Rearch on glass ceramics with negative CTE used as FBG substrate

SPIE; COS; Wuhan Municipal Government

Low Temperature Properties of PI/SiO_2 Nanocomposite Films

In this paper, the mechanical properties of PI/Si_O, nanocomposite hybrid films with different silica doping levels are experimentally studied at low temperature. Experimental results show that the coefficient of thermal expansion (CTE) of the PI/Si_O, nanocomposite hybrid films gradually reduces when the ambiance temperature is decreased. At the liquid nitrogen temperature (77 K), the CTE value is about five times less than that at room temperature (287 K). The measured CTEs of hybrid films greatly decrease when doped with inorganic silica, especially when the silica doping level is more than 1 wt.%. However, too high silica contents (more than 10 wt.%) can cause problem to disperse effectively and the specimens become quite opaque. Experimental results also show that the effects of the pre-applied stress levels can be neglected on the CTE testing. When the ambient temperature changes from 287 to 77 K, the measured average values of the films' ultimate tensile strength (UTS) and Young's modulus increase about 60 and 90%, respectively, while the breaking elongation decreases about 42%.

新型可控坍塌芯片连接技术(C4)及芯下材料力学性能研究进展

可控坍塌芯片连接 (C4)技术可以实现高速、高密度、小外形的封装 ,因此日渐得到关注和发展。然而 ,随着C4技术的普及 ,C4封装内由于芯片和基板间热膨胀系数 (CTE)的不匹配而引起的可靠性问题将日益突出 ,为此研究者在C4封装中引入芯下材料来提高C4封装的可靠性。文中侧重于制造工艺、可靠性以及最新进展对C4技术进行介绍 ,并且对C4技术中所用的芯下材料的力学性能及其对C4封装可靠性影响的研究现状进行评述

光纤光栅高温传感器的研究

提出了一种能够测量高温的光纤布拉格光栅（FBG）传感器结构。利用线膨胀系数和长度均不同的两种金属细杆和光纤布拉格光栅设计而成的传感头，能够将被测温度转化为光栅的应变，解调由应变引起的光栅波长漂移，即可得知待测的温度。目前在实验室实现了500℃的动态范围和1℃的温度分辨率，实验结果与理论分析一致。