward voltage and the radiant flux – on heat dissipation is reviewed. Actual measurements of the heat dissipation over a wide range of junction temperatures are followed to quantify the effect of the parameters using commercially available LEDs. An empirical model of heat dissipation is proposed for applications in practice. Finally, a hybrid experimental/numerical method is proposed to predict the junction temperature distribution of a high power LD bar. A commercial water-cooled LD bar is used to present the proposed method. A unique experimental setup is developed and implemented to measure the average junction temperatures of the LD bar. After measuring the heat dissipation of the LD bar, the effective heat transfer coefficient of the cooling system is determined inversely. The characterized properties are used to predict the junction temperature distribution over the LD bar under high operating currents. The results are presented in conjunction with the wall-plug efficiency and the center wavelength shift.

Performance of Plate Type Heat Exchanger as Ammonia Condenser

In this study, I experimentally analyzed the performance of a commercial semi-welded plate type heat exchanger (PHE) for use with ammonia systems. I determined performance parameters such as overall heat transfer coefficient, capacity, and pressure drop of the semi-welded PHE. This was analyzed by varying different parameters which demonstrated changes in overall heat transfer coefficient, capacity, and pressure drop. Both water and ammonia flow rates to the semi-welded PHE were varied independently, and analyzed in order to understand how changes in flow rates affected performance. Inlet water temperature was also varied, in order to understand how raising condenser water inlet temperature would affect performance. Finally, pressure drop was monitored to better understand the performance limitations of the semi-welded PHE. Testing of the semi-welded will give insight as to the performance of the semi-welded PHE in a potential ocean thermal energy conversion system, and whether the semi-welded PHE is a viable choice for use as an ammonia condenser.

A Thermal Management Solution for Compact Power Converters

Regulated Transformer Rectifier Units contain several power electronic boards to facilitate AC to DC power conversion. As these units become smaller, the number of devices on each board increases while their distance from each other decreases, making active cooling essential to maintaining reliable operation. Although it is widely accepted that liquid is a far superior heat transfer medium to air, the latter is still capable of yielding low device operating temperatures with proper heat sink and airflow design. The purpose of this study is to describe the models and methods used to design and build the thermal management system for one of the power electronic boards in a compact, high power regulated transformer rectifier unit. Maximum device temperature, available pressure drop and manufacturability were assessed when selecting the final design for testing. Once constructed, the thermal management system’s performance was experimentally verified at three different power levels.