A New Family of Soft Transition Converters: Design Example and Dynamic Model

The soft switching converters evolved through the resonant load, resonant switch, resonant transition and active clamp converters to eliminate switching losses in power converters. This paper briefly presents the operating principle of the new family of soft transition converters; the methodology of design of these converters is presented through an example. In the proposed family of converters, the switching transitions of both the main switch and auxiliary switch are lossless.When these converters are analysed in terms of the pole current and throw voltage, the defining equations of all converters belonging to this family become identical.Such a description allows one to define simple circuit oriented model for these converters. These circuit models help in evaluating the steady state and dynamic model of these converters. The standard dynamic performance functions of the converters are readily obtainable from this model. This paper presents these dynamic models and verifies the same through measurements on a prototype converter.

A new family of soft transition converters: Design and dynamic model

The soft switching converters evolved through the resonant load, resonant switch, resonant transition and active clamp converters to eliminate switching losses in power converters. This paper briefly presents the operating principle of the new family of soft transition converters; the methodology of design of these converters is presented through an example. In the proposed family of converters, the switching transitions of both the main switch and auxiliary switch are lossless. When these converters are analysed in terms of the pole current and throw voltage, the defining equations of all converters belonging to this family become identical.Such a description allows one to define simple circuit oriented model for these converters. These circuit models help in evaluating the steady state and dynamic model of these converters. The standard dynamic performance functions of the converters are readily obtainable from this model. This paper presents these dynamic models and verifies the same through measurements on a prototype converter.

Recent Advances in Low CTE and High Density System-on-a-Package (SOP) Substrate with Thin Film Component Integration

The Packaging Research Center has been developing next generation system-on-a-package (SOP) technology with digital, RF, optical, and sensor functions integrated in a single package/module. The goal of this effort is to develop a platform substrate technology providing very high wiring density and embedded thin film passive and active components using PWB compatible materials and processes. The latest SOP baseline process test vehicle has been fabricated on novel Si-matched CTE, high modulus C-SiC composite core substrates using 10mum thick BCB dielectric films with loss tangent of 0.0008 and dielectric constant of 2.65. A semi-additive plating process has been developed for multilayer microvia build-up using BCB without the use of any vacuum deposition or polishing/CMP processes. PWB and package substrate compatible processes such as plasma surface treatment/desmear and electroless/electrolytic pulse reverse plating was used. The smallest line width and space demonstrated in this paper is 6mum with microvia diameters in the 15-30mum range. This build-up process has also been developed on medium CTE organic laminates including MCL-E-679F from Hitachi Chemical and PTFE laminates with Cu-Invar-Cu core. Embedded decoupling capacitors with capacitance density of >500nF/cm2 have been integrated into the build-up layers using sol-gel synthesized BaTiO3 thin films (200-300nm film thickness) deposited on copper foils and integrated using vacuum lamination and subtractive etch processes. Thin metal alloy resistor films have been integrated into the SOP substrate using two methods: (a) NiCrAlSi thin films (25ohms per square) deposited on copper foils (Gould Electronics) laminated on the build-up layers and two step etch process for resistor definition, and (b) electroless plated Ni-W-P thin films (70 ohms to few Kohms per square) on the BCB dielectric by plasma surface treatment and activation. The electrical design and build-up layer structure along- - with key materials and processes used in the fabrication of the SOP4 test vehicle were presented in this paper. Initial results from the high density wiring and embedded thin film components were also presented. The focus of this paper is on integration of materials, processes and structures in a single package substrate for system-on-a-package (SOP) implementation

Selection of Static VAR Compensator Location and Size for System Voltage Stability Improvement

This paper presents a methodology for selection of static VAR compensator location based on static voltage stability analysis of power systems. The analysis presented here uses the L-index of load buses, which includes voltage stability information of a normal load flow and is in the range of 0 (no load of system) to 1 (voltage collapse). An approach has been presented to select a suitable size and location of static VAR compensator in an EHV network for system voltage stability improvement. The proposed approach has been tested under simulated conditions on a few power systems and the results for a sample radial network and a 24-node equivalent EHV power network of a practical system are presented for illustration purposes. © 2000 Published by Elsevier Science S.A. All rights reserved.

Extended liaison as an interface between product and process model in assembly

This paper describes the use of liaison to better integrate product model and assembly process model so as to enable sharing of design and assembly process information in a common integrated form and reason about them. Liaison can be viewed as a set, usually a pair, of features in proximity with which process information can be associated. A liaison is defined as a set of geometric entities on the parts being assembled and relations between these geometric entities. Liaisons have been defined for riveting, welding, bolt fastening, screw fastening, adhesive bonding (gluing) and blind fastening processes. The liaison captures process specific information through attributes associated with it. The attributes are associated with process details at varying levels of abstraction. A data structure for liaison has been developed to cluster the attributes of the liaison based on the level of abstraction. As information about the liaisons is not explicitly available in either the part model or the assembly model, algorithms have been developed for extracting liaisons from the assembly model. The use of liaison is proposed to enable both the construction of process model as the product model is fleshed out, as well as maintaining integrity of both product and process models as the inevitable changes happen to both design and the manufacturing environment during the product lifecycle. Results from aerospace and automotive domains have been provided to illustrate and validate the use of liaisons. (C) 2014 Elsevier Ltd. All rights reserved.

An EXAFS study of the cobalt-molybdenum/.gamma.-alumina hydrodesulfurization catalyst

While Mo in the Co-Mo/y-A1203 hydrodesulfurization catalyst is present as a sulfidic species similar to MoS2, Co shows two types of coordination, one with six sulfurs (but not a bulk sulfide) and the other with four oxygens. The significance of such species is discussed. In addition to an additive relation of the EXAFS function and the residual spectra, the ratio of amplitude terms of the catalyst and the model system has been employed in the analysis.