High-frequency characterization of packaging network in to-can photodiode modules

A simple method for analyzing the effects of TO packaging network on the high-frequency response of photodiode modules is presented. This method is established based on the relations of the scattering parameters of the packaging network, photodiode chip, and module. It is shown that the results obtained by this method agree well with those obtained by the conventional comparison method. The proposed method is much more convenient since only the electrical domain measurements are required. (C) 2008 Wiley Periodicals, Inc.

Frequency bandwidth estimation of TO packaging techniques for laser modules

Two simple methods for estimating the potential modulation bandwidth of TO packaging technique are presented. The first method is based upon the comparison of the measured frequency responses of the laser diodes and the TO laser modules, and the second is from the equivalent circuit for the test fixture, the TO header, the submount and the bonding wire. It is shown that the TO packaging techniques used in the experiments can potentially achieve a frequency bandwidth of over 10.5 GHz, and the two proposed methods give similar results.

Methods for characterization of packaging parasitics of semiconductor lasers

Two novel methods for analyzing the parasitics of packaging networks are proposed based on the relations between the scattering parameters of a semiconductor laser before and after packaging, and the experiments are designed and performed using our methods. It is found that the analysis results of the two methods are in good agreement with the measurements. Either of the two methods can provide an alternative approach for characterizing the packaging parasitics for semiconductor lasers, and both are convenient due to the developed measurement techniques. (c) 2005 Wiley Periodicals, Inc.

Silicon bench for passive coupling and packaging of high-frequency optoelectronic devices

Coupling and packaging have become decisive factors in the final performance and cost of high-frequency optoelectronic devices. Here, we report the design and successful fabrication of a silicon bench that integrates a V-groove and high-frequency coplanar waveguide (CPW) on the same high-resistivity silicon wafer as an effective optoelectronic packaging solution.

Potential frequency bandwidth estimation of TO packaging techniques for photodiode modules

Scattering parameters of photodiode chip, TO header and TO packaged module are measured, and the effects of TO packaging network on the high-frequency response of photodiode are investigated. Based on the analysis, the potential bandwidth of TO packaging techniques is estimated from the scattering parameters of the TO packaging network. Another method for estimating the potential bandwidth from the equivalent circuit for the TO packaged photodiode model is also presented. The results obtained using both methods show that the TO packaging techniques used in the experiments can potentially achieve a frequency bandwidth of 22 GHz.

Bonding-wire compensation effect on the packaging parasitics of optoelectronic devices

The effect of bonding-wire compensation on the capacitances of both the submount and the laser diode is demonstrated in this paper. The measured results show that the small-signal magnitude-frequency responses of the TO packaged laser and photodiode modules can be improved by properly choosing the length of the bonding wire. After packaging, the phase-frequency responses of the laser modules can also be significantly improved (c) 2005 Wiley Periodicals, Inc.

Microwave packaging for 10 Gb/s EML modulators - art. no. 60201O

A novel microwave packaging technique for 10Gb/s electro-absorption modulator integrated with distributed feedback laser (EML) is presented. The packaging parasitics and intrinsic parasitics are both well considered, and the packaging circuit was synthetically designed to compensate for the intrinsic parasitic of the chip. A butterfly-packaged EMI module has been successfully developed to prove that. The small-signal modulation bandwidth of the butterfly-packaged module is about 10 GHz. Optical fiber transmission experiments have shown that the module can be used for 10Gb/s optical transmission system. After transmission through 40km,. the power penalty is less than 1 dBm at a bit-error-rate of 10-12.

Design and Fabrication of Low-microwave loss Coplannar Waveguide and precise V groove on Silicon Substrate for Optoelectronic Packaging - art. no. 601938

Optoelectronic packaging has become a most important factor that influences the final performance and cost of the module. In this paper, low microwave loss coplanar waveguide(CPW) on high resistivity silicon(HRS) and precise V groove in silicon substrate were successfully fabricated. The microwave attenuation of the CPW made on HRS with the simple process is lower than 2 dB/cm in the frequency range of 0 similar to 26GHz, and V groove has the accuracy in micro level and smooth surface. These two techniques built a good foundation for high frequency packaging and passive coupling of the optoelectronic devices. Based on these two techniques, a simple high resistivity silicon substrate that integrated V groove and CPW for flip-chip packaging of lasers was completed. It set a good example for more complicate optoelectronic packaging.

The effect of Fabry-Perot interference on the packaging of SOI-based optoelectronic devices

During the packaging of optoelectrome device, a problem always met is the instability of output power. The main effect causing this problem, Fabry-Perot interference, is discussed in this paper. Both theoretical analysis and experimental test are carried out and in good agreement. As an example of avoiding the disadvantage of Fabry-Perot interference, the packaging process of Silicon-on-Insulator (SOI) based Variable Optical Attenuator(VOA) is shown at last.

Investigation of Interactions between Two Monoclonal Antibodies and SARS Virus with a Label-Free Protein Array

The investigation of interactions between two kinds of monoclonal antibodies and SARS virus with a label-free protein array technique were presented in this paper. The performance consists of three parts: a surface modification for ligand immobilization/surface, a protein array fabrication with an integrated microfluidic system for patterning, packaging and liquid handling, and a protein array reader of imaging ellipsometer. This revealed the technique could be used as an immunoassay for qualitative and quantitative detection as wen as kinetic analysis of biomolecule interaction.

大功率半导体激光器阵列的封装技术

半导体激光器阵列的应用已基本覆盖了整个光电子领域，成为当今光电子科学的重要技术。本文介绍了半导体激光器阵列的发展及其应用。着重阐述了半导体激光器阵列的封装技术——热沉材料的选择及其结构优化、热沉与半导体激光器阵列之间的焊接技术、半导体激光器阵列的冷却技术、与光纤的耦合技术等。

连续波工作大功率半导体激光器阵列的温度分布

用Ansys软件模拟了大功率半导体激光器阵列的稳态温度分布，并对自行研制的半导体激光器阵列的温度变化进行了测试，结果表明理论计算与实验结果基本吻合。该模拟结果对大功率半导体激光器阵列的封装设计具有现实的指导意义。

Dynamic optical coupled system employing even-numbered Dammann gratings

Dammann gratings are well known for their ability to generate arrays of Lmiform-intensity beams from an incoming monochromatic beam. We apply the even-numbered Dammann grating to achieve dynamic optical coupled technology. A 1 x N dynamic optical coupled system is developed by employing two complementary even-numbered Dammann gratings. With this system we can achieve a beam splitter and combiner as a switch between them according to the relative shift between the gratings. Also, this system is a preferable approach in integral packaging. More importantly, this device has the potential to be applied to the splitting of a large array, e.g., 8 x 16 array and 64 x 64 array, which is difficult to be realized with conventional splitting methods. We experimentally demonstrated a 1 x 8 coupler at the wavelength of 1550 nm. Furthermore we analyze the effects of the alignment errors between gratings and the wavelength-dependent error on efficiency and uniformity. The experimental results and the influence of alignment error and wavelength-dependent error are analyzed in detail. (c) 2006 Optical Society of America.

基于达曼光栅的动态光耦合器

提出了一种基于达曼光栅的动态光耦合器,通过控制装置中达曼光栅位移参量,可实现入射光束的分束或合束以及两者之间的动态转换。适当选择达曼光栅类型可实现任意N×M的动态光耦合。实验中以1550 nm光波长为例,对1×8达曼动态光耦合器进行测量,测得其实现光开关功能时插入损耗为0.43 dB,实现光分束功能时均匀性达到0.03,单路插入损耗均值为10.5 dB。该实验装置易于调节、体积小、能耗低,且关键元件达曼光栅制作工艺成熟,易于批量化生产。特别是在实现中大规模光交换阵列时,该方案就具有更明显的优越性,有实用意