Recent Advances in Low CTE and High Density System-on-a-Package (SOP) Substrate with Thin Film Component Integration

The Packaging Research Center has been developing next generation system-on-a-package (SOP) technology with digital, RF, optical, and sensor functions integrated in a single package/module. The goal of this effort is to develop a platform substrate technology providing very high wiring density and embedded thin film passive and active components using PWB compatible materials and processes. The latest SOP baseline process test vehicle has been fabricated on novel Si-matched CTE, high modulus C-SiC composite core substrates using 10mum thick BCB dielectric films with loss tangent of 0.0008 and dielectric constant of 2.65. A semi-additive plating process has been developed for multilayer microvia build-up using BCB without the use of any vacuum deposition or polishing/CMP processes. PWB and package substrate compatible processes such as plasma surface treatment/desmear and electroless/electrolytic pulse reverse plating was used. The smallest line width and space demonstrated in this paper is 6mum with microvia diameters in the 15-30mum range. This build-up process has also been developed on medium CTE organic laminates including MCL-E-679F from Hitachi Chemical and PTFE laminates with Cu-Invar-Cu core. Embedded decoupling capacitors with capacitance density of >500nF/cm2 have been integrated into the build-up layers using sol-gel synthesized BaTiO3 thin films (200-300nm film thickness) deposited on copper foils and integrated using vacuum lamination and subtractive etch processes. Thin metal alloy resistor films have been integrated into the SOP substrate using two methods: (a) NiCrAlSi thin films (25ohms per square) deposited on copper foils (Gould Electronics) laminated on the build-up layers and two step etch process for resistor definition, and (b) electroless plated Ni-W-P thin films (70 ohms to few Kohms per square) on the BCB dielectric by plasma surface treatment and activation. The electrical design and build-up layer structure along- - with key materials and processes used in the fabrication of the SOP4 test vehicle were presented in this paper. Initial results from the high density wiring and embedded thin film components were also presented. The focus of this paper is on integration of materials, processes and structures in a single package substrate for system-on-a-package (SOP) implementation

Hardness results for computing optimal locally Gabriel graphs

Delaunay and Gabriel graphs are widely studied geo-metric proximity structures. Motivated by applications in wireless routing, relaxed versions of these graphs known as Locally Delaunay Graphs (LDGs) and Lo-cally Gabriel Graphs (LGGs) have been proposed. We propose another generalization of LGGs called Gener-alized Locally Gabriel Graphs (GLGGs) in the context when certain edges are forbidden in the graph. Unlike a Gabriel Graph, there is no unique LGG or GLGG for a given point set because no edge is necessarily in-cluded or excluded. This property allows us to choose an LGG/GLGG that optimizes a parameter of interest in the graph. We show that computing an edge max-imum GLGG for a given problem instance is NP-hard and also APX-hard. We also show that computing an LGG on a given point set with dilation ≤k is NP-hard. Finally, we give an algorithm to verify whether a given geometric graph G= (V, E) is a valid LGG.

On Locally Gabriel Geometric Graphs

Let be a set of points in the plane. A geometric graph on is said to be locally Gabriel if for every edge in , the Euclidean disk with the segment joining and as diameter does not contain any points of that are neighbors of or in . A locally Gabriel graph(LGG) is a generalization of Gabriel graph and is motivated by applications in wireless networks. Unlike a Gabriel graph, there is no unique LGG on a given point set since no edge in a LGG is necessarily included or excluded. Thus the edge set of the graph can be customized to optimize certain network parameters depending on the application. The unit distance graph(UDG), introduced by Erdos, is also a LGG. In this paper, we show the following combinatorial bounds on edge complexity and independent sets of LGG: (i) For any , there exists LGG with edges. This improves upon the previous best bound of . (ii) For various subclasses of convex point sets, we show tight linear bounds on the maximum edge complexity of LGG. (iii) For any LGG on any point set, there exists an independent set of size .