3 resultados para Grinding process

em Chinese Academy of Sciences Institutional Repositories Grid Portal


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系统地研究了光学研磨过程中,磨料粒径、载荷大小以及机床转速对钕玻璃表面及亚表面损伤的影响。结果表明,机床转速和载荷基本不改变材料表面粗糙度,而较大载荷或较低机床转速产生较大的亚表面缺陷,表面粗糙度和亚表面缺陷缺陷深度基本与最大磨料粒径呈正比,载荷增倍使亚表面缺陷与表面粗糙度的常数比值增加0.05。研究结果为钕玻璃加工工艺改进提供了参考依据。

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We investigate the relation between the thickness of sapphire substrates and the extraction efficiency of LED. The increasing about 5% was observed in the simulations and experiments when the sapphire thickness changed from 100um to 200um. But the output power increasing is inconspicuous when the thickness is more than 200um. The structure on bottom face of sapphire substrates can enhance the extraction efficiency of GaN-based LED, too. The difference of output power between the flip-chip LED with smooth bottom surface and the LED with roughness bottom surface is about 50%, where only a common sapphire grinding process is used. But for those LEDs grown on patterned sapphire substrate the difference is only about 10%. Another kind of periodic pattern on the bottom of sapphire is fabricated by the dry etch method, and the output of the back-etched LEDs is improved about 50% than a common. case.

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提出了一种基于粒子群算法优化(PSO)的模糊控制器,对模糊控制器参数进行全局优化,以弥补模糊控制器参数在线调节方面的不足,并应用于球磨机粉磨系统的控制中。控制系统采用粒子群优化模糊控制器作为双闭环控制中的成品流量控制器,并在Matlab/Simulink进行的仿真分析中实现模糊控制器参数的在线调节。仿真结果表明,系统较好地实现了给定参考轨迹自适应跟踪,具有鲁棒性强、控制精度高等优点。