Tailoring the interface in graphene/thermoset polymer composites: A critical review

With the emergence of scientific interest in graphene oxide (GO) in recent times, researchers have endeavored to incorporate GO in thermoset polymeric matrix to develop composites with extraordinary set of properties. The current state of research in graphene/thermoset polymer composites is highlighted here with a focus on the role of interface in dictating the overall properties of the composites. Different strategies like covalent and non-covalent functionalization of GO have been discussed with respect to improvement in mechanical, electrical, thermal and rheological properties. In addition, future prospects have been outlined. By assessing the current state of research in graphene/thermoset composites, it is obvious that graphene derivatives are promising materials in enhancing the structural properties of the nanocomposites at extremely low levels of filler loading. This opens new avenues in designing lightweight composites for myriad applications and by tailoring the interfacial adhesion with the polymer, ordered structure can be achieved at macroscopic processing scales. (C) 2015 Elsevier Ltd. All rights reserved.

Gasification of wood particles in a co-current packed bed: Experiments and model analysis

This study focuses on addressing the propagation front movement in a co-current downdraft gasification system. A detailed single particle modeling analysis extended to the packed bed reactor is used to compare with the experimental measurement as well those available in the literature. This model for biomass gasification systems considered pyrolysis process, gas phase volatile combustion, and heterogeneous char reactions along with gas phase reactions in the packed bed. The pyrolysis kinetics has a critical influence on the gasification process. The propagation front has been shown to increase with air mass flux, attains a peak and then decreases with further increase in air mass flux and finally approaches negative propagation rate. This indicates that front is receding, or no upward movement() bra her it is moving downward towards the char bed. The propagation rate correlates with mass flux as (m) over dot `'(0.883) during the increasing regimes of the front movement The study clearly identifies that bed movement is an important parameter for consideration in a co-current configuration towards establishing the effective bed movement. The study also highlights the importance of surface area to volume ratio of the particles in the packed bed and its influence on the volatile generation. Finally, the gas composition for air gasification under various air mass fluxes is compared with the experimental results. (C) 2016 Elsevier B.V. All rights reserved.

Critical investigation of high performance spin-coated high-kappa titania thin films based MOS capacitor

We report the tunable dielectric constant of titania films with low leakage current density. Titanium dioxide (TiO2) films of three different thicknesses (36, 63 and 91 nm) were deposited by the consecutive steps of solution preparation, spin-coating, drying, and firing at different temperatures. The problem of poor adhesion between Si substrate and TiO2 insulating layer was resolved by using the plasma activation process. The surface roughness was found to increase with increasing thickness and annealing temperature. The electrical investigation was carried out using metal-oxide-semiconductor structure. The flat band voltage (V-FB), oxide trapped charge (Q(ot)), dielectric constant (kappa) and equivalent oxide thicknesses are calculated from capacitance-voltage (C-V) curves. The C-V characteristics indicate a thickness dependent dielectric constant. The dielectric constant increases from 31 to 78 as thickness increases from 36 to 91 nm. In addition to that the dielectric constant was found to be annealing temperature and frequency dependent. The films having thickness 91 nm and annealed at 600 A degrees C shows the low leakage current density. Our study provides a broad insight of the processing parameters towards the use of titania as high-kappa insulating layer, which might be useful in Si and polymer based flexible devices.