Image-Guided Precision Manipulation of Cells and Nanoparticles in Microfluidics

Manipulation of single cells and particles is important to biology and nanotechnology. Our electrokinetic (EK) tweezers manipulate objects in simple microfluidic devices using gentle fluid and electric forces under vision-based feedback control. In this dissertation, I detail a user-friendly implementation of EK tweezers that allows users to select, position, and assemble cells and nanoparticles. This EK system was used to measure attachment forces between living breast cancer cells, trap single quantum dots with 45 nm accuracy, build nanophotonic circuits, and scan optical properties of nanowires. With a novel multi-layer microfluidic device, EK was also used to guide single microspheres along complex 3D trajectories. The schemes, software, and methods developed here can be used in many settings to precisely manipulate most visible objects, assemble objects into useful structures, and improve the function of lab-on-a-chip microfluidic systems.

EFFECT OF ISOTHERMAL AGING ON SAC305 HARMONIC VIBRATION DURABILITY

The effect of isothermal aging on the harmonic vibration durability of Sn3.0Ag0.5Cu solder interconnects is examined. Printed wiring assemblies with daisy-chained leadless chip resistors (LCRs) are aged at 125°C for 0, 100, and 500 hours. These assemblies are instrumented with accelerometers and strain gages to maintain the same harmonic vibration profile in-test, and to characterize PWB behavior. The tested assemblies are excited at their first natural frequencies until LCRs show a resistance increase of 20%. Dynamic finite element models are employed to generate strain transfer functions, which relate board strain levels observed in-test to respective solder strain levels. The transfer functions are based on locally averaged values of strains in critical regions of the solder and in appropriate regions of the PWB. The vibration test data and the solder strains from FEA are used to estimate lower-bound material fatigue curves for SAC305 solder materials, as a function of isothermal pre-aging.