Thermal characterization of SOI CMOS micro hot-plate gas sensors

This work reports on thermal characterization of SOI (silicon on insulator) CMOS (complementary metal oxide semiconductor) MEMS (micro electro mechanical system) gas sensors using a thermoreflectance (TR) thermography system. The sensors were fabricated in a CMOS foundry and the micro hot-plate structures were created by back-etching the CMOS processed wafers in a MEMS foundry using DRIE (deep reactive ion etch) process. The calibration and experimental details of the thermoreflectance based thermal imaging setup, used for these micro hot-plate gas sensor structures, are presented. Experimentally determined temperature of a micro hot-plate sensor, using TR thermography and built-in silicon resistive temperature sensor, is compared with that estimated using numerical simulations. The results confirm that TR based thermal imaging technique can be used to determine surface temperature of CMOS MEMS devices with a high accuracy. © 2010 EDA Publishing/THERMINIC.

Thermal imaging study of scalar transport in shallow wakes

The thermal imaging technique relies on the usage of infrared signal to detect the temperature field. Using temperature as a flow tracer, thermography is used to investigate the scalar transport in the shallow-water wake generated by an emergent circular cylinder. Thermal imaging is demonstrated to be a good quantitative flow visualization technique for studying turbulent mixing phenomena in shallow waters. A key advantage of the thermal imaging method over other scalar measurement techniques, such as the Laser Induced Fluorescence (LIF) and Planar Concentration Analysis (PCA) methods, is that it involves a very simple experimental setup. The dispersion characteristics captured with this technique are found to be similar to past studies with traditional measurement techniques. © 2012 Publishing House for Journal of Hydrodynamics.