Design and process selection for joints in flexible materials

The application of high performance textiles has grown significantly in the last 10 to 15 years. Various research groups throughout the United Kingdom, such as the Department of Trade and Industry, have identified technical textiles as a field for future development. There is little design guidance for joining of flexible materials or general property models that can be applied to theses materials. This lack is due to the large diversity of properties, structures and resulting behaviours of the materials that are classified as "Flexible Materials". This dissertation explores the issues that are involved in characterising the materials at the fibre, bulk and textile levels. Different units of measurement are used for each stage of the manufacturing process of flexible materials and this disparity creates problems when trying to make general comparisons (e.g. comparing textiles to polymer films). Thus, a possible solution to this is to create selection charts that allow designers to compare the strength of materials for a given mass per unit area. A design tool was created using the Cambridge Engineering Selector (CES) software to enable the selection of joining processes for material. The tool is effective in selecting a reduced number of viable joining processes. Through case studies it was shown that designers are required to examine the selected processes (identified by the software) in greater detail - in particular the economics and geometry of the joint - in order to identify the optimum joining process.

Microfabrication of electrode patterns for high-frequency ultrasound transducer arrays.

High-frequency ultrasound is needed for medical imaging with high spatial resolution. A key issue in the development of ultrasound imaging arrays to operate at high frequencies (≥30 MHz) is the need for photolithographic patterning of array electrodes. To achieve this directly on 1-3 piezocomposite, the material requires not only planar, parallel, and smooth surfaces, but also an epoxy composite filler that is resistant to chemicals, heat, and vacuum. This paper reports, first, on the surface finishing of 1-3 piezocomposite materials by lapping and polishing. Excellent surface flatness has been obtained, with an average surface roughness of materials as low as 3 nm and step heights between ceramic/polymer of ∼80 nm. Subsequently, high-frequency array elements were patterned directly on top of these surfaces using a photolithography process. A 30-MHz linear array electrode pattern with 50-μm element pitch has been patterned on the lapped and polished surface of a high-frequency 1-3 piezocomposite. Excellent electrode edge definition and electrical contact to the composite were obtained. The composite has been lapped to a final thickness of ∼55 μm. Good adhesion of electrodes on the piezocomposite has been achieved and electrical impedance measurements have demonstrated their basic functionality. The array was then packaged, and acoustic pulse-echo measurements were performed. These results demonstrate that direct patterning of electrodes by photolithography on 1-3 piezocomposite is feasible for fabrication of high-frequency ultrasound arrays. Furthermore, this method is more conducive to mass production than other reported array fabrication techniques.