333 resultados para Alternation formation devices


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Chloromethylfurfural (CMF), a valuable intermediate for the production of chemicals and fuel, can be derived in high yields from the cellulose component of biomass. This study examined the effect of sugar cane bagasse components and biomass architecture on CMF/bio-oil yield using a HCl/dichloroethane biphasic system. The type of pretreatment affected bio-oil yield, as the CMF yield increased with increasing glucan content. CMF yield reached 81.9% with bagasse pretreated by acidified aqueous ionic liquid, which had a glucan content of 81.6%. The lignin content of the biomass was found to significantly reduce CMF yield, which was only 62.3% with acid-catalysed steam exploded sample having a lignin content of 29.6%. The change of CMF yield may be associated with fibre surface changes as a result of pretreatment. The hemicellulose content also impacted negatively on CMF yield. Storage of the bio-oil in chlorinated solvents prevented CMF degradation.

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Accurate characterization and reporting of organic photovoltaic (OPV) device performance remains one of the important challenges in the field. The large spread among the efficiencies of devices with the same structure reported by different groups is significantly caused by different procedures and equipment used during testing. The presented article addresses this issue by offering a new method of device testing using “suitcase sample” approach combined with outdoor testing that limits the diversity of the equipment, and a strict measurement protocol. A round robin outdoor characterization of roll-to-roll coated OPV cells and modules conducted among 46 laboratories worldwide is presented, where the samples and the testing equipment were integrated in a compact suitcase that served both as a sample transportation tool and as a holder and test equipment during testing. In addition, an internet based coordination was used via plasticphotovoltaics.org that allowed fast and efficient communication among participants and provided a controlled reporting format for the results that eased the analysis of the data. The reported deviations among the laboratories were limited to 5% when compared to the Si reference device integrated in the suitcase and were up to 8% when calculated using the local irradiance data. Therefore, this method offers a fast, cheap and efficient tool for sample sharing and testing that allows conducting outdoor measurements of OPV devices in a reproducible manner.

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The drive to replace lead (Pb) from electronics has led to the replacement of tin (Sn) alloys as the terminal plating for electronic devices. However, the deposition of Sn based alloys as the component surface finish tends to induce Sn whisker that causes unintended electric shorts when the conductive whiskers grow across to the adjacent conductor. Internal stress is considered as the driving force that causes the growth of Sn whiskers. In this study, stress type of elevated temperature/ humidity exposure at 55C/85%RH with the storage for up to 24 months was conducted to define the acceleration factor in samples with deposition of immersion Sn plating and Sn solder dipping. The addition of Nickel (Ni) under-layer was also applied to examine the correlation to field conditions. The results showed that the whisker length increased in high humidity irrespective of the deposition methods. It was also shown that pure Sn solder dipping mitigated the whisker growth but does not completely prevent it when alloying Sn with 0.4%wtCu. Additionally, Ni under-layer was indicated to be more efficient in mitigating the growth of whisker by prolonging the incubation time for whisker formation.