Designing for validation of medical devices and equipment

Validation is important in the design, development and production of medical devices since effective and appropriate validation plays a vital role in defining the success of a product in both technical and economic terms. Regulations and quality standards lay out the requirements for product validation, but it is left to each individual manufacturer to establish and maintain their own validation procedures. More recently, there has also been a change of emphasis in the regulations and standards that encourage the integration of validation into the development process. However, this poses particular challenges to the manufacturer since there is a distinct lack of guidance to assist this integration. This workbook provides the first real guidance on good design practices for medical device development. It has been developed through extensive consultation with device manufacturers and analysis of regulatory requirements. The approach is intended to assist manufacturers in meeting the new regulations.

Sensors based on SAW and FBAR technologies

Over the last few years a number of sensing platforms are being investigated for their use in drug development, microanalysis or medical diagnosis. Lab-on-a-chip (LOC) are devices integrating more than one laboratory functions on a single device chip of a very small size, and typically consist of two main components: microfluidic handling systems and sensors. The physical mechanisms that are generally used for microfluidics and sensors are different, hence making the integration of these components difficult and costly. In this work we present a lab-on-a-chip system based on surface acoustic waves (for fluid manipulation) and film bulk acoustic resonators (for sensing). Coupling surface acoustic waves into liquids induces acoustic streaming and motion of micro-droplets, whilst it is well-known that bulk acoustic waves can be used to fabricate microgravimetric sensors. Both technologies offer exceptional sensitivity and can be fabricated from piezoelectric thin films deposited on Si substrates, reducing the fabrication time/cost of the LOC devices. © 2013 SPIE.