Particulate composite based on coconut fiber and castor oil polyurethane adhesive: An eco-efficient product

This paper presents a study on the potential use of coconut fiber as material to produce particleboards, with two different densities (0.8 g/cm(3) and 1.0 g/cm3), using castor oil-based polyurethane adhesive and urea-formaldehyde. The quality of the product that can be produced by industry was evaluated according to the normative NBR 14.810:2006, where density, thickness swell (TS), absorption, modulus of elasticity (MOE), modulus of rupture (MOR) in static bending and internal bond (IB) were determined. From the results, there was a decrease in TS and increase in MOR of coconut fiber panels with polyurethane resin panels compared with coconut fiber and resin urea-formaldehyde. Scanning microscopy electronic images (SEM) indicated that castor oil-based polyurethane adhesive occupies the gaps between the particles, a factor that contributes to improved physical and mechanical properties of the panels. The assessment of durability through accelerated aging tests shows that panels protected with waterproofing material can be used in environments that have contact with moisture. (C) 2012 Elsevier B.V. All rights reserved.

Dependence of brittle-to-ductile transition on crystallographic direction in diamond turning of single-crystal silicon

The objective of this paper is to show the dependence relationship between the crystallographic orientations upon brittle-to-ductile transition during diamond turning of monocrystalline silicon. Cutting tests were performed using a -5 degrees rake angle round nose diamond tool at different machining scales. At the micrometre level, the feedrate was kept constant at 2.5 micrometres per revolution (mu m/r), and the depth of cut was varied from 1 to 5 mu m. At the submicrometre level, the depth of cut was kept constant at 500 nm and the feedrate varied from 5 to 10 mu m/r. At the micrometre level, the uncut shoulder generated with an interrupted cutting test procedure provided a quantitative measurement of the ductile-to-brittle transition. Results show that the critical chip thickness in silicon for ductile material removal reaches a maximum of 285 nm in the [100] direction and a minimum of 115 nm in the [110] direction, when the depth of cut was 5 mu m. It was found that when a submicrometre depth of cut was applied, microcracks were revealed in the [110] direction, which is the softer direction in silicon. Micro Raman spectroscopy was used to estimate surface residual stress after machining. Compressive residual stress in the range 142 MPa and smooth damage free surface finish was probed in the [100] direction for a depth of cut of 5 mu m, whereas residual stresses in the range 350 MPa and brittle damage was probed in the [110] direction for a depth of cut of 500 nm.

Effect of partial preferential orientation and distortions in octahedral clusters on the photoluminescence properties of FeWO4 nanocrystals

This communication is a report of our initial research to obtain iron tungstate (FeWO4) nanocrystals by the microwave-hydrothermal method at 170 degrees C for 45 min. X-ray diffraction patterns showed that the FeWO4 nanocrystals prepared with polyethylene glycol-200 have a partial preferential orientation in the (011) plane in relation to other nanocrystals prepared with sodium bis(2-ethylhexyl) sulfosuccinate and water. Rietveld refinement data indicates that all nanocrystals are monophasic with wolframite-type monoclinic structures and exhibit different distortions on octahedral [FeO6]/[WO6] clusters. High resolution transmission electron microcopy revealed an oriented attachment mechanism for the growth of aggregated FeWO4 nanocrystals. Finally, we observed that the photoluminescence properties of these nanocrystals are affected by partial preferential orientation in the (011) plane and distortions on [FeO6]/[WO6] clusters.