Socio-environmental impact of idol immersion: dimensions and directions

India possesses a diverse and rich cultural heritage and is renowned as a 'land of festivals'. These festivals attract massive community involvement paving way to new materials such as 'Plaster of Paris' being used for 'modernizing' the representation of idols with very little thought given to the issues of toxicity and environmental impacts. Another dimension to the whole issue is the plight of the artisans and the workers involved in the trade. Owing to the unorganized nature of the industry there is minimal or no guidelines pertaining-to the worker safety and health risks of the people involved. This paper attempts to address the complexities of the inherent hazards as a consequence of these socio-environmental issues and trace the scientific rationale in addressing them in a practical and pragmatic way.

Fatigue de-bond growth in adhesively bonded single lap joints

The fatigue de-bond growth studies have been conducted on adhesively bonded lap joint specimens between aluminium and aluminium with Redux-319A adhesive with a pre-defined crack of 3 mm at the bond end. The correlations between fracture parameters and the de-bond growth data are established using both numerical and experimental techniques. In the numerical method, geometrically non-linear finite element analyses were carried out on adhesively bonded joint specimen for various de-bond lengths measured from the lap end along the mid-bond line of the adhesive. The finite element results were post processed to estimate the SERR components G (I) and G (II) using the Modified Virtual Crack Closure Integral (MVCCI) procedure. In experimental work, specimens were fabricated and fatigue de-bond growth tests were conducted at a stress ratio R = -1. The results obtained from both numerical analyses and testing have been used to generate de-bond growth curve and establish de-bond growth law in the Paris regime for such joints. The de-bond growth rate is primarily function of mode-I SERR component G (I) since the rate of growth in shear mode is relatively small. The value of Paris exponent m is found to be 6.55. The high value of de-bond growth exponent in Paris regime is expected, since the adhesive is less ductile than conventional metallic materials. This study is important for estimating the life of adhesively bonded joints under both constant and variable amplitude fatigue loads.