The optical response of nanostructured surfaces and the composite diffracted evanescent wave model

Investigations of the optical response of subwavelength-structure arrays milled into thin metal films have revealed surprising phenomena, including reports of unexpectedly high transmission of light. Many studies have interpreted the optical coupling to the surface in terms of the resonant excitation of surface plasmon polaritons (SPPs), but other approaches involving composite diffraction of surface evanescent waves (CDEW) have also been proposed. Here we present a series of measurements on very simple one-dimensional subwavelength structures to test the key properties of the surface waves, and compare them to the CDEW and SPP models. We find that the optical response of the silver metal surface proceeds in two steps: a diffractive perturbation in the immediate vicinity (2–3 mu m) of the structure, followed by excitation of a persistent surface wave that propagates over tens of micrometres. The measured wavelength and phase of this persistent wave are significantly shifted from those expected for resonance excitation of a conventional SPP on a pure silver surface.

Organic functionalisation, doping and characterisation of semiconductor surfaces for future CMOS device applications

Organic Functionalisation, Doping and Characterisation of Semiconductor Surfaces for Future CMOS Device Applications Semiconductor materials have long been the driving force for the advancement of technology since their inception in the mid-20th century. Traditionally, micro-electronic devices based upon these materials have scaled down in size and doubled in transistor density in accordance with the well-known Moore’s law, enabling consumer products with outstanding computational power at lower costs and with smaller footprints. According to the International Technology Roadmap for Semiconductors (ITRS), the scaling of metal-oxide-semiconductor field-effect transistors (MOSFETs) is proceeding at a rapid pace and will reach sub-10 nm dimensions in the coming years. This scaling presents many challenges, not only in terms of metrology but also in terms of the material preparation especially with respect to doping, leading to the moniker “More-than-Moore”. Current transistor technologies are based on the use of semiconductor junctions formed by the introduction of dopant atoms into the material using various methodologies and at device sizes below 10 nm, high concentration gradients become a necessity. Doping, the controlled and purposeful addition of impurities to a semiconductor, is one of the most important steps in the material preparation with uniform and confined doping to form ultra-shallow junctions at source and drain extension regions being one of the key enablers for the continued scaling of devices. Monolayer doping has shown promise to satisfy the need to conformally dope at such small feature sizes. Monolayer doping (MLD) has been shown to satisfy the requirements for extended defect-free, conformal and controllable doping on many materials ranging from the traditional silicon and germanium devices to emerging replacement materials such as III-V compounds This thesis aims to investigate the potential of monolayer doping to complement or replace conventional doping technologies currently in use in CMOS fabrication facilities across the world.