Micropatterning of metal films coated on polymer surfaces with epoxy mold and its application to organic field effect transistor fabrication

In this letter, a simple and versatile approach to micropatterning a metal film, which is evaporated on a Si substrate coated with polymer, is demonstrated by the use of a prepatterned epoxy mold. The polymer interlayer between the metal and the Si substrate is found important for the high quality pattern. When the metal-polymer-Si sandwich structure is heated with the temperature below T-m but above T-g of the polymer, the plastic deformation of the polymer film occurs under sufficiently high pressure applied. It causes the metal to crack locally or weaken along the pattern edges. Further heating while applying a lower pressure results in the formation of an intimate junction between the epoxy stamp and the metal film. Under these conditions the epoxy cures further, ensuring adhesion between the stamp and the film. The lift-off process works because the adhesion between the epoxy and the metal film is stronger than that between the metal film and the polymer. A polymer field effect transistor is fabricated in order to demonstrate potential applications of this micropatterning approach.

Miscibility and crystallization behavior of PBT/epoxy blends

The miscibility and the isothermal crystallization kinetics for PBT/Epoxy blends have been studied by using differential scanning calorimetry, and several kinetic analyses have been used to describe the crystallization process. The Avrami exponents n were obtained for PBT/Epoxy blends. An addition of small amount of epoxy resin (3%) leads to an increase in the number of effective nuclei, thus resulting in an increase in crystallization rate and a stronger trend of instantaneous three-dimensional growth. For isothermal crystallization, crystallization parameter analysis showed that epoxy particles could act as effective nucleating agents, accelerating the crystallization of PBT component in the PBT/Epoxy blends. The Lauritzen-Hoffman equation for DSC isothermal crystallization data revealed that PBT/Epoxy 97/3 had lower nucleation constant K, than 100/0, 93/7, and 90/10 PBT/Epoxy blends. Analysis of the crystallization data of PBT/Epoxy blends showed that crystallization occurs in regime II. The fold surface free energy, sigma(e) = 101.7-58.0 x 10(-3) J/m(2), and work of chain folding, q = 5.79-3.30 kcal/mol, were determined. The equilibrium melting point depressions of PBT/Epoxy blends were observed and the Flory-Huggins interaction parameters were obtained.

Miscibility and hydrogen-bonding interactions in blends of carbon dioxide/epoxy propane copolymer with poly (p-vinylphenol)

The miscibility and hydrogen-bonding interactions of carbon dioxide and epoxy propane copolymer to poly(propylene carbonate) (PPC)/poly(p-vinylphenol) (PVPh) blends were investigated with differential scanning calorimetry (DSC), Fourier transform infrared (FTIR) spectroscopy and X-ray photoelectron spectroscopy (XPS). The single glass-transition temperature for each composition showed miscibility over the entire composition range. FTIR indicates the presence of strong hydrogen-bonding interassociation between the hydroxyl groups of PVPh and the oxygen functional groups of PPC as a function of composition and temperature. XPS results testify to intermolecular hydrogen-bonding interactions between the oxygen atoms of carbon-oxygen single bonds and carbon-oxygen double bonds in carbonate groups of PPC and the hydroxyl groups of PVPh by the shift of C-1s peaks and the evolution of three novel O-1s peaks in the blends, which supports the suggestion from FTIR analyses.

Cure processing modeling and cure cycle simulation of epoxy-terminated poly(phenylene ether ketone). V: Estimation of temperature distribution during cure process

A numerical method to estimate temperature distribution during the cure of epoxy-terminated poly(phenylene ether ketone) (E-PEK)-based composite is suggested. The effect of the temperature distribution on the selection of cure cycle is evaluated using a suggested alternation criterion. The effect of varying heating rate and thickness on the temperature distribution, viscosity distribution and distribution of the extent of cure reaction are discussed based on the combination of the here-established temperature distribution model and the previously established curing kinetics model and chemorheological model. It is found that, for a thin composite (<=10mm) and low heating rate (<=2.5K/min), the effect of temperature distribution on cure cycle and on the processing window for pressure application can be neglected. Low heating rate is of benefit to reduce the temperature gradient. The processing window for pressure application becomes narrower with increasing thicknesses of composite sheets. The validity of the temperature distribution model and the modified processing window is evaluated through the characterization of mechanical and physical properties of E-PEK-based composite fabricated according to different temperature distribution conditions.

Cure processing modeling and cure cycle simulation of epoxy-terminated poly(phenylene ether ketone) .3. Determination of the time of pressure application

The curing temperature, pressure, and curing time have significant influence on finished thermosetting composite products. The time of pressure application is one of the most important processing parameters in the manufacture of a thermosetting composite. The determination of the time of pressure application relies on analysis of the viscosity variation of the polymer, associated with curing temperature and curing time. To determine it, the influence of the time of pressure application on the physical properties of epoxy-terminated poly(phenylene ether ketone) (E-PEK)-based continuous carbon fiber composite was studied. It was found that a stepwise temperature cure cycle is more suitable for manufacture of this composite. There are two viscosity valleys, in the case of the E-PEK system, associated with temperature during a stepwise cure cycle. The analysis on the effects of reinforcement fraction and defect content on the composite sheet quality indicates that the width-adjustable second viscosity valley provides a suitable pressing window. The viscosity, ranging from 400 to 1200 Pa . s at the second viscosity valley, is the optimal viscosity range for applying pressure to ensure appropriate resin flow during curing process, which enables one to get a finished composite with optimal fiber volume fraction and low void content. (C) 1997 John Wiley & Sons, Inc.

Cure processing modeling and cure cycle simulation of epoxy-terminated poly(phenylene ether ketone) .4. Cure cycle simulation

Epoxy-terminated poly(phenylene ether ketone) (E-PEK) developed in this Institute is a candidate matrix resin for polymer composites as structural materials. Cure cycles for this reaction system were simulated according to the previously established processing model. It is found that for the E-PEK system, the curing process is best completed by a stepwise cure cycle comprising two isothermal processes at different temperatures, T-1 and T-2. The cure cycles over a wide range of processing parameters simulated, based on the established processing model, indicate that the processing window is width-adjustable. Analysis of the mechanical properties of the composite sheets showed that the simulated cure cycles are acceptable and reliable. (C) 1997 John Wiley & Sons, Inc.

Morphologies and mechanical properties of epoxy resins toughened by hydroxyl-terminated butadiene-acrylonitrile copolymer

The morphologies and mechanical properties of epoxy resins toughened by hydroxyl-terminated butadiene-acrylonitrile copolymer (HTBN) and cured with hexahydrophthalic anhydride were studied, The results show that the level of HTBN in epoxy resin, content of acrylonitrile in HTBN and curing temperature influence the morphology and then influence the mechanical properties of cured epoxy resin.

Cure processing modeling and cure cycle simulation of epoxy-terminated poly(phenylene ether ketone) .1. DSC characterization of curing reaction

The curing reaction process of epoxy-terminated poly(phenylene ether ketone) (E-PEK) with 4,4'-diaminodiphenyl sulfone (DDS) and hexahydrophthalic acid anhydride (Nadic) as curing agents was investigated using isothermal differential scanning calorimetry (IDSC) and nonisothermal differential scanning calorimetry (DDSC) techniques. It was found that the curing reactions of E-PEK/DDS and E-PEK/Nadic are nth-order reactions but not autoaccelerating. The experimental results revealed that the curing reaction kinetics parameters measured from IDSC and DDSC are not equivalent. This means that, in the curing reaction kinetics model for our E-PEK system, both isothermal and nonisothermal reaction kinetics parameters are needed to describe isothermal and nonisothermal curing processes, The isothermal and nonisothermal curing processes were successfully simulated using this model. A new extrapolation method was suggested. On the basis of this method the maximum extent of the curing reaction (A(ult)) that is able to reach a certain temperature can be predicted. The A(ult) for the E-PEK system estimated by the new method agrees well with the results obtained from another procedure reported in the literature. (C) 1997 John Wiley & Sons, Inc.

Cure processing modeling and cure cycle simulation of epoxy-terminated poly(phenylene ether ketone) .2. Chemorheological modeling

Chemorheology and corresponding models for an epoxy-terminated poly(phenylene ether ketone) (E-PEK) and 4,4'-diaminodiphenyl sulfone (DDS) system were investigated using a differential scanning calorimeter (DSC) and a cone-and-plate rheometer. For this system, the reported four-parameter chemorheological model and modified WLF chemorheological model can only be used in an isothermal or nonisothermal process, respectively. In order to predict the resin viscosity variation during a stepwise temperature cure cycle actually used, a new model based on the combination of the four-parameter model and the modified WLF model was developed. The combined model can predict the resin viscosity variation during a stepwise temperature cure cycle more accurately than the above two models. In order to simplify the establishment of this model, a new five-parameter chemorheological model was then developed. The parameters in this five-parameter model can be determined through very few rheology and DSC experiments. This model is practicable to describe the resin viscosity variation for isothermal, nonisothermal, or stepwise temperature cure cycles accurately. The five-parameter chemorheological model has also successfully been used in the E-PEK systems with two other curing agents, i.e., the diamine curing agent with the addition of a boron trifluride monoethylamine (BF3-MEA) accelerator and an anhydride curing agent (hexahydrophthalic acid anhydride). (C) 1997 John Wiley & Sons, Inc.

SAXS measurements of the interface in polyacrylate and epoxy interpenetrating networks with fractal geometry

The interface thickness in two-component interpenetrating polymer networks (IPN) system based on polyacrylate and epoxy were determined using small-angle X-ray scattering (SAXS) in terms of the theory proposed by Ruland. The thickness was found to be nonexistent for the samples at various compositions and synthesized at variable conditions-temperature and initiator concentration. By viewing the system as a two-phase system with a sharp boundary, the roughness of the interface was described by fractal dimension, D, which slightly varies with composition and synthesis condition. Length scales in which surface fractals are proved to be correct exist for each sample and range from 0.02 to 0.4 Angstrom(-1). The interface in the present IPN system was treated as fractal, which reasonably explained the differences between Pored's law and experimental data, and gained an insight into the interaction between different segments on the interface. (C) 1997 Elsevier Science Ltd.

Use of SAXS to characterize the morphology of poly(polyethylene glycol diacrylate)/epoxy resin interpenetrating networks

Interpenetrating polymer networks (IPNs) have been synthesized from prepolymers that form miscible blends. All IPNs made from polyacrylate ((polyethylene glycol diacrylate), PEGDA) and epoxy (diglycidyl ether of bisphenol A, DGEBA) can be made in phase separated states by incorporating crosslinks. However, blends of these prepolymers, having a negative Flory-Huggins interaction parameter, are highly miscible. This indicates that formation of IPNs favours phase separation relative to blends. The microphase separation characteristics in the PEGDA/DGEBA IPNs were determined using smalt-angle X-ray scattering (SAXS). The Debye-Bueche and Guinier methods were used to calculate the correlation lengths of the segregated phases existing in the PEGDA/DGEBA IPNs. The results from SAXS showed that the size of the phase segregation zones changed with composition from about 50 to 100 Angstrom.

Dynamic mechanical properties of interpenetrating polymer networks based on polyacrylates and epoxy

Interpenetrating polymer networks (IPNs) based on polyacrylate (poly(polyethylene glycol diacrylate), PEGDA) and epoxy(diglycidyl ether of bisphenol A, DGEBA) were prepared simultaneously Dynamic mechanical properties of the SINs (simultaneous interpenetrating networks) with various compositions were studied. Enhanced mechanical properties were found in this case. From the point of view of pre-swollen networks, all of the PEGDA/DGEBA IPNs were composed of the individual pre-swollen networks. A micro-phase segregation system was produced in the SIN. Glass transition temperatures shifted inward, which was attributed to molecular packing effects or mutual-entanglements of molecular segments among the individual pre-swollen networks. In accordance with the additivity of properties, namely the parallel model, the entanglement density between the two polymer networks reached its maximum at 50/50 PEGDA/DGEBA IPN.

Synthesis and characterization of interpenetrating polymer networks based on polyacrylate and epoxy

The synthesis and properties of simultaneously interpenetrating networks (SINs) based on poly(polyethylene glycol diacrylate) (PEGDA) and epoxy (diglycidyl ether of bisphenol A, DGEBA) were studied. The effect of compositional variation on the morphology and properties of products was investigated. The swelling coefficient, densities, glass transition behavior, and thermal stability of these interpenetrating networks (IPNs) are discussed. Microphase separation morphological structures were found in all PEGDA/DGEBA IPNs. Decreased swelling ratios compared to the calculated swelling coefficients based on the weight additivity of the components were obtained after the formation of IPNs. Increased density and thermal stability were also obtained in these IPNs, implying the existence of interpenetration (topological entanglements) among the component networks.

CURE AND IONIC-CONDUCTIVITY OF A 2-COMPONENT EPOXY NETWORK POLYMER ELECTROLYTE

In order to raise the room temperature ionic conductivity and improve the mechanical strength of a PEO-based polymer electrolyte, a non-crystalline two-component epoxy network was synthesized by curing diglycidyl ether of polyethylene glycol (DGEPEG) with triglycidyl ether of glycerol (TGEG) in the presence of LiClO4 salt, which acts in this system as both a ring opening catalyst and a source of ionic carrier. The structure of the precursors, the curing process and the cured films have been characterized by C-13 NMR, IR, DSC and ionic conductivity measurement techniques. The electrolyte system exhibits an ionic conductivity as high as similar to 10(-5) S/cm at 25 degrees C and is mechanically self-supportable. The dependence of ionic conductivity was investigated as a function of temperature, salt content, MW of PEG segment in DGEPEG and the proportion of DGEPEG in DGEPEG/TGEG ratio.

IONIC-CONDUCTIVITY AND DYNAMIC MECHANICAL RELAXATION OF A 2-COMPONENT EPOXY NETWORK-LICLO4 ELECTROLYTE SYSTEM

The correlation between mechanical relaxation and ionic conductivity was investigated in a two-component epoxy network-LiClO4 electrolyte system. The network was composed of diglycidyl ether of polyethylene glycol (DGEPEG) and triglycidyl ether of glycerol (TGEG). The effects of salt concentration, molecular weight of PEG in DGEPEG and the proportion of DGEPEG (1000) in DGEPEG/TGEG ratio on the ionic conductivity and the mechanical relaxation of the system were studied. It was found that, among the three influential factors, the former reinforces the network chains, reduces the free volume fraction and thus increases the relaxation time of the segmental motion, which in turn lowers the ionic conductivity of the specimen. Conversely, the latter two increase the free volume and thus the chain flexibility, showing an opposite effect. From the iso-free-volume plot of the shift factor log at and reduced ionic conductivity, it is noted that the plot can be used to examine the temperature dependence of segmental mobility and seems to be useful to judge whether the incorporated salt has been dissociated completely. Besides, the ionic conductivity and relaxation time at constant reference temperature are linearly correlated with each other in all the three cases. This result gives an additional experimental confirmation of the coordinated motion model of the ionic hopping with the moving polymer chain segment, which is generally used to explain the ionic conduction in non-glassy amorphous polymer electrolytes.