550 resultados para YB-YAG


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本文讨论了激光晶体YAG:Er中Er~(3+)浓度效应所引起的晶体结构畸变,Er~(3+)离子高激发态(~4S_(3/2),~4F_(9/2)和~2H_(11/2)能级)的发光与浓度猝灭,~4I_(11/2)→I_(13/2)自饱和跃迁和激光波长红移的变化规律。

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本文讨论和分析了激光晶体YAG中Er~(3+)离子的激光上能级的~4S_(3/2)、~4I_(11/2)和~4I_(13/2)辐射跃迁的有关因素。

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本文给出了(Nd,Ce) :YAG 晶体激光性能的实验结果。与优质 Nd:YAG 晶体比较,我们现在得到的双掺晶体的静态脉冲激光效率提高了80%,激光阈值也显著降低,并具有抗紫外特性。双掺晶体激光性能的大幅度提高,说明在 YAG 晶体里 Ce~(3+)是 Nd~(3+)很好的敏化离子。

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本文合成了 Ba_2P_(rx)Ln_(1-x)Cu_3O_(7-δ)系列化合物,测量了它们的超导电性(Tc),当 x=0.1,T_c(L_n=Y)=78.5K,T_c(Yd)=88K、T_c(Nd)<77K。晶胞参数及正交畸变与组成的变化图表明稀土元素的离子半径影响显著,讨论了 Ba_2LnCu_3O(7-δ)体系中 Cu-O 链、Cu-O 层及 Cu~(3+)对超导电性的作用,当 Ln 的价态界于三、四价之间时(如Pr),四价的成份越多,Cu~(3+)的量就越少,虽然正交畸变很大,但 T_c 降低。

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分析了激光拼焊工艺特征,重点研究了在大功率固体激光器条件下,激光拼焊焊接工艺中激光功率、焊接速度和离焦量等因素变化对焊接质量的影响,得出了变化规律曲线。并系统全面地研究了目前汽车常用板材全厚度系列激光拼焊工艺,采用叠代寻优的方法获得到了适用于全自动激光拼焊生产线的优化工艺规范。

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A numerical analysis was carried out to study the moving boundary problem in the physical process of pulsed Nd-YAG laser surface melting prior to vaporization. The enthalpy method was applied to solve this two-phase axisymmetrical melting problem Computational results of temperature fields were obtained, which provide useful information to practical laser treatment processing. The validity of enthalpy method in solving such problems is presented.

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利用Nd:YAG脉冲激光在不锈钢表层合金化SiO_2纳米颗粒,在熔池最表层14μm深度范围内形成Si合金化区域,Si含量呈非均匀分布特征。表层为非晶相与奥氏体的双相组织,非昌相约不散分布并呈现特殊的环状形貌,中心为非晶,外侧为纳米尺度的超细柱晶及等轴晶。分析了非晶形成机制。

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In this paper, construction of hybrid device by integrating nanowires with F1-ATPase motors is described. The nickel nanowires and multi-segment nanowires, including gold and nickel, were fabricated by electrochemical deposition in nanoporous templates. The nickel nanowires functionalized by biotinylated peptide can be assembled directly onto F1-ATPase motors to act as the propellers. If the multicomponent nanowires, including gold and nickel, were selectively functionalized by the thiol group modified ssDNA and the synthetic peptide, respectively, the biotinylated F1- ATPase motors can be attached to the biotinylated peptide on nickel segment of the nanowires. Then, the multi-component nanowires can also be used as the propellers, and one may observe the rotations of the multi-component nanowires driven by F1-ATPase motors. Therefore, introduction of multiple segments along the length of a nanowire can lead to a variety of multiple chemical functionalities, which can be selectively bound to cells and special biomolecules. This method provides an insight for the construction of other hybrid devices with its controlling arrangement of different biomolecule on designed nanometer scale structures.

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Coatings were synthesized by laser alloying of zirconium (Zr) particles using a pulsed Nd:YAG laser on an austenite stainless steel. The distribution of Zr is uneven, in a depth of 18 mum just below the surface of the pool. The coating consisted of duplex microstructures, i.e. metallic glass (MG) and austenite. The MG formed in Zr-contained regions, with the Zr composition ranging from 7.6 to 16.8 at.%. The formation of the MG was attributed to an increase in glass-forming ability by Zr addition.

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实验研究了连续波Nd:YAG激光焊接速度、侧吹保护气流量和离焦量等参量对激光穿透焊接K418和42CrMo焊缝成形的影响。结果表明,K418与42CrMo激光穿透焊接有X形和T形两种典型的焊缝形貌,且焊缝形貌是不对称的。随着焊接速度的提高,焊接线能量降低,焊缝尺寸变小,且焊缝上部尺寸变化比下部尺寸变化慢,焊缝形貌由X形过渡到T形。当离焦量在瑞利长度范围内时,焊缝正面宽度变化很小;当离焦量超出瑞利长度范围时,在足够高的激光功率密度下,焊缝正面宽度快速增加。在激光功率为3kW,侧吹保护气角度为35°条件下,通过优化焊接速度、侧吹保护气流量和离焦量等参量可以得到最佳焊缝质量。

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We reported here a novel technique for laser high speed drillings on Printed Circuit Boards (PCBs). A CNC solid laser based system is developed to drill through and blind vias as an alternative to mechanical drilling. The system employs an Acousto-Optic Q-switched Nd: YAG laser, a computer control system and an X-Y moving table which can handle up to 400 x 400 mm PCB. With a special designed cavity the laser system works in a pulsed operation in order to generate pulses with width down to 0.5 mu s and maximum peak power over 10kW at 10k repetition rate. Delivered by an improved optical beam transforming system, the focused laser beam can drill hobs including blind vias on PCBs with diameter in the range of 0.1 - 0.4 mm and at up to 300 - 500 vias per second (depending on the construction of PCBs). By means of a CNC X-Y moving system, laser pulses with pulse-to-pulse superior repeatability can be fired at desired location on a PCBs with high accuracy. This alternative technology for drilling through or blind vias on PCBs or PWBs (printed wiring boards) will obviously enhance the capability to printed boards manufacturing.