Peroxomonosulphate initiated graft copolymerization of aniline onto poly(propylene) fibre - A kinetic approach

Graft copolymerization of poly(aniline) (PANI) onto poly(propylene) (PP) fibre was carried out in aqueous acidic medium under nitrogen atmosphere by using peroxomonosulphate (PMS) as a lone initiator. The non-conducting fibre was now made into a conducting one through the chemical grafting of PANI units onto the PP fibre backbone. The content of PANI in the backbone was found to vary while varying the [ANI], [PMS] and amount of PP fibre. Various graft parameters were evaluated. The chemical grafting of PANI onto PP fibre was confirmed by conductivity measurements.

Al/SiC carriers for microwave integrated circuits by a new technique of pressureless infiltration

Materials with high thermal conductivity and thermal expansion coefficient matching with that of Si or GaAs are being used for packaging high density microcircuits due to their ability of faster heat dissipation. Al/SiC is gaining wide acceptance as electronic packaging material due to the fact that its thermal expansion coefficient can be tailored to match with that of Si or GaAs by varying the Al:SiC ratio while maintaining the thermal conductivity more or less the same. In the present work, Al/SiC microwave integrated circuit (MIC) carriers have been fabricated by pressureless infiltration of Al-alloy into porous SiC preforms in air. This new technique provides a cheaper alternative to pressure infiltration or pressureless infiltration in nitrogen in producing Al/SiC composites for electronic packaging applications. Al-alloy/65vol% SiC composite exhibited a coefficient of thermal expansion of 7 x 10(-6) K-1 (25 degrees C-100 degrees C) and a thermal conductivity of 147 Wm(-1) K-1 at 30 degrees C. The hysteresis observed in thermal expansion coefficient of the composite in the temperature range 100 degrees C-400 degrees C has been attributed to the presence of thermal residual stresses in the composite. Thermal diffusivity of the composite measured over the temperature range from 30 degrees C to 400 degrees C showed a 55% decrease in thermal diffusivity with temperature. Such a large decrease in thermal diffusivity with temperature could be due to the presence of micropores, microcracks, and decohesion of the Al/SiC interfaces in the microstructure (all formed during cooling from the processing temperature). The carrier showed satisfactory performance after integrating it into a MIC.

Studies on a nanocomposite solid polymer electrolyte with hydrotalcite as a filler

We have prepared a new nanocomposite polymer electrolyte using nanoparticles of hydrotalcite, an anionic clay, as the filler. Hydrotalcite has the chemical composition [M-1-x(2+) M-x(3+) (OH)(2)](x+) [A(x/n)(n-)center dot mH(2)O] where M2+ is a divalent cation (e.g. Mg2+, Ni2+, Co2+,etc.) and M3+ is a trivalent cation (e.g. Al3+, Fe3+, Cr3+, etc.). A(n-) is an anion intercalated between the positively charged double hydroxide layers. The nanoparticles of [Mg0.67Al0.33 (OH)(2)] [(CO3)(0.17)center dot mH(2)O] were prepared by the co-precipitation method (average particle size as observed by TEM similar to 50 nm) and were doped into poly(ethylene glycol) PEG (m.w.2000) complexed with LiCIO4. Samples with different wt.% of hydrotalcite were prepared and characterized using XRD, DSC, TGA, impedance spectroscopy and NMR. Ionic conductivity for the pristine sample, similar to 7.3 x 10(-7) S cm(-1), was enhanced to a maximum of = 1.1 x 10(-5) S cm(-1) for 3.6 wt.% nanoparticle doped sample. We propose that the enhancement of ionic conductivity is caused by percolation effects of the high conductivity paths provided by interfaces between the nanoparticles and the polymer electrolyte. (C) 2010 Elsevier B.V. All rights reserved.