1 resultado para electronics packaging
em Repositório Científico da Universidade de Évora - Portugal
Filtro por publicador
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Resumo:
In this study, a finite element (FE) framework for the analysis of the interplay between buckling and delamination of thin layers bonded to soft substrates is proposed. The current framework incorporates the following modeling features: (i) geometrically nonlinear solid shell elements, (ii) geometrically nonlinear cohesive interface elements, and (iii) hyperelastic material constitutive response for the bodies that compose the system. A fully implicit Newton–Raphson solution strategy is adopted to deal with the complex simultaneous presence of geometrical and material nonlinearities through the derivation of the consistent FE formulation. Applications to a rubber-like bi-material system under finite bending and to patterned stiff islands resting on soft substrate for stretchable solar cells subjected to tensile loading are proposed. The results obtained are in good agreement with benchmark results available in the literature, confirming the accuracy and the capabilities of the proposed numerical method for the analysis of complex three-dimensional fracture mechanics problems under finite deformations.