In-flight thermal experiments for LISA Pathfinder: Simulating temperature noise at the Inertial Sensors

Thermal Diagnostics experiments to be carried out on board LISA Pathfinder (LPF) will yield a detailed characterisation of how temperature fluctuations affect the LTP (LISA Technology Package) instrument performance, a crucial information for future space based gravitational wave detectors as the proposed eLISA. Amongst them, the study of temperature gradient fluctuations around the test masses of the Inertial Sensors will provide as well information regarding the contribution of the Brownian noise, which is expected to limit the LTP sensitivity at frequencies close to 1mHz during some LTP experiments. In this paper we report on how these kind of Thermal Diagnostics experiments were simulated in the last LPF Simulation Campaign (November, 2013) involving all the LPF Data Analysis team and using an end-to-end simulator of the whole spacecraft. Such simulation campaign was conducted under the framework of the preparation for LPF operations.

Electronic Packaging of Paper-Based Anisotropic Magnetoresistive Sensors

This report investigates adaptations of electronic packaging methods used to create stacks of these sensors. Four methods were developed and tested to determine the best option in terms of mechanical stability and electrical conductivity of the system. For the first method, a stack is created by way of through paper vias (TPVs), a hole that is cut in the pads of the sensors and then filled with electrically conductive adhesive through the openings on the two sensors to be joined. The second method is called mechanical caulking and connects sensors through pads which have been lined with copper tape backed with conductive adhesive. The connection is created with a small copper rivet which is flattened in place by compressive force. The third method is the stitching method which is inspired by sewing of fabric. A pattern of thin copper wire is stitched on the pad of a sensor that is lined with copper tape backed with conductive adhesive. The wire is then stitched through a second sensor that is treated similarly with copper tape and the stack receives the same pattern through the two layers as was applied to the first sensor alone. The final method is the collapsed daisy chain which is the linear connection of sensors to their neighboring sensors via copper tape backed with conductive adhesive. The row of sensors is then collapsed in an alternating orientation into a single stack.