Generalized self-assembly of scalable two-dimensional transition metal oxide nanosheets

Two-dimensional (2D) transition metal oxide systems present exotic electronic properties and high specific surface areas, and also demonstrate promising applications ranging from electronics to energy storage. Yet, in contrast to other types of nanostructures, the question as to whether we could assemble 2D nanomaterials with an atomic thickness from molecules in a general way, which may give them some interesting properties such as those of graphene, still remains unresolved. Herein, we report a generalized and fundamental approach to molecular self-assembly synthesis of ultrathin 2D nanosheets of transition metal oxides by rationally employing lamellar reverse micelles. It is worth emphasizing that the synthesized crystallized ultrathin transition metal oxide nanosheets possess confined thickness, high specific surface area and chemically reactive facets, so that they could have promising applications in nanostructured electronics, photonics, sensors, and energy conversion and storage devices.

A novel ionic diffusion strategy to fabricate high-performance anode-supported solid oxide fuel cells (SOFCs) with proton-conducting Y-doped BaZrO3 films

A stable Y-doped BaZrO3 electrolyte film, which showed a good performance in proton-conducting SOFCs, was successfully fabricated using a novel ionic diffusion strategy.

Sinteractive anodic powders improve densification and electrochemical properties of BaZr0.8Y0.2O3-δ electrolyte films for anode-supported solid oxide fuel cells

The difficult sintering of BaZr0.8Y0.2O 3-δ (BZY20) powders makes the fabrication of anode-supported BZY20 electrolyte films complex. Dense BZY20 membranes were successfully fabricated on anode substrates made of sinteractive NiO-BZY20 powders, prepared by a combustion method. With respect to traditional anode substrates made of powders prepared by mechanical mixing, the anode substrates made of the wet-chemically synthesized composite NiO-BZY20 powders significantly promoted the densification of BZY20 membranes: dense BZY20 films were obtained after co-pressing and co-firing at 1300 °C, a much lower temperature than those usually needed for densifying BZY20 membranes. Improved electrochemical performance was also observed: the supported BZY20 films maintained a high proton conductivity, up to 5.4 × 10-3 S cm-1 at 700 °C. Moreover, an anode-supported fuel cell with a 30 m thick BZY20 electrolyte film fabricated at 1400 °C on the anode made of the wet-chemically synthesized NiO-BZY20 powder showed a peak power density of 172 mW cm-2 at 700 °C, using La0.6Sr0.4Co 0.2Fe0.8O3-δ-BaZr0.7Y 0.2Pr0.1O3-δ as the cathode material, with a remarkable performance for proton-conducting solid oxide fuel cell (SOFC) applications.

Sinteractivity, proton conductivity and chemical stability of BaZr 0.7In0.3O3-δ for solid oxide fuel cells (SOFCs)

In3+ was used as dopant for BaZrO3 proton conductor and 30 at%-doped BaZrO3 samples (BaZr0.7In 0.3O3-δ, BZI) were prepared as electrolyte materials for proton-conducting solid oxide fuel cells (SOFCs). The BZI material showed a much improved sinteractivity compared with the conventional Y-doped BaZrO 3. The BZI pellets reached almost full density after sintering at 1600 °C for 10 h, whereas the Y-doped BaZrO3 samples still remained porous under the same sintering conditions. The conductivity measurements indicated that BZI pellets showed smaller bulk but improved grain boundary proton conductivity, when compared with Y-doped BaZrO3 samples. A total proton conductivity of 1.7 × 10-3 S cm -1 was obtained for the BZI sample at 700 °C in wet 10% H 2 atmosphere. The BZI electrolyte material also showed adequate chemical stability against CO2 and H2O, which is promising for application in fuel cells.

The effects of humidity on tin whisker growth by immersion tin plating and tin solder dipping surface finishes

The drive to replace lead (Pb) from electronics has led to the replacement of tin (Sn) alloys as the terminal plating for electronic devices. However, the deposition of Sn based alloys as the component surface finish tends to induce Sn whisker that causes unintended electric shorts when the conductive whiskers grow across to the adjacent conductor. Internal stress is considered as the driving force that causes the growth of Sn whiskers. In this study, stress type of elevated temperature/ humidity exposure at 55C/85%RH with the storage for up to 24 months was conducted to define the acceleration factor in samples with deposition of immersion Sn plating and Sn solder dipping. The addition of Nickel (Ni) under-layer was also applied to examine the correlation to field conditions. The results showed that the whisker length increased in high humidity irrespective of the deposition methods. It was also shown that pure Sn solder dipping mitigated the whisker growth but does not completely prevent it when alloying Sn with 0.4%wtCu. Additionally, Ni under-layer was indicated to be more efficient in mitigating the growth of whisker by prolonging the incubation time for whisker formation.