17 resultados para thermal stress
em Cambridge University Engineering Department Publications Database
Resumo:
Flare tips are essential for safety. Maintenance is difficult and costly. Flare tips are subjected to high combustion temperatures, thermal cycling, oxidation and marine corrosion. Following a number of flare tip failures an in depth study by Imperial College was carried out into the failure of a flare tip from a UK platform, looking for service life improvement. Materials selection and design solutions were considered. The study considered alternative materials and concluded that materials selection was the smaller part of the answer; design changes can double service life. This study used failure investigation, high temperature experimental and thermo-mechanical modelling analysis. The modelling process simulated two common flaring conditions and correctly predicted the observed failure of initiation and crack propagation from holes used to bolt on flame stabilizing plates to the top of the flare. The calculated thermal stress and strains enabled the low cycle fatigue life and minimum creep life to be predicted. It was concluded that service life could be improved by replacing Incoloy alloy 800HT (UNS N08800) with Inconel alloy 625 (UNS N06625), an alloy with attractive mechanical properties and improved high temperature corrosion resistance. Repositioning or eliminating bolt holes can double service life. Copyright 2008, Society of Petroleum Engineers.
Resumo:
The efficiency of the injection and recombination processes in InGaN/GaN LEDs is governed by the properties of the active region of the devices, which strongly depend on the conditions used for the growth of the epitaxial material. To improve device quality, it is very important to understand how the high temperatures used during the growth process can modify the quality of the epitaxial material. With this paper we present a study of the modifications in the properties of InGaN/GaN LED structures induced by high temperature annealing: thermal stress tests were carried out at 900 °C, in nitrogen atmosphere, on selected samples. The efficiency and the recombination dynamics were evaluated by photoluminescence measurements (both integrated and time-resolved), while the properties of the epitaxial material were studied by Secondary Ion Mass Spectroscopy (SIMS) and Rutherford Backscattering (RBS) channeling measurements. Results indicate that exposure to high temperatures may lead to: (i) a significant increase in the photoluminescence efficiency of the devices; (ii) a decrease in the parasitic emission bands located between 380 nm and 400 nm; (iii) an increase in carrier lifetime, as detected by time-resolved photoluminescence measurements. The increase in device efficiency is tentatively ascribed to an improvement in the crystallographic quality of the samples. © 2013 SPIE.
Resumo:
A comprehensive study of the stress release and structural changes caused by postdeposition thermal annealing of tetrahedral amorphous carbon (ta-C) on Si has been carried out. Complete stress relief occurs at 600-700°C and is accompanied by minimal structural modifications, as indicated by electron energy loss spectroscopy, Raman spectroscopy, and optical gap measurements. Further annealing in vacuum converts sp3 sites to sp2 with a drastic change occurring after 1100°C. The field emitting behavior is substantially retained up to the complete stress relief, confirming that ta-C is a robust emitting material. © 1999 American Institute of Physics.
Resumo:
A brief analysis is presented of how heat transfer takes place in porous materials of various types. The emphasis is on materials able to withstand extremes of temperature, gas pressure, irradiation, etc., i.e. metals and ceramics, rather than polymers. A primary aim is commonly to maximize either the thermal resistance (i.e. provide insulation) or the rate of thermal equilibration between the material and a fluid passing through it (i.e. to facilitate heat exchange). The main structural characteristics concern porosity (void content), anisotropy, pore connectivity and scale. The effect of scale is complex, since the permeability decreases as the structure is refined, but the interfacial area for fluid-solid heat exchange is, thereby, raised. The durability of the pore structure may also be an issue, with a possible disadvantage of finer scale structures being poor microstructural stability under service conditions. Finally, good mechanical properties may be required, since the development of thermal gradients, high fluid fluxes, etc. can generate substantial levels of stress. There are, thus, some complex interplays between service conditions, pore architecture/scale, fluid permeation characteristics, convective heat flow, thermal conduction and radiative heat transfer. Such interplays are illustrated with reference to three examples: (i) a thermal barrier coating in a gas turbine engine; (ii) a Space Shuttle tile; and (iii) a Stirling engine heat exchanger. Highly porous, permeable materials are often made by bonding fibres together into a network structure and much of the analysis presented here is oriented towards such materials. © 2005 The Royal Society.
Resumo:
The finite element method is used to analyze the elastodynamic response of a columnar thermal barrier coating due to normal impact and oblique impact by an erosive particle. An assessment is made of the erosion by crack growth from preexisting flaws at the edge of each column: it is demonstrated that particle impacts can be sufficiently severe to give rise to columnar cracking. First, the transient stress state induced by the normal impact of a circular cylinder or a sphere is calculated in order to assess whether a 2D calculation adequately captures the more realistic 3D behavior. It is found that the transient stress states for the plane strain and axisymmetric models are similar. The sensitivity of response to particle diameter and to impact velocity is determined for both the cylinder and the sphere. Second, the transient stress state is explored for 2D oblique impact by a circular cylindrical particle and by an angular cylindrical particle. The sensitivity of transient tensile stress within the columns to particle shape (circular and angular), impact angle, impact location, orientation of the angular particle, and to the level of friction is explored in turn. The paper concludes with an evaluation of the effect of inclining the thermal barrier coating columns upon their erosion resistance. © 2011 The American Ceramic Society.
Resumo:
Metal based thermal microactuators normally have lower operation temperatures than those of Si-based ones; hence they have great potential for applications. However, metal-based thermal actuators easily suffer from degradation such as plastic deformation. In this study, planar thermal actuators were made by a single mask process using electroplated nickel as the active material, and their thermal degradation has been studied. Electrical tests show that the Ni-based thermal actuators deliver a maximum displacement of ∼20μm at an average temperature of ∼420°C, much lower than that of Si-based microactuators. However, the displacement strongly depends on the frequency and peak voltage of the pulse applied. Back bending was clearly observed at a maximum temperature as low as 240°C. Both forward and backward displacements increase with increasing the temperature up to ∼450°C, and then decreases with power. Scanning electron microscopy observation clearly showed that Ni structure deforms and reflows at power above 50mW. The compressive stress is believed to be responsible for Ni piling-up (creep), while the tensile stress upon removing the pulse current is responsible for necking at the hottest section of the device. Energy dispersive X-ray diffraction analysis revealed severe oxidation of the Ni-structure induced by Joule-heating of the current.
Resumo:
The successful utilization of an array of silicon on insulator complementary metal oxide semiconductor (SOICMOS) micro thermal shear stress sensors for flow measurements at macro-scale is demonstrated. The sensors use CMOS aluminum metallization as the sensing material and are embedded in low thermal conductivity silicon oxide membranes. They have been fabricated using a commercial 1 μm SOI-CMOS process and a post-CMOS DRIE back etch. The sensors with two different sizes were evaluated. The small sensors (18.5 ×18.5 μm2 sensing area on 266 × 266 μm2 oxide membrane) have an ultra low power (100 °C temperature rise at 6mW) and a small time constant of only 5.46 μs which corresponds to a cut-off frequency of 122 kHz. The large sensors (130 × 130 μm2 sensing area on 500 × 500 μm2 membrane) have a time constant of 9.82 μs (cut-off frequency of 67.9 kHz). The sensors' performance has proven to be robust under transonic and supersonic flow conditions. Also, they have successfully identified laminar, separated, transitional and turbulent boundary layers in a low speed flow. © 2008 IEEE.
Resumo:
Thermal barrier coatings with a columnar microstructure are prone to erosion damage by a mechanism of surface cracking upon impact by small foreign particles. In order to explore this erosion mechanism, the elastic indentation and the elastic-plastic indentation responses of a columnar thermal barrier coating to a spherical indenter were determined by the finite element method and by analytical models. It was shown that the indentation response is intermediate between that of a homogeneous half-space and that given by an elastic-plastic mattress model (with the columns behaving as independent non-linear springs). The sensitivity of the indentation behaviour to geometry and to the material parameters was explored: the diameter of the columns, the gap width between columns, the coefficient of Coulomb friction between columns and the layer height of the thermal barrier coating. The calculations revealed that the level of induced tensile stress is sufficient to lead to cracking of the columns at a depth of about the column radius. It was also demonstrated that the underlying soft bond coat can undergo plastic indentation when the coating comprises parallel columns, but this is less likely for the more realistic case of a random arrangement of tapered columns. © 2009 Elsevier B.V.
Resumo:
This paper presents an explicit time-marching formulation for the solution of the coupled thermal flow mechanical behavior of gas- hydrate sediment. The formulation considers the soil skeleton as a deformable elastoplastic continuum, with an emphasis on the effect of hydrate (and its dissociation) on the stress-strain behavior of the soil. In the formulation, the hydrate is assumed to deform with the soil and may dissociate into gas and water. The formulation is explicitly coupled, such that the changes in temperature because of energy How and hydrate dissociation affect the skeleton stresses and fluid (water and gas) pressures. This, in return, affects the mechanical behavior. A simulation of a vertical well within a layered soil is presented. It is shown that the heterogeneity of hydrate saturation causes different rates of dissociation in the layers. The difference alters the overall gas production and also the mechanical-deformation pattern, which leads to loading/ unloading shearing along the interfaces between the layers. Copyright © 2013 Society of Petorlleum Engineers.
Resumo:
Mechanical degradation is thought to be one of the causes of capacity fade within Lithium-Ion batteries. In this work we develop a coupled stress-diffusion model for idealized spherical storage particles, which is analogous to the development of thermal strains. We then non-dimensionalize the model and identify three important parameters that control the development of stress within these particles. We can therefore use a wide number of values for these parameters to make predictions about the stress responses of different materials. The maximum stress developed within the particle for different values of these parameters are plotted as stress maps. A two dimensional model of a battery was then developed, in order to study the effect of particle morphology. Copyright © 2012 by ASME.