High temperature direct double side cooled inverter module for hybrid electric vehicle application

In this paper a novel approach to the design and fabrication of a high temperature inverter module for hybrid electrical vehicles is presented. Firstly, SiC power electronic devices are considered in place of the conventional Si devices. Use of SiC raises the maximum practical operating junction temperature to well over 200°C, giving much greater thermal headroom between the chips and the coolant. In the first fabrication, a SiC Schottky barrier diode (SBD) replaces the Si pin diode and is paired with a Si-IGBT. Secondly, double-sided cooling is employed, in which the semiconductor chips are sandwiched between two substrate tiles. The tiles provide electrical connections to the top and the bottom of the chips, thus replacing the conventional wire bonded interconnect. Each tile assembly supports two IGBTs and two SBDs in a half-bridge configuration. Both sides of the assembly are cooled directly using a high-performance liquid impingement system. Specific features of the design ensure that thermo-mechanical stresses are controlled so as to achieve long thermal cycling life. A prototype 10 kW inverter module is described incorporating three half-bridge sandwich assemblies, gate drives, dc-link capacitance and two heat-exchangers. This achieves a volumetric power density of 30W/cm3.

Compact double-side liquid-impingement-cooled integrated power electronic module

This paper presents a compact integrated power electronic module (IPEM) which seeks to overcome the volumetric power density limitations of conventional packaging technologies. A key innovation has been the development of a substrate sandwich structure which permits double side cooling of the embedded dies whilst controlling the mechanical stresses both within the module and at the heat exchanger interface. A 3-phase inverter module has been developed, integrating the sandwich structures with high efficiency impingement coolers, delink capacitance and gate drive units. Full details of the IPEM construction and electrical evaluation are given in the paper. © 2007 IEEE.

4-Channel polymeric optical bus module for board-level optical interconnections

A 4-channel polymeric optical bus module suitable for use in board-level interconnections is presented. Low-loss and low-crosstalk module performance is achieved, while -1 dB alignment tolerances better than ± 8 μm are demonstrated. © 2012 OSA.

4-channel polymeric optical bus module for board-level optical interconnections

A 4-channel polymeric optical bus module suitable for use in board-levelinterconnections is presented. Low-loss and low-crosstalk module performance is achieved, while-1 dB alignment tolerances better than ± 8 μm are demonstrated. © OSA 2012.

Evaluation of manufacturing techniques for a minifluidics demonstrator system

A multi-disciplinary team based at Heriot-Watt University and other Universities has been set up to tackle the design and manufacturing of lab-on-a-chip for industries as one of the demonstrators of the EPSRC Grand Challenge project "3D-Mintegration". The team focuses on the analysis of foetal genetic material extracted from maternal blood as a smart alternative to invasive prenatal testing such as amniocentesis. The first module of the microsystem envisaged achieves a separation of blood cells from plasma. This system permits the testing of different manufacturing techniques.

Nonautonomous elementary net systems and their application to programmable logic control

In this paper, a novel approach to Petri net modeling of programmable logic controller (PLC) programs is presented. The modeling approach is a simple extension of elementary net systems, and a graphical design tool that supports the use of this modeling approach is provided. A key characteristic of the model is that the binary sensory inputs and binary actuation outputs of the PLC are explicitly represented. This leads to the following two improvements: outputs are unambiguous, and interaction patterns are more clearly represented in the graphical form. The use of this modeling approach produces programs that are simple, lightweight, and portable. The approach is demonstrated by applying it to the development of a control module for a MonTech Positioning Station. © 2008 IEEE.

Wave digital filter model of the entire auditory periphery

A model of the auditory periphery assembled from analog network submodels of all the relevant anatomical structures is described. There is bidirectional coupling between networks representing the outer ear, middle ear and cochlea. A simple voltage source representation of the outer hair cells provides level-dependent basilar membrane curves. The networks are translated into efficient computational modules by means of wave digital filtering. A feedback unit regulates the average firing rate at the output of an inner hair cell module via a simplified modelling of the dynamics of the descending paths to the peripheral ear. This leads to a digital model of the entire auditory periphery with applications to both speech and hearing research.

Expert system for prestressed concrete bridge design

The development of an expert system, BRIDEX, for the design of prestressed concrete bridges is discussed in this paper. Design of multi-span continuous pre-stressed concrete bridges pose considerable difficulties to designers because of the large number of parameters involved and their complex interactions. The design is often perceived as an iterative process of generation, evaluation and modification of trial designs. It takes years of experience to develop an understanding of the design process. BRIDEX is aimed at providing guidance to the designers by suggesting appropriate range of values for the design parameters. The knowledge within BRIDEX is mainly based on fundamental principles developed by a careful study of the intricacies involved in the design process, while heuristics are used only to supplement this knowledge. The BRIDEX approach ensures that the whole design evolves sequentially as the design proceeds, module after module.