2 resultados para Material fatigue

em DRUM (Digital Repository at the University of Maryland)


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The effect of isothermal aging on the harmonic vibration durability of Sn3.0Ag0.5Cu solder interconnects is examined. Printed wiring assemblies with daisy-chained leadless chip resistors (LCRs) are aged at 125°C for 0, 100, and 500 hours. These assemblies are instrumented with accelerometers and strain gages to maintain the same harmonic vibration profile in-test, and to characterize PWB behavior. The tested assemblies are excited at their first natural frequencies until LCRs show a resistance increase of 20%. Dynamic finite element models are employed to generate strain transfer functions, which relate board strain levels observed in-test to respective solder strain levels. The transfer functions are based on locally averaged values of strains in critical regions of the solder and in appropriate regions of the PWB. The vibration test data and the solder strains from FEA are used to estimate lower-bound material fatigue curves for SAC305 solder materials, as a function of isothermal pre-aging.

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Information entropy measured from acoustic emission (AE) waveforms is shown to be an indicator of fatigue damage in a high-strength aluminum alloy. Several tension-tension fatigue experiments were performed with dogbone samples of aluminum alloy, Al7075-T6, a commonly used material in aerospace structures. Unlike previous studies in which fatigue damage is simply measured based on visible crack growth, this work investigated fatigue damage prior to crack initiation through the use of instantaneous elastic modulus degradation. Three methods of measuring the AE information entropy, regarded as a direct measure of microstructural disorder, are proposed and compared with traditional damage-related AE features. Results show that one of the three entropy measurement methods appears to better assess damage than the traditional AE features, while the other two entropies have unique trends that can differentiate between small and large cracks.