Comparison of Image-Based and Time-of-Flight-Based Technologies for Three-Dimensional Reconstruction of Infrastructure

Image-based (i.e., photo/videogrammetry) and time-of-flight-based (i.e., laser scanning) technologies are typically used to collect spatial data of infrastructure. In order to help architecture, engineering, and construction (AEC) industries make cost-effective decisions in selecting between these two technologies with respect to their settings, this paper makes an attempt to measure the accuracy, quality, time efficiency, and cost of applying image-based and time-of-flight-based technologies to conduct as-built 3D reconstruction of infrastructure. In this paper, a novel comparison method is proposed, and preliminary experiments are conducted. The results reveal that if the accuracy and quality level desired for a particular application is not high (i.e., error < 10 cm, and completeness rate > 80%), image-based technologies constitute a good alternative for time-of-flight-based technologies and significantly reduce the time and cost needed for collecting the data on site.

Three-Dimensional Tracking of Construction Resources using an On-Site Camera System

Vision trackers have been proposed as a promising alternative for tracking at large-scale, congested construction sites. They provide the location of a large number of entities in a camera view across frames. However, vision trackers provide only two-dimensional (2D) pixel coordinates, which are not adequate for construction applications. This paper proposes and validates a method that overcomes this limitation by employing stereo cameras and converting 2D pixel coordinates to three-dimensional (3D) metric coordinates. The proposed method consists of four steps: camera calibration, camera pose estimation, 2D tracking, and triangulation. Given that the method employs fixed, calibrated stereo cameras with a long baseline, appropriate algorithms are selected for each step. Once the first two steps reveal camera system parameters, the third step determines 2D pixel coordinates of entities in subsequent frames. The 2D coordinates are triangulated on the basis of the camera system parameters to obtain 3D coordinates. The methodology presented in this paper has been implemented and tested with data collected from a construction site. The results demonstrate the suitability of this method for on-site tracking purposes.

Three-dimensional distribution of Al in high-k metal gate: Impact on transistor voltage threshold

The three-dimensional spatial distribution of Al in the high-k metal gates of metal-oxide-semiconductor field-effect-transistors is measured by atom probe tomography. Chemical distribution is correlated with the transistor voltage threshold (VTH) shift generated by the introduction of a metallic Al layer in the metal gate. After a 1050 °C annealing, it is shown that a 2-Å thick Al layer completely diffuses into oxide layers, while a positive VTH shift is measured. On the contrary, for thicker Al layers, Al precipitation in the metal gate stack is observed and the VTH shift becomes negative. © 2012 American Institute of Physics.

Three dimensional distributions of arsenic and platinum within NiSi contact and gate of an n-type transistor

Atom probe tomography was used to study the redistribution of platinum and arsenic atoms after Ni(Pt) silicidation of As-doped polycrystalline Si. These measurements were performed on a field-effect transistor and compared with those obtained in unpatterned region submitted to the same process. These results suggest that Pt and As redistribution during silicide formation is only marginally influenced by the confinement in microelectronic devices. On the contrary, there is a clear difference with the redistribution reported in the literature for the blanket wafers. Selective etching used to remove the non-reacted Ni(Pt) film after the first rapid heat treatment may induce this difference. © 2011 American Institute of Physics.