A Nonlinear Voltage Regulator With One Tunable Parameter for Multimachine Power Systems

This paper proposes a nonlinear voltage regulator with one tunable parameter for multimachine power systems. Based on output feedback linearization, this regulator can achieve simultaneous voltage regulation and small-signal performance objectives. Conventionally output feedback linearization has been used for voltage regulator design by taking infinite bus voltage as reference. Unfortunately, this controller has poor small-signal performance and cannot be applied to multimachine systems without the estimation of the equivalent external reactance seen from the generator. This paper proposes a voltage regulator design by redefining the rotor angle at each generator with respect to the secondary voltage of the step-up transformer as reference instead of a common synchronously rotating reference frame. Using synchronizing and damping torques analysis, we show that the proposed voltage regulator achieves simultaneous voltage regulation and damping performance over a range of system and operating conditions by controlling the relative angle between the generator internal voltage angle delta and the secondary voltage of the step up transformer. The performance of the proposed voltage regulator is evaluated on a single machine infinite bus system and two widely used multimachine test systems.

Ascent Phase Trajectory Optimization of a Generic Launch Vehicle

Trajectory optimization of a generic launch vehicle is considered in this paper. The trajectory from launch point to terminal injection point is divided in to two segments. The first segment deals with launcher clearance and vertical raise of the vehicle. During this phase, a nonlinear feedback guidance loop is incorporated to assure vertical raise in presence of thrust misalignment, centre of gravity offset, wind disturbance etc. and possibly to clear obstacles as well. The second segment deals with the trajectory optimization, where the objective is to ensure desired terminal conditions as well as minimum control effort and minimum structural loading in the high dynamic pressure region. The usefulness of this dynamic optimization problem formulation is demonstrated by solving it using the classical Gradient method. Numerical results for both the segments are presented, which clearly brings out the potential advantages of the proposed approach.

Antenna Selection Training in MIMO-OFDM/OFDMA Cellular Systems

Antenna selection allows multiple-antenna systems to achieve most of their promised diversity gain, while keeping the number of RF chains and, thus, cost/complexity low. In this paper we investigate antenna selection for fourth-generation OFDMA- based cellular communications systems, in particular, 3GPP LTE (long-term evolution) systems. We propose a training method for antenna selection that is especially suitable for OFDMA. By means of simulation, we evaluate the SNR-gain that can be achieved with our design. We find that the performance depends on the bandwidth assigned to each user, the scheduling method (round-robin or frequency-domain scheduling), and the Doppler spread. Furthermore, the signal-to-noise ratio of the training sequence plays a critical role. Typical SNR gains are around 2 dB, with larger values obtainable in certain circumstances.

On the fundamentally asynchronous nature of interference in cooperative base station systems

Cooperative transmission by base stations can significantly improve the spectral efficiency of multiuser, multi-cell multiple input multiple output systems. We show that in such systems the multiuser interference is asynchronous by nature, even when perfect timing-advance mechanisms ensure that the desired signal components arrive synchronously. We establish an accurate mathematical model for the asynchronism, and use it to show that the asynchronism leads to a significant performance degradation of existing linear preceding designs that assumed synchronous interference. We consider three different previously proposed precoding designs, and show how to modify them to effectively mitigate asynchronous interference.

Recent Advances in Low CTE and High Density System-on-a-Package (SOP) Substrate with Thin Film Component Integration

The Packaging Research Center has been developing next generation system-on-a-package (SOP) technology with digital, RF, optical, and sensor functions integrated in a single package/module. The goal of this effort is to develop a platform substrate technology providing very high wiring density and embedded thin film passive and active components using PWB compatible materials and processes. The latest SOP baseline process test vehicle has been fabricated on novel Si-matched CTE, high modulus C-SiC composite core substrates using 10mum thick BCB dielectric films with loss tangent of 0.0008 and dielectric constant of 2.65. A semi-additive plating process has been developed for multilayer microvia build-up using BCB without the use of any vacuum deposition or polishing/CMP processes. PWB and package substrate compatible processes such as plasma surface treatment/desmear and electroless/electrolytic pulse reverse plating was used. The smallest line width and space demonstrated in this paper is 6mum with microvia diameters in the 15-30mum range. This build-up process has also been developed on medium CTE organic laminates including MCL-E-679F from Hitachi Chemical and PTFE laminates with Cu-Invar-Cu core. Embedded decoupling capacitors with capacitance density of >500nF/cm2 have been integrated into the build-up layers using sol-gel synthesized BaTiO3 thin films (200-300nm film thickness) deposited on copper foils and integrated using vacuum lamination and subtractive etch processes. Thin metal alloy resistor films have been integrated into the SOP substrate using two methods: (a) NiCrAlSi thin films (25ohms per square) deposited on copper foils (Gould Electronics) laminated on the build-up layers and two step etch process for resistor definition, and (b) electroless plated Ni-W-P thin films (70 ohms to few Kohms per square) on the BCB dielectric by plasma surface treatment and activation. The electrical design and build-up layer structure along- - with key materials and processes used in the fabrication of the SOP4 test vehicle were presented in this paper. Initial results from the high density wiring and embedded thin film components were also presented. The focus of this paper is on integration of materials, processes and structures in a single package substrate for system-on-a-package (SOP) implementation