BEHAVIOR OF FIBER REINFORCED POLYMER COMPOSITE PILES WITH ELLIPTICAL CROSS SECTIONS IN INTEGRAL ABUTMENT BRIDGE FOUNDATIONS

Every year in the US and other cold-climate countries considerable amount of money is spent to restore structural damages in conventional bridges resulting from (or “caused by”) salt corrosion in bridge expansion joints. Frequent usage of deicing salt in conventional bridges with expansion joints results in corrosion and other damages to the expansion joints, steel girders, stiffeners, concrete rebar, and any structural steel members in the abutments. The best way to prevent these damages is to eliminate the expansion joints at the abutment and elsewhere and make the entire bridge abutment and deck a continuous monolithic structural system. This type of bridge is called Integral Abutment Bridge which is now widely used in the US and other cold-climate countries. In order to provide lateral flexibility, the entire abutment is constructed on piles. Piles used in integral abutments should have enough capacity in the perpendicular direction to support the vertical forces. In addition, piles should be able to withstand corrosive environments near the surface of the ground and maintain their performance during the lifespan of the bridge. Fiber Reinforced Polymer (FRP) piles are a new type of pile that can not only accommodate large displacements, but can also resist corrosion significantly better than traditional steel or concrete piles. The use of FRP piles extends the life of the pile which in turn extends the life of the bridge. This dissertation studies FRP piles with elliptical shapes. The elliptical shapes can simultaneously provide flexibility and stiffness in two perpendicular axes. The elliptical shapes can be made using the filament winding method which is a less expensive method of manufacturing compared to the pultrusion or other manufacturing methods. In this dissertation a new way is introduced to construct the desired elliptical shapes with the filament winding method. Pile specifications such as dimensions, number of layers, fiber orientation angles, material, and soil stiffness are defined as parameters and the effects of each parameter on the pile stresses and pile failure have been studied. The ANSYS software has been used to model the composite materials. More than 14,000 nonlinear finite element pile models have been created, each slightly different from the others. The outputs of analyses have been used to draw curves. Optimum values of the parameters have been defined using generated curves. The best approaches to find optimum shape, angle of fibers and types of composite material have been discussed.

Advanced Adhesion Strength Testing Methods of Thin Film Multilayers in Electronic Packaging Systems

With the continued miniaturization and increasing performance of electronic devices, new technical challenges have arisen. One such issue is delamination occurring at critical interfaces inside the device. This major reliability issue can occur during the manufacturing process or during normal use of the device. Proper evaluation of the adhesion strength of critical interfaces early in the product development cycle can help reduce reliability issues and time-to-market of the product. However, conventional adhesion strength testing is inherently limited in the face of package miniaturization, which brings about further technical challenges to quantify design integrity and reliability. Although there are many different interfaces in today's advanced electronic packages, they can be generalized into two main categories: 1) rigid to rigid connections with a thin flexible polymeric layer in between, or 2) a thin film membrane on a rigid structure. Knowing that every technique has its own advantages and disadvantages, multiple testing methods must be enhanced and developed to be able to accommodate all the interfaces encountered for emerging electronic packaging technologies. For evaluating the adhesion strength of high adhesion strength interfaces in thin multilayer structures a novel adhesion test configuration called “single cantilever adhesion test (SCAT)” is proposed and implemented for an epoxy molding compound (EMC) and photo solder resist (PSR) interface. The test method is then shown to be capable of comparing and selecting the stronger of two potential EMC/PSR material sets. Additionally, a theoretical approach for establishing the applicable testing domain for a four-point bending test method was presented. For evaluating polymeric films on rigid substrates, major testing challenges are encountered for reducing testing scatter and for factoring in the potentially degrading effect of environmental conditioning on the material properties of the film. An advanced blister test with predefined area test method was developed that considers an elasto-plastic analytical solution and implemented for a conformal coating used to prevent tin whisker growth. The advanced blister testing with predefined area test method was then extended by employing a numerical method for evaluating the adhesion strength when the polymer’s film properties are unknown.