3 resultados para Thermocouples

em Indian Institute of Science - Bangalore - Índia


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The oxidation rate of a cuprous sulfide pellet suspended in a stream of air was followed by measuring the evolution of SO2 titrimetrically. Thin thermocouples embedded in the center of the sample recorded the variation of temperature during oxidation. The reaction was found to be topochemical and the sample temperature was found to be higher than its surroundings initially for about half an hour. After this initial period, the sample temperature decreased to that of the surroundings and remained constant during the rest of the period of over 5 hr. The apparent activation energy from the experimental data was found to be different for the initial (nonisothermal) and subsequent (isothermal) periods. Rate controlling mechanisms for these two intervals have been proposed based on interface chemical reaction, mass transfer resistance, and heat transfer concepts. Fair agreement is found between the theoretical rates based on transport mechanisms and those obtained experimentally

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Resistance temperature detectors (RTDs) are being widely used to detect low temperature, while thermocouples (TCs) are being used to detect high temperature. The materials suitable for RTDs are platinum, germanium, carbon, carbon-glass, cernox, etc. Here, we have reported the possible application of another form of carbon i.e. carbon nanotubes in low temperature thermometry. It has been shown the resistance R and the sensitivity of carbon nanotube bundles can be tuned and made suitable for ultralow temperature detection. We report on the R-T measurement of carbon nanotube bundles from room temperature down to 1 K to felicitate the possible application of bundles in low temperature RTDs. ©2008 American Institute of Physics

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Managing heat produced by computer processors is an important issue today, especially when the size of processors is decreasing rapidly while the number of transistors in the processor is increasing rapidly. This poster describes a preliminary study of the process of adding carbon nanotubes (CNTs) to a standard silicon paste covering a CPU. Measurements were made in two rounds of tests to compare the rate of cool-down with and without CNTs present. The silicon paste acts as an interface between the CPU and the heat sink, increasing the heat transfer rate away from the CPU. To the silicon paste was added 0.05% by weight of CNTs. These were not aligned. A series of K-type thermocouples was used to measure the temperature as a function of time in the vicinity of the CPU, following its shut-off. An Omega data acquisition system was attached to the thermocouples. The CPU temperature was not measured directly because attachment of a thermocouple would have prevented its automatic shut-off A thermocouple in the paste containing the CNTs actually reached a higher temperature than the standard paste, an effect easily explained. But the rate of cooling with the CNTs was about 4.55% better.