Transient Temperature Distribution in a Sheet Metal by Low-Energy Laser Scanning

Low-energy laser-heating techniques are widely used in engineering applications such as, thinfilm deposition, surface treatment, metal forming and micro-structural pattern formation. In this paper,under the conditions of ignoring the thermo-mechanical coupling, a numerical simulation on the spatialand temporal temperature distribution in a sheet metal produced by the laser beam scanning in virtue of thefinite element method is presented. Both the three-dimensional transient temperature field and thetemperature evolution as a function of heat penetrating depth in the metal sheet are calculated. Thetemperature dependence of material properties was taken into account. It was shown that, after taking thetemperature dependence of the material absorbance effect into consideration, the temperature change ratealong the scanning direction and the temperature maximum were both increased.

人工神经网络技术在板料激光弯曲中的应用

基于人工神经网络基本理论,建立在板料激光弯曲中预测材料表面最高温度、弯曲角度的BP网络模型.借助于MATLAB仿真软件中的神经网络工具箱作为开发平台,将试验样本数据和经过试验验证的数值计算结果作为补充的样本数据用于BP网络的训练,利用训练好的BP网络对非线性的样本数据规律进行拟合,实现激光加工工艺参数的优化,为实际生产和加工提供有效的依据.

薄板激光弯曲温度场的数值模拟与校验

采用MSC.Marc非线性有限元软件，对薄板激光变曲过程中的温度场进行了数值模拟，得到了引起薄板激光弯曲形的温度场的变化规律。通过温度传感器测量与激光扫描线相对应的薄板下表面温度变化的规律来验证数值模拟的结果。模拟值与实测值基本吻合，表明数值模拟结果可作为激光加工工艺参数选择的依据。

板料激光弯曲试验

针对大飞机壁板用的铝合金板料AA6056进行激光弯曲过程的试验研究.试验选用厚度为1.0 mm和2.5 mm的薄板,采用多组不同的工艺参数进行对比分析.采用直径0.1 mm的镍铬.镍硅热电偶作为温度传感器,YOKOGAWA MV200型便携式记录仪测量板料表面的温度;使用MV.1300UM CCD拍摄板料激光弯曲变形的过程,通过自行开发的实时采集软件记录并进行图像处理,最终得到了板料激光弯曲变形过程的实测曲线.试验结果为该过程的数值模拟提供了更为精确的验证依据,为深入研究板料激光弯曲过程奠定了试验基础.

Numeric Calculation for Transient Thermal Stress Field in Wall-Shape Metal Part During Laser Direct Forming

In order to investigate the transient thermal stress field in wall-shape metal part during laser direct forming, a FEM model basing on ANSYS is established, and its algorithm is also dealt with. Calculation results show that while the wall-shape metal part is being deposited, in X direction, the thermal stress in the top layer of the wall-shape metal part is tensile stress and in the inner of the wall-shape metal part is compressive stress. The reason causing above-mentioned thermal stress status in the wall-shape metal part is illustrated, and the influence of the time and the processing parameters on the thermal stress field in wall-shape metal part is also studied. The calculation results are consistent with experimental results in tendency.

BONDING OF ALUMINA AND METAL USING BULK METALLIC GLASS FORMING ALLOY

Metal-alumina joints have found various practical applications in electronic devices and high technology industry. However, making of sound metal ceramic brazed couple is still a challenge in terms of its direct application in the industry. In this work we successfully braze copper with Al2O3 ceramic using Zr52.5Cu17.9Ni14.6Al10Ti5 bulk metallic glass forming alloy as filler alloy. The shear strength of the joints can reach 140 MPa, and the microstructrural analysis confirms a reliable chemical boning of the interface. The results show that the bulk metallic glass forming alloys with high concentration of active elements are prospective for using as filler alloy in metal-ceramic bonding.

Bonding Of Alumina And Metal Using Bulk Metallic Glass Forming Alloy

Metal-alumina joints have found various practical applications in electronic devices and high technology industry. However, making of sound metal ceramic brazed couple is still a challenge in terms of its direct application in the industry. In this work we successfully braze copper with Al2O3 ceramic using Zr52.5Cu17.9Ni14.6Al10Ti5 bulk metallic glass forming alloy as filler alloy. The shear strength of the joints can reach 140 MPa, and the microstructrural analysis confirms a reliable chemical boning of the interface. The results show that the bulk metallic glass forming alloys with high concentration of active elements are prospective for using as filler alloy in metal-ceramic bonding.

The plastic instability behaviour of laser-textured steel sheet

As the production of a new technique that can offer both good formability and high image clarity for texturing metal sheet, laser-textured sheet has attracted the attention of many manufacturers and users. Among the many subjects to be studied, plastic instability behaviour of the laser-textured sheet is one of most important to understand its ability in extending material ductility and to appropriately control this technique. Experimental investigations are carried out in this paper to study the macroscopic behaviour and microstructural mechanism of the laser-textured sheet, and comparison is made with the normal sheet taken from the same coil of metal sheet. It is demonstrated that, the difference in the behaviour of plastic instability obviously shows tendency to delay strain localization and the onset of thickness necking. Shear banding and internal void damage are spread to a much wider region in the sheet being laser-textured. The prestrained microcraters enforced on the surface of the textured sheet act as hardening spots, which are likely to share out deformation and inhibit the increasing rate of voiding, and eventually favouring the ductility of the material used.

Investigation on the Interaction of Laser Beam and Metal Powders Conveyed by Coaxial Powder Feeder

In order to investigate the transient thermal stress field in wall-shape metal part during laser direct forming, a FEM model basing on ANSYS is established, and its algorithm is also dealt with. Calculation results show that while the wall-shape metal part is being deposited, in X direction, the thermal stress in the top layer of the wall-shape metal part is tensile stress and in the inner of the wall-shape metal part is compressive stress. The reason causing above-mentioned thermal stress status in the wall-shape metal part is illustrated, and the influence of the time and the processing parameters on the thermal stress field in wall-shape metal part is also studied. The calculation results are consistent with experimental results in tendency.

Determination Of Interfacial Properties Between Metal Film And Ceramic Substrate With An Adhesive Layer

Peel test measurements and inverse analysis to determine the interfacial mechanical parameters for the metal film/ceramic system are performed, considering that there exist an epoxy interface layer between film and ceramic. In the present investigation, Al films with a series of thicknesses between 20 and 250 mu m and three peel angles of 90, 135 and 180 degrees are considered. A finite element model with the cohesive zone elements is used to simulate the peel test process. The finite element results are taken as the training data of a neural network in the inverse analysis. The interfacial cohesive energy and the separation strength can be determined based on the inverse analysis and peel experimental result. (C) 2008 Elsevier Ltd. All rights reserved.

Poly[[diaqua-mu-4,4 '-bipyridine-dinitratodi-mu-L-tyrosinato-dicopper(II)]: a chiral two-dimensional coordination polymer

The title compound, [Cu-2(C9H10NO3)(2)(NO3)(2)(C10H8N2)-(H2O)(2)](n), contains Cu-II atoms and L-tyrosinate (L-tyr) and 4,4'-bipyridine (4,4'-bipy) ligands in a 2:2:1 ratio. Each Cu atom is coordinated by one amino N atom and two carboxylate O atoms from two L-tyr ligands, one N atom from a 4,4'-bipy ligand, a monodentate nitrate ion and a water molecule in an elongated octahedral geometry. Adjacent Cu atoms are bridged by the bidentate carboxylate groups into a chain. These chains are further linked by the bridging 4,4'-bipy ligands, forming an undulated chiral two-dimensional sheet. O-H center dot center dot center dot O and N-H center dot center dot center dot O hydrogen bonds connect the sheets in the [100] direction. This study offers useful information for the engineering of chiral coordination polymers with amino acids and 4,4'-bipy ligands by considering the ratios of the metal ion and organic components.

Constructing mixed-metal coordination polymers from copper(II)-pyridinedicarboxylate metalloligands

In the mixed-metal complex catena-poly[bis[diaquasilver(I)] [bis[aquacopper(II)]-mu(3)-pyridine-2,5-dicarboxylato-2': 1: 1'kappa N-5,O-2: O-5: O-5, O-5'-mu-pyridine-2,5-dicarboxylato-2: 1 kappa(4) N, O-2: O-5, O-5'-disilver(I)-mu(3)-pyridine-2,5-dicarboxylato-1: 1': 2 '' kappa(5) O-5, O-5': O-5: N, O-2-mu pyridine-2,5-dicarboxylato-1': 20 ''kappa(4) O-5, O-5': N, O-2] hexahydrate], {[Ag(H2O)(2)][AgCu(C7H3NO4)(2)(H2O)] center dot 3H(2)O}(n), a square-pyramidal Cu-II center is coordinated by two N atoms and two O atoms from two pyridine-2,5-dicarboxylate (2,5-pydc) ligands and a water molecule, forming a [Cu(2,5-pydc)(2)-( H2O)](2-) metalloligand. One Ag I center is coordinated by five O atoms from three 2,5-pydc ligands and, as a result, the [Cu(2,5-pydc)(2)(H2O)](2-) metalloligands act as linkers in a unique mu(3)-mode connecting Ag-I centers into a one-dimensional anionic double chain along the [101] direction.

Networks with hexagonal circuits in co-ordination polymers of metal ions (Zn-II, Cd-II) with 1,1 '-(1,4-butanediyl)bis(imidazole)

Three new compounds, [ZnL1.5(H2O)(SO4)]. 6H(2)O 1, [ZnL1.5(H2O)(2)][NO3](2). 2H(2)O 2 and [CdL1.5(H2O)(2)(SO4)]. 4H(2)O 3 were obtained from self-assembly of the corresponding metal salts with 1,1'-(1,4-butanediyl)bis(imidazole) (L). In both 1 and 2 zinc ion is five-co-ordinated, showing a less-common trigonal bipyramidal co-ordination polyhedron, while cadmium ion of 3 is six-co-ordinated with a common octahedral arrangement. The sulfate ions of 1 and 3 are co-ordinated, however the nitrate ions of 2 are not. Each of the three compounds is composed of a (6, 3) network with the hexagonal smallest circuit containing six metal ions and six L; each L is co-ordinated to two metal ions, acting as a bridging ligand. In 1 the 2-D sheet of (6, 3) networks is interpenetrated in an inclined mode by symmetry related, identical sheets to give an interlocked 3-D structure, while the (6, 3) networks of both 2 and 3 stack in a parallel fashion to construct frameworks having channels.