201 resultados para double antibody sandwich ELISA

em Cambridge University Engineering Department Publications Database


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In this paper a novel approach to the design and fabrication of a high temperature inverter module for hybrid electrical vehicles is presented. Firstly, SiC power electronic devices are considered in place of the conventional Si devices. Use of SiC raises the maximum practical operating junction temperature to well over 200°C, giving much greater thermal headroom between the chips and the coolant. In the first fabrication, a SiC Schottky barrier diode (SBD) replaces the Si pin diode and is paired with a Si-IGBT. Secondly, double-sided cooling is employed, in which the semiconductor chips are sandwiched between two substrate tiles. The tiles provide electrical connections to the top and the bottom of the chips, thus replacing the conventional wire bonded interconnect. Each tile assembly supports two IGBTs and two SBDs in a half-bridge configuration. Both sides of the assembly are cooled directly using a high-performance liquid impingement system. Specific features of the design ensure that thermo-mechanical stresses are controlled so as to achieve long thermal cycling life. A prototype 10 kW inverter module is described incorporating three half-bridge sandwich assemblies, gate drives, dc-link capacitance and two heat-exchangers. This achieves a volumetric power density of 30W/cm3.

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This paper presents a compact integrated power electronic module (IPEM) which seeks to overcome the volumetric power density limitations of conventional packaging technologies. A key innovation has been the development of a substrate sandwich structure which permits double side cooling of the embedded dies whilst controlling the mechanical stresses both within the module and at the heat exchanger interface. A 3-phase inverter module has been developed, integrating the sandwich structures with high efficiency impingement coolers, delink capacitance and gate drive units. Full details of the IPEM construction and electrical evaluation are given in the paper. © 2007 IEEE.

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The creep response of metallic foam sandwich beams in 3-point bend is investigated numerically for the case of a metallic foam core and two steel faces. The face sheets are treated as elastic, while the foam core is modeled by a viscoplastic extension of the Deshpande-Fleck yield surface. This power-law creeping constitutive law has been implemented within the commercial finite element code ABAQUS. It is found that the beams creep by a variety of competing mechanisms, depending upon the choice of material properties and the geometric parameters. A failure map is constructed and effect of rate dependence on the load-deflection curves is quantified, and compared against the available experimental data.

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Plastic collapse modes of sandwich beams have been investigated experimentally and theoretically for the case of an aluminum alloy foam with cold-worked aluminum face sheets. Plastic collapse is by three competing mechanisms: face yield, indentation and core shear, with the active mechanism depending upon the choice of geometry and material properties. The collapse loads, as predicted by simple upper bound solutions for a rigid, ideally plastic beam, and by more refined finite element calculations are generally in good agreement with the measured strengths. However, a thickness effect of the foam core on the collapse strength is observed for collapse by core shear: the shear strength of the core increases with diminishing core thickness in relation to the cell size. Limit load solutions are used to construct collapse maps, with the beam geometrical parameters as axes. Upon displaying the collapse load for each collapse mechanism, the regimes of dominance of each mechanism and the associate mass of the beam are determined. The map is then used in optimal design by minimizing the beam weight for a given structural load index.