An integrated service-device-technology roadmap for smart city development

Firms and other organizations use Technology Roadmapping (TRM) extensively as a framework for supporting research and development of future technologies and products that could sustain a competitive advantage. While the importance of technology strategy has received more attention in recent years, few research studies have examined how roadmapping processes are used to explore the potential convergence of products and services that may be developed in the future. The aim of this paper is to introduce an integrated roadmapping process for services, devices and technologies capable of implementing a smart city development R&D project in Korea. The paper applies a QFD (Quality Function Deployment) method to establish interconnections between services and devices, and between devices and technologies. The method is illustrated by a detailed case study, which shows how different types of roadmap can be coordinated with each other to produce a clear representation of the technological changes and uncertainties associated with the strategic planning of complex innovations. © 2012 Elsevier Inc.

Multi-field simulations and characterization of CMOS-MEMS high-temperature smart gas sensors based on SOI technology

This paper describes multiple field-coupled simulations and device characterization of fully CMOS-MEMS-compatible smart gas sensors. The sensor structure is designated for gas/vapour detection at high temperatures (>300 °C) with low power consumption, high sensitivity and competent mechanic robustness employing the silicon-on-insulator (SOI) wafer technology, CMOS process and micromachining techniques. The smart gas sensor features micro-heaters using p-type MOSFETs or polysilicon resistors and differentially transducing circuits for in situ temperature measurement. Physical models and 3D electro-thermo-mechanical simulations of the SOI micro-hotplate induced by Joule, self-heating, mechanic stress and piezoresistive effects are provided. The electro-thermal effect initiates and thus affects electronic and mechanical characteristics of the sensor devices at high temperatures. Experiments on variation and characterization of micro-heater resistance, power consumption, thermal imaging, deformation interferometry and dynamic thermal response of the SOI micro-hotplate have been presented and discussed. The full integration of the smart gas sensor with automatically temperature-reading ICs demonstrates the lowest power consumption of 57 mW at 300 °C and fast thermal response of 10 ms. © 2008 IOP Publishing Ltd.