3 resultados para Percussion

em Cambridge University Engineering Department Publications Database


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A study on the nanosecond fiber laser interaction with silicon was performed experimentally for the generation of percussion drilled holes. Single pulse ablation experiments were carried out on mono crystalline 650μm thick Si wafers. Changes of the mass removal mechanism were investigated by varying laser fluence up to 68 J/cm2 and pulse duration from 50 ns to 200 ns. Hole width and depth were measured and surface morphology were studied using scanning electron microscopy (SEM) and optical interferometric profilometry (Veeco NT3300). High speed photography was also used to examine laser generated plasma expansion rates. The material removal rate was found to be influenced by the pulse energy, full pulse duration and pulse peak power. Single pulse ablation depth of 4.42 μm was achieved using a 200 ns pulse of 13.3 J/cm 2, giving a maximum machining efficiency of 31.86 μm per mJ. Holes drilled with an increased fluence but fixed pulse length were deeper, exhibited low recast, but were less efficient than those produced at a lower fluence. The increased peak power in this case led to high levels of plasma and vapour production. The expansion of which, results in a strong driving recoil force, an increase in the rate and volume of melt ejection, and cleaner hole formation. The experimental findings show that for efficient drilling at a given energy, a longer, lower peak power pulse is more desirable than a high peak power short pulse.

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The interaction phenomena of nanosecond Q-switched diode-pumped solid state (DPSS) laser using 355nm radiation with 0.2mm thick 316L stainless steel foil was investigated at incident laser fluence range of 19 - 82Jcm-2. The characterization study was performed with and without the use of assist gas by utilizing micro supersonic minimum length nozzles (MLN), specifically designed for air at inlet chamber pressure of 8bar. MLN ranged in throat diameters of 200μm, 300μm, and 500μm respectively. Average etch rate per pulse under the influence of three micro supersonic impinging jets, for both oxygen and air showed the average etch rate was reduced when high-speed gas jets were utilized, compared to that without any gas jets, but significant variation was noticed between different jet sizes. Highest etch rate and quality was achieved with the smallest diameter nozzle, suggesting that micro nozzles can produce a viable process route for micro laser cutting.