Phase noise and spur reduction in an array of direct digital synthesizers

Many applications, including communications, test and measurement, and radar, require the generation of signals with a high degree of spectral purity. One method for producing tunable, low-noise source signals is to combine the outputs of multiple direct digital synthesizers (DDSs) arranged in a parallel configuration. In such an approach, if all noise is uncorrelated across channels, the noise will decrease relative to the combined signal power, resulting in a reduction of sideband noise and an increase in SNR. However, in any real array, the broadband noise and spurious components will be correlated to some degree, limiting the gains achieved by parallelization. This thesis examines the potential performance benefits that may arise from using an array of DDSs, with a focus on several types of common DDS errors, including phase noise, phase truncation spurs, quantization noise spurs, and quantizer nonlinearity spurs. Measurements to determine the level of correlation among DDS channels were made on a custom 14-channel DDS testbed. The investigation of the phase noise of a DDS array indicates that the contribution to the phase noise from the DACs can be decreased to a desired level by using a large enough number of channels. In such a system, the phase noise qualities of the source clock and the system cost and complexity will be the main limitations on the phase noise of the DDS array. The study of phase truncation spurs suggests that, at least in our system, the phase truncation spurs are uncorrelated, contrary to the theoretical prediction. We believe this decorrelation is due to the existence of an unidentified mechanism in our DDS array that is unaccounted for in our current operational DDS model. This mechanism, likely due to some timing element in the FPGA, causes some randomness in the relative phases of the truncation spurs from channel to channel each time the DDS array is powered up. This randomness decorrelates the phase truncation spurs, opening the potential for SFDR gain from using a DDS array. The analysis of the correlation of quantization noise spurs in an array of DDSs shows that the total quantization noise power of each DDS channel is uncorrelated for nearly all values of DAC output bits. This suggests that a near N gain in SQNR is possible for an N-channel array of DDSs. This gain will be most apparent for low-bit DACs in which quantization noise is notably higher than the thermal noise contribution. Lastly, the measurements of the correlation of quantizer nonlinearity spurs demonstrate that the second and third harmonics are highly correlated across channels for all frequencies tested. This means that there is no benefit to using an array of DDSs for the problems of in-band quantizer nonlinearities. As a result, alternate methods of harmonic spur management must be employed.

Heat dissipation from carbon nano-electronics

The incorporation of graphitic compounds such as carbon nanotubes (CNTs) and graphene into nano-electronic device packaging holds much promise for waste heat management given their high thermal conductivities. However, as these graphitic materials must be used in together with other semiconductor/insulator materials, it is not known how thermal transport is affected by the interaction. Using different simulation techniques, in this thesis, we evaluate the thermal transport properties - thermal boundary conductance (TBC) and thermal conductivity - of CNTs and single-layer graphene in contact with an amorphous SiO2 (a-SiO2) substrate. First, the theoretical methodologies and concepts used in our simulations are presented. In particular, two concepts are described in detail as they are necessary for the understanding of the subsequent chapters. The first is the linear response Green-Kubo (GK) theory of thermal boundary conductance (TBC), which we develop in this thesis, and the second is the spectral energy density method, which we use to directly compute the phonon lifetimes and thermal transport coefficients. After we set the conceptual foundations, the TBC of the CNT-SiO2 interface is computed using non- equilibrium molecular dynamics (MD) simulations and the new Green-Kubo method that we have developed. Its dependence on temperature, the strength of the interaction with the substrate, and tube diameter are evaluated. To gain further insight into the phonon dynamics in supported CNTs, the scattering rates are computed using the spectral energy density (SED) method. With this method, we are able to distinguish the different scattering mechanisms (boundary and CNT-substrate phonon-phonon) and rates. The phonon lifetimes in supported CNTs are found to be reduced by contact with the substrate and we use that lifetime reduction to determine the change in CNT thermal conductivity. Next, we examine thermal transport in graphene supported on SiO2. The phonon contribution to the TBC of the graphene-SiO2 interface is computed from MD simulations and found to agree well with experimentally measured values. We derive the theory of remote phonon scattering of graphene electrons and compute the heat transfer coefficient dependence on doping level and temperature. The thermal boundary conductance from remote phonon scattering is found to be an order of magnitude smaller than that of the phonon contribution. The in-plane thermal conductivity of supported graphene is calculated from MD simulations. The experimentally measured order of magnitude reduction in thermal conductivity is reproduced in our simulations. We show that this reduction is due to the damping of the flexural (ZA) modes. By varying the interaction between graphene and the substrate, the ZA modes hybridize with the substrate Rayleigh modes and the dispersion of the hybridized modes is found to linearize in the strong coupling limit, leading to an increased thermal conductance in the composite structure.