Strength of the Iberian intraplate lithosphere: Cenozoic deformations and seismicity

Previous studies about the strength of the lithosphere in the center of Iberia fail to resolve the depth of earthquakes because of the rheological uncertainties. Therefore, new contributions are considered (the crustal structure from a density model) and several parameters (tectonic regime, mantle rheology, strain rate) are checked in this paper to properly examine the role of lithospheric strength in the intraplate seismicity and the Cenozoic evolution. The strength distribution with depth, the integrated strength, the effective elastic thickness and the seismogenic thickness have been calculated by a finite element modelling of the lithosphere across the Central System mountain range and the bordering Duero and Madrid sedimentary basins. Only a dry mantle under strike-slip/extension and a strain rate of 10-15 s-1, or under extension and 10-16 s-1, causes a strong lithosphere. The integrated strength and the elastic thickness are lower in the mountain chain than in the basins. This heterogeneity has been maintained since the Cenozoic and determine the mountain uplift and the biharmonic folding of the Iberian lithosphere during the Alpine deformations. The seismogenic thickness bounds the seismic activity in the upper–middle crust, and the decreasing crustal strength from the Duero Basin towards the Madrid Basin is related to a parallel increase in Plio–Quaternary deformations and seismicity. However, elasto–plastic modelling shows that current African–Eurasian convergence is resolved elastically or ductilely, which accounts for the low seismicity recorded in this region.

Optimized square Fresnel zone plates for microoptics applications

Polygonal Fresnel zone plates with a low number of sides have deserved attention in micro and nanoptics, because they can be straightforwardly integrated in photonic devices, and, at the same time, they represent a balance between the high-focusing performance of a circular zone plate and the easiness of fabrication at micro and nano-scales of polygons. Among them, the most representative family are Square Fresnel Zone Plates (SFZP). In this work, we propose two different customized designs of SFZP for optical wavelengths. Both designs are based on the optimization of a SFZP to perform as close as possible as a usual Fresnel Zone Plate. In the first case, the criterion followed to compute it is the minimization of the difference between the area covered by the angular sector of the zone of the corresponding circular plate and the one covered by the polygon traced on the former. Such a requirement leads to a customized polygon-like Fresnel zone. The simplest one is a square zone with a pattern of phases repeating each five zones. On the other hand, an alternative SFZP can be designed guided by the same criterion but with a new restriction. In this case, the distance between the borders of different zones remains unaltered. A comparison between the two lenses is carried out. The irradiance at focus is computed for both and suitable merit figures are defined to account for the difference between them.

Micromachined silicon lenses for terahertz applications

Silicon microlenses are a very important tool for coupling terahertz (THz) radiation into antennas and detectors in integrated circuits. They can be used in a large array structures at this frequency range reducing considerably the crosstalk between the pixels. Drops of photoresist have been deposited and their shape transferred into the silicon by means of a Reactive Ion Etching (RIE) process. Large silicon lenses with a few mm diameter (between 1.5 and 4.5 mm) and hundreds of μm height (between 50 and 350 μm) have been fabricated. The surface of such lenses has been characterized using Scanning Electron Microscopy (SEM) and Atomic Force Microscopy (AFM), resulting in a surface roughness of about ∼3 μm, good enough for any THz application. The beam profile at the focal plane of such lenses has been measured at a wavelength of 10.6 μm using a tomographic knife-edge technique and a CO2 laser.