Dendrimer films as matrices for electrochemical fabrication of novel gold/palladium bimetallic nanostructures

Electrodeposition of novel Au/Pd bimetallic nanostructures with dendrimer films as matrices has been reported. The dendrimers exhibited highly open structures arising from protonation of amines and this made them have good penetrability for solvent molecules. The unique properties of dendrimers obviously affected the morphologies and compositions of deposited bimetallic nanostructures compared with those from unmodified surfaces. Field-emitted scanning electron microscopy, energy dispersive spectroscopy, X-ray photoelectron spectroscopy and UV-vis spectroscopy were used to characterize these nanostructures.

Synthesis and assembly of Au-Pt bimetallic nanoparticles

Au-Pt bimetallic nanoparticles (NPs) were synthesized by reducing the mixture of HAuCl4 and K2PtCl6 with ethanol in the presence of cinnamic acid (C6H5CHCHCO2H, CA) through a thermal process. It was found that the isolated NPs could gradually self-assemble into chain-like structures, ultimately to 3-dimensional network nanostructures by adjusting the molar ratio of CA to K2PtCl6. Energy-dispersive Spectroscopy, X-ray photoelectron spectroscopy and X-ray diffraction was used to confirm the formation of Au-Pt bimetallic nanostructures.

Synthesis and assembly of Au-Pt bimetallic nanoparticles

Au-Pt bimetallic nanoparticles (NPs) were synthesized by reducing the mixture of HAuCl4 and K2PtCl6 with ethanol in the presence of cinnamic acid (C6H5CHCHCO2H, CA) through a thermal process. It was found that the isolated NPs could gradually self-assemble into chain-like structures, ultimately to 3-dimensional network nanostructures by adjusting the molar ratio of CA to K2PtCl6. Energy-dispersive Spectroscopy, X-ray photoelectron spectroscopy and X-ray diffraction was used to confirm the formation of Au-Pt bimetallic nanostructures. It was worthwhile noting that the bimetallic NPs with the novel structures prepared by our method exhibited an attractive catalytic activity for the hydrogen evolution reaction in an acidic solution.

Polyamidoamine dendrimers-assisted electrodeposition of gold-platinum bimetallic nanoflowers

Novel Au-Pt bimetallic flower nanostructures fabricated on a polyamidoamine dendrimers-modified surface by electrodeposition are reported. These polyamidoamine dendrimers were stable, and they assisted the formation of Au-Pt bimetallic nanoflowers during the electrodeposition process. These nanoflowers were characterized by field-emitted scanning electron microscopy (FE-SEM), energy-dispersive spectroscopy (EDS), X-ray photoelectron spectroscopy (XPS), X-ray diffraction, and electrochemical methods. FE-SEM images showed that the bimetallic nanoflower included two parts: the "light" and the "pale" part. The two parts consisted of many small bimetallic nanoparticles, which was attributed to the progressive nucleation process. Moreover, the "light" part contained more bimetallic nanoparticles. The morphologies of bimetallic nanoflowers depended on the electrodeposition time and potential and the layer number of assembled dendrimers. The average size of nanoflowers increased with the increase in electrodeposition time. The layer number of assembled dendrimers obviously affected the size and morphologies of the "pale" parts of deposited nanoflowers.

One-pot synthesis and characterization of novel silver-gold bimetallic nanostructures with hollow interiors and bearing nanospikes

One-pot preparation of shell-type silver-gold bimetallic nanostructures with hollow interiors and bearing nanospikes, based on colloid seed-engaged replacement reaction and colloid-mediated deposition reactions, has been reported. Heating-induced evolution of Ag-Au bimetallic nanoshells can lead to spontaneous production of nanospikes on the colloid surface. The hollow interior structure and bimetallic nature of the as-prepared colloids are characterized by transmission electron microscopy (TEM), UV-vis spectroscopy, and X-ray photoelectron spectroscopy (XPS).

Surface structure and reaction performances of highly dispersed and supported bimetallic catalysts

Surface structures of Pt-Sn and Pt-Fe bimetallic catalysts have been investigated by means of Mossbauer spectroscopy, Pt-L-III -edge EXAFS and H-2-adsorption. The results showed that the second component, such as Sn or Fe, remained in the oxidative state and dispersed on the gamma-Al2O3 surface after reduction, while Pt was completely reduced to the metallic state and dispersed on either the metal oxide surface or the gamma-Al2O3 surface. By correlating the distribution of Pt species on different surfaces with the reaction and adsorption performances, it is proposed that two kinds of active Pt species existed on the surfaces of both catalysts, named M-1 sites and M-2 sites. M-1 sites are the sites in which Pr directly anchored on the gamma-Al2O3 surface, while M-2 sites are those in which Pt anchored on the metal oxide surface. M-1 sites are favorable for low temperature H-2 adsorption, and responsible for the hydrogenolysis reaction and carbon deposition, while M-2 sites which adsorb more H-2 at higher temperature, are more resistant to the deactivation due to less carbon deposition, and provide major contribution to the dehydrogenation reaction.

MC3T3-E1 Osteoblasts Adhesion to Micropatterned Surfaces

细胞在材料表面的黏附对细胞的增殖和分化起重要作用。格式化表面提供了对细胞在基底的空间分布和动附进行控制的方法。利用微制作形成的格式模板,分别以微接触转印法和微流道法形成格式化表面,使MC3T3-E1成骨细胞以一定的格式黏附于表面上。在微接触转印法形成的含二氯二甲基硅烷(DMS)的疏水区域和不含DMS的亲水区域相间隔的表面,细胞优先在亲水区域黏附。在微流道法形成的胶原和白蛋白格式化表面,细胞优先黏附于含胶原区域。结果还表明微格式化表面可以用于研究表面的物理化学性质对细胞的黏附等功能的影响。

Surface Stress Induced By Adatoms Adsorption On Solid Surfaces

Based on the statistical thermodynamics theory, a theoretical model of adsorbate induced surface stress of adatoms adsorption on solid surface is presented. For the low coverage, the interaction between the adsorbed molecules is entirely negligible and the adsorption induced surface stress is found to be the function of the coverage and the adsorption energy change with strain. For the high coverage, the adsorbate-adsorbate interaction contributes to the adsorption-induced surface stress effectively. In the case of carbon adsorption on the Ni(100) surface, the value of 0.5 is obtained as a characteristic coverage to decide whether to take the interaction between the adsorabtes into consideration and the results also show that the adsorption induces a compressive surface stress.

An Electrowetting Model For Rough Surfaces Under Low Voltage

Electrowetting is one of the most effective methods to enhance wettability. A significant change of contact angle for the liquid droplet can result from the surface microstructures and the external electric field, without altering the chemical composition of the system. During the electrowetting process on a rough surface, the droplet exhibits a sharp transition from the Cassie-Baxter to the Wenzel regime at a low critical voltage. In this paper, a theoretical model for electrowetting is put forth to describe the dynamic electrical control of the wetting behavior at the low voltage, considering the surface topography. The theoretical results are found to be in good agreement with the existing experimental results. (c) Koninklijke Brill NV, Leiden, 2008.

Adsorption of His-tagged peptide to Ni, Cu and Au (100) surfaces: Molecular dynamics simulation

Molecular dynamics (MD) simulations are performed to study the interaction of His-tagged peptide with three different metal surfaces in explicit water. The equilibrium properties are analyzed by using pair correlation functions (PCF) to give an insight into the behavior of the peptide adsorption to metal surfaces in water solvent. The intermolecular interactions between peptide residues and the metal surfaces are evaluated. By pulling the peptide away from the peptide in the presence of solvent water, peeling forces are obtained and reveal the binding strength of peptide adsorption on nickel, copper and gold. From the analysis of the dynamics properties of the peptide interaction with the metal surfaces, it is shown that the affinity of peptide to Ni surface is the strongest, while on Cu and An the affinity is a little weaker. In MD simulations including metals, the His-tagged region interacts with the substrate to an extent greater than the other regions. The work presented here reveals various interactions between His-tagged peptide and Ni/Cu/Au surfaces. The interesting affinities and dynamical properties of the peptide are also derived. The results give predictions for the structure of His-tagged peptide adsorbing on three different metal surfaces and show the different affinities between them, which assist the understanding of how peptides behave on metal surfaces and of how designers select amino sequences in molecule devices design. (c) 2007 Elsevier Ltd. All rights reserved.

Thermophoretic deposition of particles onto cold surfaces of bodies in two-dimensional and axisymmetric flows

The problem of thermophoretic deposition of small particles onto cold surfaces is studied in two-dimensional and axisymmetric flow fields. The particle concentration equation is solved numerically together with the momentum and energy equations in the laminar boundary layer with variable density effect included. It is shown explicitly to what extent the particle concentration and deposition rate at the wall are influenced by the density variation effect for external flow past bodies. The general numerical procedure is given for two-dimensional and axisymmetric cases and is illustrated with examples of thermophoretic deposition of particles in flows past a cold cylinder and a sphere.

Thermophoretic deposition of particles in gas flowing over cold surfaces

Some of the calculated parameters show a maximum value for specimens heat-treated at about 100°C. The tensile strength is, for instance, substantially higher for specimens shock-heated at 100°C than for non-heated ones. Another striking feature is the initial decrease of the diameter observed in specimens heat-treated at 600°C when loaded in uniaxial compression. Both optical microscopy and DSA experiments reveal a large increase in microcracking when the heat-treatment temperature exceeds 300°C.