133 resultados para tablet-PC


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Overconsolidated soils exhibit a bilinear e-log p relationship. During virgin compression, microstructural units form larger stable groups, thereby reducing the operating specific surface and, in turn, net osmotic repulsive forces in the soil. The rebound portion of the e-log p curve is consequently flatter. The generalized relationship for compressibility of uncemented soils in the overconsolidated state has been developed in the form of e/eL = 1.122 = 0.188 log pc - 0.0463 log p in which e/eL is the generalized soil state parameter, pc is the preconsolidation pressure in kPa, p is the effective overburden pressure in kPa, e is the in situ void ratio, and eL is the void ratio corresponding to the liquid limit water content (wLG). This relationship can be usefully employed to predict both the preconsolidation pressure and compressibility responses of overconsolidated uncemented soils.

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Recent work of Jones et al. giving the long-range behaviour of the pair correlation function is used to confirm that the critical ratio Pc/nckBTc = 1/2 in the Born-Green theory. This deviates from experimental results on simple insulating liquids by more than the predictions of the van der Waals equation of state. A brief discussion of conditions for thermodynamic consistency, which the Born-Green theory violates, is then given. Finally, the approach of the Ornstein-Zernike correlation function to its critical point behaviour is discussed within the Born-Green theory.

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Antibodies to deoxycytidylate (dpC) were elicited in rabbits using a thyroglobulin (Tg) conjugate of dpC. The specificity of the antibodies was determined by measuring the inhibition of the binding of [3H]dpC to the antibodies by various non-radioactive nucleotides or derivatives. The antibodies were found to distinguish dpC from pC and DNA from RNA, probably due to their specificity for the conformation of the deoxycytidylate.

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Abstract is not available.

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Abstract is not available.

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A new 8-node serendipity quadrilateral plate bending element (MQP8) based on the Mindlin-Reissner theory for the analysis of thin and moderately thick plate bending problems using Integrated Force Method is presented in this paper. The performance of this new element (MQP8) is studied for accuracy and convergence by analyzing many standard benchmark plate bending problems. This new element MQP8 performs excellent in both thin and moderately thick plate bending situations. And also this element is free from spurious/zero energy modes and free from shear locking problem.

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O6-Alkylguanine-DNA alkyltransferase (AGT) repairs O6-methylguanine (O6mG) in DNA that is known to cause Mutation and cancer. On the basis of Calculations performed using density functional theory involving the active site of AGT, a mechanism for catalytic demethylation of O6mG to guanine has been proposed. In this mechanism, roles of six amino acids, i.e., Cys145, His 146, Glu172, Tyr114, Lys165, and Ser159 in catalytic demethylation of O6mG are involved. This mechanism has three steps as follows. At the first step, Cys145 in the Cys145-water-His146-Glu172 tetrad is converted to cysteine thiolate anion while at the second step, abstraction of the Tyr114 proton by the N3 site of O6mG occurs in a barrierless manner. In the third step, abstraction of Lys165 proton by deprotonated Tyr114 and transfer of the methyl group of O6mG to the thiolate group of Cys145 anion Occur simultaneously. As AGT is a major target in cancer therapy, identification of the roles of the different amino acids in demethylation of O6mG is expected to be useful in designing efficient AGT inhibitors.

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In document images, we often find printed lines over-lapping with hand written elements especially in case of signatures. Typical examples of such images are bank cheques and payment slips. Although the detection and removal of the horizontal lines has been addressed, the restoration of the handwritten area after removal of lines, persists to be a problem of interest. lit this paper, we propose a method for line removal and restoration of the erased areas of the handwritten elements. Subjective evaluation of the results have been conducted to analyze the effectiveness of the proposed method. The results are promising with an accuracy of 86.33%. The entire Process takes less than half a second for completion on a 2.4 GHz 512 MB RAM Pentium IV PC for a document image.

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The document images that are fed into an Optical Character Recognition system, might be skewed. This could be due to improper feeding of the document into the scanner or may be due to a faulty scanner. In this paper, we propose a skew detection and correction method for document images. We make use of the inherent randomness in the Horizontal Projection profiles of a text block image, as the skew of the image varies. The proposed algorithm has proved to be very robust and time efficient. The entire process takes less than a second on a 2.4 GHz Pentium IV PC.

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We describe a real-time system that supports design of optimal flight paths over terrains. These paths either maximize view coverage or minimize vehicle exposure to ground. A volume-rendered display of multi-viewpoint visibility and a haptic interface assists the user in selecting, assessing, and refining the computed flight path. We design a three-dimensional scalar field representing the visibility of a point above the terrain, describe an efficient algorithm to compute the visibility field, and develop visual and haptic schemes to interact with the visibility field. Given the origin and destination, the desired flight path is computed using an efficient simulation of an articulated rope under the influence of the visibility gradient. The simulation framework also accepts user input, via the haptic interface, thereby allowing manual refinement of the flight path.

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Adhesively-bonded composite patch repairs over cracked or corrosion-damaged metallic aircraft structures have shown great promise for extending life of ageing structures. This study presents the numerical investigation into the interface behaviour of adhesively-bonded cracked aluminum alloy substrate patched with fibre-reinforced composite material. The adhesive is modelled as an elasto-plastic bilinear material to characterise the debond behaviour, while the defective substrate is regarded as linear elastic continuum. Two typical patch shapes were selected based on information available in the literature. Geometric and material nonlinear analyses for square and octagonal patches were performed to capture peel and shear stresses developed between the substrate and the patch to examine the possibility of interface delamination/debonding. Parametric studies on adhesive thickness and patch thickness were carried out to predict their infuence on damage tolerance of repaired structures.

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W/Cr codoped Bi4Ti3O12 ceramics, Bi4Ti3-xWxO12+x+0.2 wt%Cr2O3 (BITWC, x=0-0.15), were prepared using a solid-state reaction method. The crystallographic evolution and phase analysis were distinctly determined focusing on the X-ray diffraction peak changes in (020)/(200) and (220)/(1115) diffraction planes, by which the lattice parameters, a, b, and c can be refined. The thermal variations of permittivity, dielectric loss (tan delta), impedance, and electrical conductivity properties were characterized. A decrease in the values of Curie temperature from 675 degrees to 640 degrees C and an increase in the values of the dielectric constant due to an increase of W6+/Cr3+ content were observed. The highest piezoelectric constant, d(33) of 22 pC/N, was achieved with the composition of Bi4Ti2.975W0.025O12.025+0.2 wt% Cr2O3. Also, this composition had a lower electrical conductivity than the other investigated compositions.

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The use of relatively low modulus adhesive at the ends of overlap in a bi-adhesive bondline of a bonded joint can reduce the stress concentration significantly and, therefore, potentially lead to higher strength of the joint. This study presents the two-dimensional and three-dimensional nonlinear (geometric and material) finite element analyses of adhesively bonded single lap joints having modulus-graded bondline under monotonic loading conditions. The adhesives were modelled as an elasto-plastic multi-linear material, while the substrates were regarded as both linear elastic and bi-linear elasto-plastic material. The computational simulations have been performed to investigate the bondline behaviour by studying the stress and strain distributions both at the mid-plane as well as at the interface of the bondline. It has been observed that the static strength is higher for joints with bi-adhesive bondlines compared to those with single adhesives in bondline. Higher joint strength has also been observed for optimum bi-adhesive bondline ratio through parametric studies. Effects of load level, and bondline thickness on stress distribution in the bi-adhesive bondline have also been studied. 3D analysis results reveal the existence of complex multi-axial stress/strain state at the ends of the overlap in the bondline which cannot be observed in 2D plane strain analysis. About 1/3rd of the width of the joint from the free edge in the width direction has 3D stress state, especially in the compliant adhesive of the bondline. Magnitudes of longitudinal and lateral stress/strain components are comparable to peel stress/strain components. It has also been analytically shown that the in-plane global stiffness of the joint remains unaffected by modulus gradation of the bondline adhesive. (C) Koninklijke Brill NV, Leiden, 2010.

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Adhesively-bonded composite patch repairs over cracked or corrosion-damaged metallic aircraft structures have shown great promise for extending life of ageing structures. This study presents the numerical investigation into the interface behaviour of adhesively-bonded cracked aluminum alloy substrate patched with fibre-reinforced composite material. The adhesive is modelled as an elasto-plastic bilinear material to characterise the debond behaviour, while the defective substrate is regarded as linear elastic continuum. Two typical patch shapes were selected based on information available in the literature. Geometric and material nonlinear analyses for square and octagonal patches were performed to capture peel and shear stresses developed between the substrate and the patch to examine the possibility of interface delamination/debonding. Parametric studies on adhesive thickness and patch thickness were carried out to predict their infuence on damage tolerance of repaired structures.