Computational modeling of laser-induced delamination testing of thin films

Thin film adhesion often determines microelectronic device reliability and it is therefore essential to have experimental techniques that accurately and efficiently characterize it. Laser-induced delamination is a novel technique that uses laser-generated stress waves to load thin films at high strain rates and extract the fracture toughness of the film/substrate interface. The effectiveness of the technique in measuring the interface properties of metallic films has been documented in previous studies. The objective of the current effort is to model the effect of residual stresses on the dynamic delamination of thin films. Residual stresses can be high enough to affect the crack advance and the mode mixity of the delimitation event, and must therefore be adequately modeled to make accurate and repeatable predictions of fracture toughness. The equivalent axial force and bending moment generated by the residual stresses are included in a dynamic, nonlinear finite element model of the delaminating film, and the impact of residual stresses on the final extent of the interfacial crack, the relative contribution of shear failure, and the deformed shape of the delaminated film is studied in detail. Another objective of the study is to develop techniques to address issues related to the testing of polymeric films. These type of films adhere well to silicon and the resulting crack advance is often much smaller than for metallic films, making the extraction of the interface fracture toughness more difficult. The use of an inertial layer which enhances the amount of kinetic energy trapped in the film and thus the crack advance is examined. It is determined that the inertial layer does improve the crack advance, although in a relatively limited fashion. The high interface toughness of polymer films often causes the film to fail cohesively when the crack front leaves the weakly bonded region and enters the strong interface. The use of a tapered pre-crack region that provides a more gradual transition to the strong interface is examined. The tapered triangular pre-crack geometry is found to be effective in reducing the stresses induced thereby making it an attractive option. We conclude by studying the impact of modifying the pre-crack geometry to enable the testing of multiple polymer films.

Design of unique composites based on aromatic thermosetting copolyesters

Aromatic thermosetting copolyester (ATSP) has promise in high-temperature applications. It can be employed as a bulk polymer, as a coating and as a matrix for carbon fiber composites (ATSP/C composites). This work focuses on the applications of high performance ATSP/C composites. The morphology of the ATSP matrix in the presence of carbon fiber was studied. The effect of liquid crystalline character of starting oligomers used to prepare ATSP on the final crystal structure of the ATSP/C composite was evaluated. Matrices obtained by crosslinking of both liquid crystalline oligomers (ATSP2) and non-liquid crystalline oligomers (ATSP1) tend to crystallize in presence of carbon fibers. The crystallite size of ATSP2 is 4 times that of ATSP1. Composites made from ATSP2 yield tougher matrices compared to those made from ATSP1. Thus toughened matrices could be achieved without incorporating any additives by just changing the morphology of the final polymer. The flammability characteristics of ATSP were also studied. The limiting oxygen index (LOI) of bulk ATSP was found to be 40% whereas that of ATSP/C composites is estimated to be 85%. Thus, ATSP shows potential to be used as a flame resistant material, and also as an aerospace reentry shield. Mechanical properties of the ATSP/C composite were characterized. ATSP was observed to bond strongly with reinforcing carbon fibers. The tensile strength, modulus and shear modulus were comparable to those of conventionally used high temperature epoxy resins. ATSP shows a unique capability for healing of interlaminar cracks on application of heat and pressure, via the Interchain Transesterification Reaction (ITR). ITR can also be used for reduction in void volume and healing of microcracks. Thus, ATSP resin systems provide a unique intrinsic repair mechanism compared to any other thermosetting systems in use today. Preliminary studies on measurement of residual stresses for ATSP/C composites indicate that the stresses induced are much lower than that in epoxy/C composites. Thermal fatigue testing suggests that ATSP shows better resistance to microcracking compared to epoxy resins.