Assessment of Microscale Test Methods of Peeling and Splitting along Surface of Thin-Film/Substrates

Peel test methods are assessed through being applied to a peeling analysis of the ductile film/ceramic substrate system. Through computing the fracture work of the system using the either beam bend model (BB model) or the general plane analysis model (GPA model), surprisingly, a big difference between both model results is found. Although the BB model can capture the plastic dissipation phenomenon for the ductile film case as the GPA model can, it is much sensitive to the choice of the peeling criterion parameters, and it overestimates the plastic bending effect unable to capture crack tip constraint plasticity. In view of the difficulty of measuring interfacial toughness using peel test method when film is the ductile material, a new test method, split test, is recommended and analyzed using the GPA model. The prediction is applied to a wedge-loaded experiment for Al-alloy double-cantilever beam in literature.

不等间距达曼型滤波器的飞秒脉冲时空变换整形与识别技术

研究了以不等间距达曼（Dammann）型滤波器为模板的飞秒激光时空变换与识别技术。优化设计出不等间距多脉冲达曼型滤波器，并在高斯光谱分布的模拟中讨论产生的超快时域多脉冲平均度和光谱平面上调制周期重复数的相关性。给出了频率分辨光开关法（FROG）技术识别超快时域两脉冲的实验结果。