520 resultados para 291602 Memory Structures
Resumo:
A Shape Memory Alloy (SMA) wire reinforced composite shell structure is analyzed for self-healing characteristic using Variational Asymptotic Method (VAM). SMA behavior is modeled using a onedimensional constitutive model. A pre-notched specimen is loaded longitudinally to simulate crack propagation. The loading process is accompanied by martensitic phase transformation in pre-strained SMA wires, bridging the crack. To heal the composite, uniform heating is required to initiate reverse transformation in the wires and bringing the crack faces back into contact. The pre-strain in the SMA wires used for reinforcement, causes a closure force across the crack during reverse transformation of the wires under heating. The simulation can be useful in design of self-healing composite structures using SMA. Effect of various parameters, like composite and SMA material properties and the geometry of the specimen, on the cracking and self-healing can also be studied.
Resumo:
The focus of this paper is on designing useful compliant micro-mechanisms of high-aspect-ratio which can be microfabricated by the cost-effective wet etching of (110) orientation silicon (Si) wafers. Wet etching of (110) Si imposes constraints on the geometry of the realized mechanisms because it allows only etch-through in the form of slots parallel to the wafer's flat with a certain minimum length. In this paper, we incorporate this constraint in the topology optimization and obtain compliant designs that meet the specifications on the desired motion for given input forces. Using this design technique and wet etching, we show that we can realize high-aspect-ratio compliant micro-mechanisms. For a (110) Si wafer of 250 µm thickness, the minimum length of the etch opening to get a slot is found to be 866 µm. The minimum achievable width of the slot is limited by the resolution of the lithography process and this can be a very small value. This is studied by conducting trials with different mask layouts on a (110) Si wafer. These constraints are taken care of by using a suitable design parameterization rather than by imposing the constraints explicitly. Topology optimization, as is well known, gives designs using only the essential design specifications. In this work, we show that our technique also gives manufacturable mechanism designs along with lithography mask layouts. Some designs obtained are transferred to lithography masks and mechanisms are fabricated on (110) Si wafers.
Resumo:
As the gap between processor and memory continues to grow Memory performance becomes a key performance bottleneck for many applications. Compilers therefore increasingly seek to modify an application’s data layout to improve cache locality and cache reuse. Whole program Structure Layout [WPSL] transformations can significantly increase the spatial locality of data and reduce the runtime of programs that use link-based data structures, by increasing the cache line utilization. However, in production compilers WPSL transformations do not realize the entire performance potential possible due to a number of factors. Structure layout decisions made on the basis of whole program aggregated affinity/hotness of structure fields, can be sub optimal for local code regions. WPSL is also restricted in applicability in production compilers for type unsafe languages like C/C++ due to the extensive legality checks and field sensitive pointer analysis required over the entire application. In order to overcome the issues associated with WPSL, we propose Region Based Structure Layout (RBSL) optimization framework, using selective data copying. We describe our RBSL framework, implemented in the production compiler for C/C++ on HP-UX IA-64. We show that acting in complement to the existing and mature WPSL transformation framework in our compiler, RBSL improves application performance in pointer intensive SPEC benchmarks ranging from 3% to 28% over WPSL
Resumo:
Today's feature-rich multimedia products require embedded system solution with complex System-on-Chip (SoC) to meet market expectations of high performance at a low cost and lower energy consumption. The memory architecture of the embedded system strongly influences these parameters. Hence the embedded system designer performs a complete memory architecture exploration. This problem is a multi-objective optimization problem and can be tackled as a two-level optimization problem. The outer level explores various memory architecture while the inner level explores placement of data sections (data layout problem) to minimize memory stalls. Further, the designer would be interested in multiple optimal design points to address various market segments. However, tight time-to-market constraints enforces short design cycle time. In this paper we address the multi-level multi-objective memory architecture exploration problem through a combination of Multi-objective Genetic Algorithm (Memory Architecture exploration) and an efficient heuristic data placement algorithm. At the outer level the memory architecture exploration is done by picking memory modules directly from a ASIC memory Library. This helps in performing the memory architecture exploration in a integrated framework, where the memory allocation, memory exploration and data layout works in a tightly coupled way to yield optimal design points with respect to area, power and performance. We experimented our approach for 3 embedded applications and our approach explores several thousand memory architecture for each application, yielding a few hundred optimal design points in a few hours of computation time on a standard desktop.
Resumo:
In this paper we propose the architecture of a SoC fabric onto which applications described in a HLL are synthesized. The fabric is a homogeneous layout of computation, storage and communication resources on silicon. Through a process of composition of resources (as opposed to decomposition of applications), application specific computational structures are defined on the fabric at runtime to realize different modules of the applications in hardware. Applications synthesized on this fabric offers performance comparable to ASICs while retaining the programmability of processing cores. We outline the application synthesis methodology through examples, and compare our results with software implementations on traditional platforms with unbounded resources.
Resumo:
Structural Health Monitoring has gained wide acceptance in the recent past as a means to monitor a structure and provide an early warning of an unsafe condition using real-time data. Utilization of structurally integrated, distributed sensors to monitor the health of a structure through accurate interpretation of sensor signals and real-time data processing can greatly reduce the inspection burden. The rapid improvement of the Fiber Optic Sensor technology for strain, vibration, ultrasonic and acoustic emission measurements in recent times makes it feasible alternative to the traditional strain gauges, PVDF and conventional Piezoelectric sensors used for Non Destructive Evaluation (NDE) and Structural Health Monitoring (SHM). Optical fiber-based sensors offer advantages over conventional strain gauges, and PZT devices in terms of size, ease of embedment, immunity from electromagnetic interference (EMI) and potential for multiplexing a number of sensors. The objective of this paper is to demonstrate the acoustic wave sensing using Extrinsic Fabry-Perot Interferometric (EFPI) sensor on a GFRP composite laminates. For this purpose experiments have been carried out initially for strain measurement with Fiber Optic Sensors on GFRP laminates with intentionally introduced holes of different sizes as defects. The results obtained from these experiments are presented in this paper. Numerical modeling has been carried out to obtain the relationship between the defect size and strain.