Surface Insulation Resistance Degradation and Electrochemical Migration on Printed Circuit Boards

Widespread adoption of lead-free materials and processing for printed circuit board (PCB) assembly has raised reliability concerns regarding surface insulation resistance (SIR) degradation and electrochemical migration (ECM). As PCB conductor spacings decrease, electronic products become more susceptible to these failures mechanisms, especially in the presence of surface contamination and flux residues which might remain after no-clean processing. Moreover, the probability of failure due to SIR degradation and ECM is affected by the interaction between physical factors (such as temperature, relative humidity, electric field) and chemical factors (such as solder alloy, substrate material, no-clean processing). Current industry standards for assessing SIR reliability are designed to serve as short-term qualification tests, typically lasting 72 to 168 hours, and do not provide a prediction of reliability in long-term applications. The risk of electrochemical migration with lead-free assemblies has not been adequately investigated. Furthermore, the mechanism of electrochemical migration is not completely understood. For example, the role of path formation has not been discussed in previous studies. Another issue is that there are very few studies on development of rapid assessment methodologies for characterizing materials such as solder flux with respect to their potential for promoting ECM. In this dissertation, the following research accomplishments are described: 1). Long-term temp-humidity-bias (THB) testing over 8,000 hours assessing the reliability of printed circuit boards processed with a variety of lead-free solder pastes, solder pad finishes, and substrates. 2). Identification of silver migration from Sn3.5Ag and Sn3.0Ag0.5Cu lead-free solder, which is a completely new finding compared with previous research. 3). Established the role of path formation as a step in the ECM process, and provided clarification of the sequence of individual steps in the mechanism of ECM: path formation, electrodeposition, ion transport, electrodeposition, and filament formation. 4). Developed appropriate accelerated testing conditions for assessing the no-clean processed PCBs' susceptibility to ECM: a). Conductor spacings in test structures should be reduced in order to reflect the trend of higher density electronics and the effect of path formation, independent of electric field, on the time-to-failure. b). THB testing temperatures should be modified according to the material present on the PCB, since testing at 85oC can cause the evaporation of weak organic acids (WOAs) in the flux residues, leading one to underestimate the risk of ECM. 5). Correlated temp-humidity-bias testing with ion chromatography analysis and potentiostat measurement to develop an efficient and effective assessment methodology to characterize the effect of no-clean processing on ECM.

An Acoustic Analysis of Valveless Pulsejet Engines

Valveless pulsejets are extremely simple aircraft engines; essentially cleverly designed tubes with no moving parts. These engines utilize pressure waves, instead of machinery, for thrust generation, and have demonstrated thrust-to-weight ratios over 8 and thrust specific fuel consumption levels below 1 lbm/lbf-hr – performance levels that can rival many gas turbines. Despite their simplicity and competitive performance, they have not seen widespread application due to extremely high noise and vibration levels, which have persisted as an unresolved challenge primarily due to a lack of fundamental insight into the operation of these engines. This thesis develops two theories for pulsejet operation (both based on electro-acoustic analogies) that predict measurements better than any previous theory reported in the literature, and then uses them to devise and experimentally validate effective noise reduction strategies. The first theory analyzes valveless pulsejets as acoustic ducts with axially varying area and temperature. An electro-acoustic analogy is used to calculate longitudinal mode frequencies and shapes for prescribed area and temperature distributions inside an engine. Predicted operating frequencies match experimental values to within 6% with the use of appropriate end corrections. Mode shapes are predicted and used to develop strategies for suppressing higher modes that are responsible for much of the perceived noise. These strategies are verified experimentally and via comparison to existing models/data for valveless pulsejets in the literature. The second theory analyzes valveless pulsejets as acoustic systems/circuits in which each engine component is represented by an acoustic impedance. These are assembled to form an equivalent circuit for the engine that is solved to find the frequency response. The theory is used to predict the behavior of two interacting pulsejet engines. It is validated via comparison to experiment and data in the literature. The technique is then used to develop and experimentally verify a method for operating two engines in anti-phase without interfering with thrust production. Finally, Helmholtz resonators are used to suppress higher order modes that inhibit noise suppression via anti-phasing. Experiments show that the acoustic output of two resonator-equipped pulsejets operating in anti-phase is 9 dBA less than the acoustic output of a single pulsejet.