Comparative statistical aging studies on an oil-pressboard insulation model

Accelerated aging experiments have been conducted on a representative oil-pressboard insulation model to investigate the effect of constant and sequential stresses on the PD behavior using a built-in phase resolved partial discharge analyzer. A cycle of the applied voltage starting from the zero of the positive half cycle was divided into 16 equal phase windows (Φ1 to Φ16) and partial discharge (PD) magnitude distribution in each phase was determined. Based on the experimental results, three stages of aging mechanism were identified. Gumbel's extreme value distribution of the largest element was used to model the first stage of aging process. Second and subsequent stages were modeled using two-parameter Weibull distribution. Spearman's non-parametric rank correlation test statistic and Kolmogrov-Smirnov two sample test were used to relate the aging process of each phase with the corresponding process of the full cycle. To bring out clearly the effect of stress level, its duration and test procedure on the distribution parameters and hence of the aging process, non-parametric ANOVA techniques like Kruskal-Wallis and Fisher's LSD multiple comparison tests were used. Results of the analysis show that two phases (Φ13 and Φ14) near the vicinity of the negative voltage peak were found to contribute significantly to the aging process and their aging mechanism also correlated well with that of the corresponding full cycle mechanism. Attempts have been made to relate these results with the published work of other workers

Effect of isothermal aging and electromigration on the microstructural evolution of solder interconnections during thermomechanical loading

The effect of different pre-aging treatments on the microstructural evolution of lead-free solder and growth of interfacial intermetallic compound layers under thermal cycling has been investigated in this work. The results show that there are distinct differences in the microstructural changes between samples with no pretreatment, samples that have experienced thermal annealing at 125A degrees C for 750 h before thermal cycling, and those that have had direct current (DC) stressing for 750 h as pretreatment. The microstructural evolution of the solder matrix is rationalized by utilizing the science of microstructures and analysis of the influence of electron flow on the precipitation phenomena. The finite-element method is utilized to understand the loading conditions imposed on the solder interconnections during cyclic stressing. The growth of intermetallic reaction layers is further analyzed by utilizing quantitative thermodynamic calculations coupled with kinetic analysis. The latter is based on the changes in the intrinsic diffusion fluxes of elements induced by current flow and alloying elements present in the system. With this concurrent approach the differences seen in thermal cycling behavior between the different pre-aging treatments can be explained.

Studies on the Aging Characteristics of Base Oil with Amine Based Antioxidant in Steel-on-Steel Lubricated Sliding

An industrial base oil, a blend of different paraffin fractions, is heated to 130 degrees C (1) in the ambient and (2) for use as a lubricant in a steel pin on a steel disk sliding experiment. The base oil was tested with and without test antioxidants: dimethyl disulfide (DMDS) and alkylated diphenylamine (ADPA). Primary and secondary oxidation products were monitored continuously by FTIR over a 100 h period. In addition, friction and wear of the steel pin were monitored over the same period and the chemical transformation of the pin surface was monitored by XPS. The objective of this work is to observe the catalytic action of the steel components on the oil aging process and the efficacy of the antioxidant to reduce oxidation of oil used in tribology as a lubricant. Possible mechanistic explanations of the aging process as well as its impact on friction and wear are discussed.

Multiple parents crossover operators: A new approach removes the overlapping solutions for sequencing problems

Maintaining population diversity throughout generations of Genetic Algorithms (GAs) is key to avoid premature convergence. Redundant solutions is one cause for the decreasing population diversity. To prevent the negative effect of redundant solutions, we propose a framework that is based on the multi-parents crossover (MPX) operator embedded in GAs. Because MPX generates diversified chromosomes with good solution quality, when a pair of redundant solutions is found, we would generate a new offspring by using the MPX to replace the redundant chromosome. Three schemes of MPX will be examined and will be compared against some algorithms in literature when we solve the permutation flowshop scheduling problems, which is a strong NP-Hard sequencing problem. The results indicate that our approach significantly improves the solution quality. This study is useful for researchers who are trying to avoid premature convergence of evolutionary algorithms by solving the sequencing problems.

Accelerated multistress aging of polymer nanocomposites and its condition monitoring

In recent years, the time dependant maintenance of expensive high voltage power equipments is getting replaced by condition based maintenance so as to detect apriori an impending failure of the equipment. For condition based maintenance, most monitoring systems concentrate on the electrical quantities such as measurement and evaluation of partial discharges, tan delta, tip-up test, dielectric strength, insulation resistance, polarization and depolarization current. However, in the case of equipments being developed with novel nanodielectric insulating materials, the variation in these parameters before an impending failure is not available. Hence in this work, accelerated electrothermal aging studies have been conducted on unfilled epoxy as well as epoxy nanocomposite samples of 5 wt% filler loading, and the tan d values were continuously monitored to obtain the condition of the samples under study. It was observed that those samples whose tan d increased at a rapid rate failed first.

EFFECT OF AGING ON IMPRESSION CREEP BEHAVIOR OF Pb-FREE SOLDERS

During service and/or storage, Sn-Ag-Cu (SAC) solder alloys are subjected to temperatures ranging from 0.4 to 0.8 Tm (where Tm is the melting temperature of SAC alloys), making them highly prone to significant microstructural coarsening. The microstructures of these low melting point alloys continuously evolve during service. This results in evolution of creep properties of the joint over time, thereby influencing the long-term reliability of microelectronic packages. Here, we study microstructure evolution and creep behavior of two Sn-Ag-Cu (SAC) alloys, namely Sn-3.0Ag-0.5Cu and Sn-1.0Cu-0.5Cu, isothermally aged at 150 degrees C for various lengths of time. Creep behavior of the two SAC solders after different aging durations was systematically studied using impression creep technique. The key microstructural features that evolve during aging are Ag3Sn particle size and inter-particle spacing. Creep results indicate that the creep rate increases considerably with increasing inter-particle spacing although the creep stress exponent and creep activation energy are independent of the aging history.