Perfectly Hydrophobic Silicone Nanofiber Coatings: Preparation from Methyltrialkoxysilanes and Use as Water-Collecting Substrate

Perfectly hydrophobic (PHO) coatings consisting of silicone nanofibers have been obtained via a solution process using methyltrialkoxysilanes as precursors. On the basis of thermal gravimetry and differential thermal analysis (TG-DTA) and Fourier transform infrared spectroscopy (FTIR) results, the formula of the nanofibers was tentatively given and a possible growth mechanism of the nanofibers was proposed. Because of the low affinity between the coatings and the small water droplet, when using these coatings as substrate for collecting water vapor, the harvesting efficiency could be enhanced as compared with those from bare glass substrate for more than 50% under 25 degrees C and 60-90% relative humidity. By removing the surface methyl group by heat treatment or ultraviolet (UV) irradiation, the as-prepared perfectly hydrophobic surface can be converted into a superhydrophilic surface.

Bilayer Photoresist Insulator for High Performance Organic Thin-Film Transistors on Plastic Films

A novel bilayer photoresist insulator is applied in flexible vanadyl-phthalocyanine (VOPc) organic thin-film transistors (OTFTs). The micron-size patterns of this photoresisit insulator can be directly defined only by photolithography without the etching process. Furthermore, these OTFTs exhibit high field-effect mobility (about 0.8 cm(2)/Vs) and current on/off ratio (about 10(6)). In particular, they show rather low hysteresis (< 1 V). The results demonstrate that this bilayer photoresist insulator can be applied in large-area electronics and in the facilitation of patterning insulators.

Plastic zone in front of mode I crack in phenolphthalein polyether ketone

The plastic zone size and crack opening displacement of phenolphthalein polyether ketone (PEK-C) at various conditions were investigated. Both of them increase with increasing temperature (decreasing strain rate), i.e. yield stress steadily falls. Thus, the mechanism increasing the yield stress leads to increased constraint in the crack tip and a corresponding reduction in the crack opening displacement and the plastic deformation zone. The effect of the plastic deformation on the fracture toughness is also discussed.