Solderjet bumping technique used to manufacture a compact and robust green solid-state laser

Solder-joining using metallic solder alloys is an alternative to adhesive bonding. Laser-based soldering processes are especially well suited for the joining of optical components made of fragile and brittle materials such as glasses, ceramics and optical crystals due to a localized and minimized input of thermal energy. The Solderjet Bumping technique is used to assemble a miniaturized laser resonator in order to obtain higher robustness, wider thermal conductivity performance, higher vacuum and radiation compatibility, and better heat and long term stability compared with identical glued devices. The resulting assembled compact and robust green diode-pumped solid-state laser is part of the future Raman Laser Spectrometer designed for the Exomars European Space Agency (ESA) space mission 2018.

An Approach to Manage Reconfigurations and Reduce Area Cost in Hard Real-Time Reconfigurable Systems

This article presents a methodology to build real-time reconfigurable systems that ensure that all the temporal constraints of a set of applications are met, while optimizing the utilization of the available reconfigurable resources. Starting from a static platform that meets all the real-time deadlines, our approach takes advantage of run-time reconfiguration in order to reduce the area needed while guaranteeing that all the deadlines are still met. This goal is achieved by identifying which tasks must be always ready for execution in order to meet the deadlines, and by means of a methodology that also allows reducing the area requirements.