基于数字制造环境的可重构装配线仿真分析平台

以某汽车变速箱装配生产线制造系统为背景,应用多Agent制造及Holon制造模式改造传统装配生产线以提升其柔性与重构能力·针对基于agent与holon混合思想的可重构装配生产线的基础框架与实现等理论提供分析验证环境,提出应用数字制造技术构建面向可重构装配线的数字仿真验证平台·在分析面向重构装配线的仿真平台功能特征的基础上,构建了数字仿真验证平台的框架·研究了仿真平台开发中的系统集成、可视化仿真、可重构装配线性能分析等关键技术,最后给出了仿真平台的实例系统·

数字制造环境下的加工过程仿真验证技术研究

生产线数字制造环境是数字化工厂的核心 ,而加工过程的仿真与验证技术构成生产线数字系统的底层结构与制造过程数字化分析的主要内容。分析了目前加工过程在几何仿真与物理仿真方面的研究情况、研究方法与存在问题 ,就该项技术向生产线数字制造环境融合的关键技术 ,即综合设备数字样机的完整数字加工环境的建立及加工过程仿真与上层制造环境的信息集成等进行分析与研究

基于集成的机器人生产线数字化制造环境

提出建立集系统总体规划设计、设备工作过程仿真分析、生产线性能评价于一体的机器人生产线数字化设计验证系统,构建了系统基本框架及分析各部分的仿真实现特征。研究了系统集成的关键技术问题、各功能模块的特点及系统实现的技术问题。

A Method Based on Digital Image Analysis for Measuring the Strain Field of Deformed Sheet

对薄板成形应变场传统的测量方法进行了研究,指出了其不足和误差的来源,提出了数字图像分析法测量薄板成形中的应变场,对测量原理、新的测量方法对传统方法的改进,以及如何降低误差进行了介绍,指出数字图像分析法的前景,提出了改进意见。

Thermal Properties Measurement of Micro-Electromechanical System Sensors by Digital Moire Method

The thermal properties of a micro-electromechanical system sensor were analysed by a novel digital moire method. A double-layer micro-cantilever sensor (60 mu m long, 10 mu m width and 2 mu dm thick) was prepared by focused ion beam milling. A grating with frequency of 5000 lines mm- I was etched on the cantilever. The sensor was placed into a scanning electron microscope system with a high temperature device. The observation and recording of the thermal deformation of the grating were realised in real-time as the temperature rose from room temperature to 300 degrees C at intervals of 50 degrees C. Digital moire was generated by interference of the deformed grating and a digital virtual grating. The thermal properties including strain distribution of the sensor and the linear expansion coefficient of polysilicon were accurately measured by the phase-shifted moire patterns.

Laser drilling improving circuit board manufacturing

We reported here a novel technique for laser high speed drillings on Printed Circuit Boards (PCBs). A CNC solid laser based system is developed to drill through and blind vias as an alternative to mechanical drilling. The system employs an Acousto-Optic Q-switched Nd: YAG laser, a computer control system and an X-Y moving table which can handle up to 400 x 400 mm PCB. With a special designed cavity the laser system works in a pulsed operation in order to generate pulses with width down to 0.5 mu s and maximum peak power over 10kW at 10k repetition rate. Delivered by an improved optical beam transforming system, the focused laser beam can drill hobs including blind vias on PCBs with diameter in the range of 0.1 - 0.4 mm and at up to 300 - 500 vias per second (depending on the construction of PCBs). By means of a CNC X-Y moving system, laser pulses with pulse-to-pulse superior repeatability can be fired at desired location on a PCBs with high accuracy. This alternative technology for drilling through or blind vias on PCBs or PWBs (printed wiring boards) will obviously enhance the capability to printed boards manufacturing.

Gasdynamic Heating Process Suitable for Manufacturing Ethene by Pyrolysis

对乙烷裂解制造乙烯的非平衡过程进行了分析,为了获得高的乙烯产率,需准确控制裂解停留时间并提高裂解反应温度,探讨了目前工业生产中普遍采用的管式裂解炉的特性及局限,这种管式裂解炉的性能虽己接近完善,但仍不能满足裂解工艺需求,对几种利用激波控制加热方法生产乙烯的发明及其不足进行了评述,提出新颖的反向超声速射流混合加热方法,该方法能满足裂解制造乙烯的要求。