投资时间序列的混沌分维研究

以某市固定资产投资同比增长数据为根据 ,利用混沌动力学中的相空间重构技术、幅值谱分析、庞加莱截面等方法进行分析 ,并计算其关联分维 ,得出其饱和嵌入维数为 5、关联分维约为 1 7,初步确定某市固定资产投资增长过程具有混沌特性 ,有 5个因素影响着某市固定资产投资的同比增长幅度 ,其中 2个因素起决定作用·该法可用于复杂的经济系统的分析研究·

Streamline topology and dilute particle dynamics in a Karman vortex street flow

Three types of streamline topology in a Karman vortex street flow are shown under the variation of spatial parameters. For the motion of dilute particles in the Karman vortex street flow, there exist a route of bifurcation to a chaotic orbit and more attractors in a bifurcation diagram for the proportion of particle density to fluid density. Along with the increase of spatial parameters in the flow field, the bifurcation process is suspended, as well as more and more attractors emerge. In the motion of dilute particles, a drag term and gravity term dominate and result in the bifurcation phenomenon.

Is there chaotic synchronization in space extend systems

Based on coupled map lattice (CML), the chaotic synchronous pattern in space extend systems is discussed. Making use of the criterion for the existence and the conditions of stability, we find an important difference between chaotic and nonchaotic movements in synchronization. A few numerical results are presented.

Molecular dynamics simulation of the role of dislocations in microcrack healing

The molecular dynamics method is used to simulate microcrack healing during heating or/and under compressive stress. A centre microcrack in Cu crystal would be sealed under compressive stress or by heating. The role of compressive stress and heating in crack healing was additive. During microcrack healing, dislocation generation and motion occurred. When there were pre-existing dislocations around the microcrack, the critical temperature or compressive stress necessary for microcrack healing would decrease, and, the higher the number of dislocations, the lower the critical temperature or compressive stress. The critical temperature necessary for microcrack healing depended upon the orientation of the crack plane. For example, the critical temperature for the crack along the (001) plane was the lowest, i.e. 770K.