A packaging technique for silicon MEMS strain sensors on steel

A packaging technique suited to applying MEMS strain sensors realized on a silicon chip to a steel flat surface is described. The method is based on adhesive bonding of the silicon chip rear surface on steel using two types of glue normally used for standard piezoresistive strain sensors (Mbond200/ 600), using direct wire bonding of the chip to a Printed Circuit Board, also fixed on steel. In order to protect the sensor from the external environment, and to improve the MEMS performance, the silicon chip is encapsulated with a metal cap hermetically sealed-off under vacuum condition with a vacuum adhesive in which the bonding wires are also protected from possible damage. In order to evaluate the mechanical coupling of the silicon chip with the bar and thestress transfer extent to the silicon surface, commercial strain sensors have been applied on the chip glued on a steel bar in alaboratory setup able to generate strain by inflection, yielding a stress transfer around 70% from steel to silicon. © 2008 IEEE.

Fabrication and testing of a high resolution extensometer based on resonant MEMS strain sensors

A novel type of linear extensometer with exceptionally high resolution of 4 nm based on MEMS resonant strain sensors bonded on steel and operating in a vacuum package is presented. The tool is implemented by means of a steel thin bar that can be pre-stressed in tension within two fixing anchors. The extension of the bar is detected by using two vacuum-packaged resonant MEMS double- ended tuning fork (DETF) sensors bonded on the bar with epoxy glue, one of which is utilized for temperature compensation. Both sensors are driven by a closed loop self-oscillating transresistance amplifier feedback scheme implemented on a PCB (Printed Circuit Board). On the same board, a microcontroller-based frequency measurement circuit is also implemented, which is able to count the square wave fronts of the MEMS oscillator output with a resolution of 20 nsec. The system provides a frequency noise of 0.2 Hz corresponding to an extension resolution of 4 nm for the extensometer. Nearly perfect temperature compensation of the frequency output is achieved in the temperature range 20-35 C using the reference sensor. © 2011 IEEE.

High-resolution strain sensing on steel by Silicon-On-Insulator flexural resonators fabricated with chip-level vacuum packaging

This paper reports on the fabrication and characterization of high-resolution strain sensors for steel based on Silicon On Insulator flexural resonators manufactured with chip-level LPCVD vacuum packaging. The sensors present high sensitivity (120 Hz/μ), very high resolution (4 n), low drift, and near-perfect reversibility in bending tests performed in both tensile and compressive strain regimes. © 2013 IEEE.

The use of fibre optic sensors to monitor pipeline response to tunnelling

This paper describes the use of fibre optic sensing with Brillouin Optical Time-Domain Reflectometry (BOTDR) for near-continuous (distributed) strain monitoring of a large diameter pipeline, buried in predominantly granular material, subjected to a pipe jack tunnelling operation in London Clay. The pipeline, buried at shallow depth, comprises 4.6 m long sections connected with standard bell and spigot type joints, which connect to a continuous steel pipeline. In this paper the suitability of fibre optic sensing with BOTDR for monitoring pipeline behaviour is illustrated. The ability of the fibre optic sensor to detect local strain changes at joints and the subsequent impact on the overall strain profile is shown. The BOTDR strain profile was also used to infer pipe settlement through a process of double-integration and was compared to pipe settlement measurements. The close approximation of the measured pipe settlement provides further confidence in fibre optic strain sensing with BOTDR to investigate the intricacies of pipeline behaviour, pipe-soil interaction and interaction between pipe sections when subjected to ground movement. Copyright ASCE 2006.

Distributed optical fiber strain sensing in a secant piled wall

An optical fiber strain sensing technique, based on Brillouin Optical Time Domain Reflectometry (BOTDR), was used to obtain the full deformation profile of a secant pile wall during construction of an adjacent basement in London. Details of the installation of sensors as well as data processing are described. By installing optical fiber down opposite sides of the pile, the distributed strain profiles obtained can be used to give both the axial and lateral movements along the pile. Measurements obtained from the BOTDR were found in good agreement with inclinometer data from the adjacent piles. The relative merits of the two different techniques are discussed. © 2007 ASCE.

Investigation of biotin-streptavidin binding interactions using microcantilever sensors

We report the investigation of biotin-streptavidin binding interactions using microcantilever sensors. A symmetric cantilever construction is employed to minimize the effects of thermal drift and the control of surface chemistry on the backside of the cantilever is demonstrated to reduce the effects of non-specific binding interactions on the cantilever. Three structurally different biotin modified cantilever surfaces are used as a model system to study the binding interaction with streptavidin. The cantilever response to the binding of streptavidin on these biotin sensing monolayers is compared. The lowest detection limit of streptavidin using biotin-HPDP is found to be between 1 and 10 nM limited by the optical measurement setup. Surface characterization using quartz crystal microbalance (QCM) and high-resolution atomic force microscope (AFM) is used to benchmark the cantilever sensor response. In addition, the QCM and AFM studies reveal that the surface density of bound streptavidin on biotin modified surfaces was low, thereby implying that effects other than steric hindrance are responsible for defining cantilever response. (c) 2006 Elsevier B.V. All rights reserved.