Two-photon absorption and self-phase modulation in InGaAsP/InP multi-quantum-well waveguides

We report the first measurement of two-photon absorption (TPA) and self-phase modulation in an InGaAsP/InP multi-quantum-well waveguide. The TPA coefficient, β2, was found to be 60±10 cm/GW at 1.55 μm. Despite operating at 200 nm from the band edge, self-phase modulation as high as 8±2 rad was observed for 30-ps optical pulses at 3.8-W peak input power. A theoretical calculation indicates that this enhanced phase modulation is primarily due to bandfilling in the quantum wells and the free-carrier plasma effect.

Free-space locomotion with thread formation

The paper presents a new concept of locomotion for wheeled or legged robots through an object-free space. The concept is inspired by the behaviour of spiders forming silk threads to move in 3D space. The approach provides the possibility of variation in thread diameter by deforming source material, therefore it is useful for a wider coverage of payload by mobile robots. As a case study, we propose a technology for descending locomotion through a free space with inverted formation of threads in variable diameters. Inverted thread formation is enabled with source material thermoplastic adhesive (TPA) through thermally-induced phase transition. To demonstrate the feasibility of the technology, we have designed and prototyped a 300-gram wheeled robot that can supply and deform TPA into a thread and descend with the thread from an existing hanging structure. Experiment results suggest repeatable inverted thread formation with a diameter range of 1.1-4.5 mm, and a locomotion speed of 0.73 cm per minute with a power consumption of 2.5 W. © 2013 IEEE.

Large-payload climbing in complex vertical environments using thermoplastic adhesive bonds

Despite many approaches proposed in the past, robotic climbing in a complex vertical environment is still a big challenge. We present here an alternative climbing technology that is based on thermoplastic adhesive (TPA) bonds. The approach has a great advantage because of its large payload capacity and viability to a wide range of flat surfaces and complex vertical terrains. The large payload capacity comes from a physical process of thermal bonding, while the wide applicability benefits from rheological properties of TPAs at higher temperatures and intermolecular forces between TPAs and adherends when being cooled down. A particular type of TPA has been used in combination with two robotic platforms, featuring different foot designs, including heating/cooling methods and construction of footpads. Various experiments have been conducted to quantitatively assess different aspects of the approach. Results show that an exceptionally high ratio of 500% between dynamic payloads and body mass can be achieved for stable and repeatable vertical climbing on flat surfaces at a low speed. Assessments on four types of typical complex vertical terrains with a measure, i.e., terrain shape index ranging from -0.114 to 0.167, return a universal success rate of 80%-100%. © 2004-2012 IEEE.

In situ thermoplastic thread formation for robot built structures

We demonstrate autonomous construction of structures using a robot arm that can fabricate threads of TPA (Thermoplastic Adhesive) in free space on the fly. TPA has many important material properties that help to greatly simplify the otherwise complex task of building structures in complex environments. We present a model for the formation of TPA strings based on plastic deformation which also includes the temperature dependent material properties which change significantly as the thread is formed and cools. Experiments of drawing TPA show that drawing forces due to the viscosity of the TPA are more dominated by the speed of drawing than the changes in viscosity due to temperature. The load bearing capacity of individual strings is also modelled and measured and structures are built using the TPA strings which due to the adhesiveness can be anchored to a wide range surfaces as well as to other strings. © 2013 IEEE.